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datasheet r01ds0261ej0110 rev.1.10 page 1 of 177 oct 30, 2015 rx230 group, rx231 group renesas mcus features 32-bit rxv2 cpu core ? max. operating frequency: 54 mhz capable of 88.56 dmips in operation at 54 mhz ? enhanced dsp: 32-bit multiply-accumulate and 16-bit multiply-subtract instructions supported ? built-in fpu: 32-bit single-precision floating point (compliant to ieee754) ? divider (fastest instruction execution takes two cpu clock cycles) ? fast interrupt ? cisc harvard architecture with 5-stage pipeline ? variable-length instructions, ultra-compact code ? on-chip debugging circuit ? memory protection unit (mpu) supported low power design and architecture ? operation from a single 1.8-v to 5.5-v supply ? rtc capable of operating on the battery backup power supply ? three low power consumption modes ? low power timer (lpt) that operates during the software standby state on-chip flash memory for code ? 128- to 512-kbyte capacities ? on-board or off-board user programming ? programmable at 1.8 v ? for instructions and operands on-chip data flash memory ? 8 kbytes (1,000,000 program/erase cycles (typ.)) ? bgo (background operation) on-chip sram, no wait states ? 32- to 64-kbyte size capacities data transfer functions ? dmac: incorporates four channels ? dtc: four transfer modes elc ? module operation can be initiated by event signals without using interrupts. ? linked operation between modules is possible while the cpu is sleeping. reset and supply management ? eight types of reset, including the power-on reset (por) ? low voltage detection (lvd) with voltage settings clock functions ? main clock oscillator frequency: 1 to 20 mhz ? external clock input frequency: up to 20 mhz ? sub-clock oscillator frequency: 32.768 khz ? pll circuit input: 4 mhz to 12.5 mhz ? on-chip low- and high-speed oscillators, dedicated on-chip low-speed oscillator for the iwdt ? usb-dedicated pll circuit: 4, 6, 8, or 12 mhz 54 mhz can be set for the system clock and 48 mhz for the usb clock ? generation of a dedicated 32.768-khz clock for the rtc ? clock frequency accuracy measurement circuit (cac) realtime clock ? adjustment functions (30 seconds, leap year, and error) ? calendar count mode or binary count mode selectable ? time capture function ? time capture on event-signal input through external pins independent watchdog timer ? 15-khz on-chip oscillator produces a dedicated clock signal to drive iwdt operation. useful functions fo r iec60730 compliance ? self-diagnostic and disconnection-detection assistance functions for the a/d converter, clock frequency accuracy measurement circuit, independent watchdog timer, ram test assistance functions using the doc, etc. external address space ? four cs areas (4 16 mbytes) ? 8- or 16-bit bus space is selectable per area mpc ? input/output functions selectable from multiple pins up to 14 communication functions ? usb 2.0 host/function/on-the-go (otg) (one channel), full-speed = 12 mbps, low-speed = 1.5 mbps, isochronous transfer, and bc (battery charger) supported ? can (one channel) compliant to iso11898-1: transfer at up to 1 mbps ? sci with many useful functions (up to 7 channels) asynchronous mode, clock synchronous mode, smart card interface reduction of errors in communications using the bit modulation function ? irda interface (one channel, in cooperation with the sci5) ? i 2 c bus interface: transfer at up to 400 kbps, capable of smbus operation (one channel) ? rspi (one channel): transfer at up to 16 mbps ? serial sound interface (one channel) ? sd host interface (optional: one channel) sd memory/ sdio 1-bit or 4-bit sd bus supported note: 48-pin packages support 1-bit mode only up to 20 extended-function timers ? 16-bit mtu: input capture, output compare, complementary pwm output, phase counting mode (six channels) ? 16-bit tpu: input capture, output compare, phase counting mode (six channels) ? 8-bit tmr (four channels) ? 16-bit compare-match timers (four channels) 12-bit a/d converter ? capable of conversion within 0.83 s ? 24 channels ? sampling time can be set for each channel ? self-diagnostic function and analog input disconnection detection assistance function 12-bit d/a converter ? two channels capacitive touch sensing unit ? self-capacitance method: a single pin configures a single key, supporting up to 24 keys ? mutual capacitance method: matrix configuration with 24 pins, supporting up to 144 keys analog comparator ? two channels two units general i/o ports ? 5-v tolerant, open drain, input pull-up, switching of driving capacity security functions (tsip-lite) ? unauthorized access to the encryption engine is disabled and imposture and falsification of information are prevented ? safe management of keys ? 128- or 256-bit key length of aes for ecb, cbc, gcm, others ? true random number generator temperature sensor operating temperature range ?? 40 to +85 ? c ?? 40 to +105 ?c applications ? general industrial and consumer equipment plqp0100kb-b 14 14 mm, 0.5 mm pitch plqp0064kb-c 10 10 mm, 0.5 mm pitch PLQP0048KB-B 7 7 mm, 0.5 mm pitch pwqn0064kc-a 9 9 mm, 0.5 mm pitch pwqn0048kb-a 7 7 mm, 0.5 mm pitch ptlg0100ka-a 5.5 5.5 mm, 0.5 mm pitch pwlg0064ka-a 5 5 mm, 0.5 mm pitch 54-mhz 32-bit rx mcus, built-in fpu, 88.56 dmips, up to 512-kb flash memory, various communication functions including usb 2.0 full-speed host/function/otg, can, sd host interface, serial sound interface, capacitive touch sensing uni t, 12-bit a/d, 12-bit d/a, rtc, aes, mpu security functions r01ds0261ej0110 rev.1.10 oct 30, 2015
r01ds0261ej0110 rev.1.10 page 2 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 1. overview 1.1 outline of specifications table 1.1 lists the specifications, and table 1.2 gives a comparison of the functions of the products in different packages. table 1.1 is for products with the greatest number of functions, so the number of peripheral modules and channels will differ in accordance with the p ackage type. for details, see table 1.2, comparison of functions for different packages . table 1.1 outline of specifications (1/4) classification module/function description cpu cpu ? maximum operating frequency: 54 mhz ? 32-bit rx cpu (rx v2) ? minimum instruction execution time: one instruction per clock cycle ? address space: 4-gbyte linear ? register set general purpose: sixteen 32-bit registers control: ten 32-bit registers accumulator: two 72-bit registers ? basic instructions: 75 (variable-length instruction format) ? floating-point instructions: 11 ? dsp instructions: 23 ? addressing modes: 10 ? data arrangement instructions: little endian data: selectable as little endian or big endian ? on-chip 32-bit multiplier: 32-bit 32-bit 64-bit ? on-chip divider: 32-bit 32-bit 32 bits ? barrel shifter: 32 bits ? memory protection unit (mpu) fpu ? single precision (32-bit) floating point ? data types and floating-point exceptions in conformance with the ieee754 standard memory rom ? capacity: 128/256/384/512 kbytes ? up to 32 mhz: no-wait memory access 32 to 54 mhz: wait state required. no wait state if the instruction is served by a rom accelerator hit. ? programming/erasing method: serial programming (asynchronous serial communication/usb communication), self-programming ram ? capacity: 32/64 kbytes ? 54 mhz, no-wait memory access e2 dataflash ? capacity: 8 kbytes ? number of erase/write cycles: 1,000,000 (typ) mcu operating mode single-chip mode, on-chip rom enabled expansion mode, and on-chip rom disabled expansion mode (software switching) clock clock generation circuit ? main clock oscillator, sub-clock oscillator, low-s peed on-chip oscillator, high-speed on-chip oscillator, pll frequency synthesizer, usb-dedicated pll frequency synthesizer, and iwdt-dedicated on-chip oscillator ? oscillation stop detection: available ? clock frequency accuracy measurement circuit (cac) ? independent settings for the system clock (iclk), peripheral module clock (pclk), external bus clock (bclk), and flashif clock (fclk) the cpu and system sections such as other bus masters run in synchronization with the system clock (iclk): 54 mhz (at max.) mtu2a runs in synchronization with the pclka: 54 mhz (at max.) the adclk for the s12ad runs in synchronization with the pclkd: 54 mhz (at max.) peripheral modules other than mtu2a and s12ade run in synchronization with the pclkb: 32 mhz (at max.) devices connected to external buses run in synchronization wit h the bclk: 32 mhz (at max.) the flash peripheral circuit runs in sync hronization with the fclk: 32 mhz (at max.) resets res# pin reset, power-on reset, voltage monitoring reset, watchdog timer reset, independent watchdog timer reset, and software reset voltage detection voltage detection circuit (lvdab) ? when the voltage on vcc falls below the voltage detection level, an internal reset or internal interrupt is generated. voltage detection circuit 0 is capable of selecting the detection voltage from 4 levels voltage detection circuit 1 is capable of selecting the detection voltage from 14 levels voltage detection circuit 2 is capable of selecting the detection voltage from 4 levels r01ds0261ej0110 rev.1.10 page 3 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview low power consumption low power consumption functions ? module stop function ? three low power consumption modes sleep mode, deep sleep mode, and software standby mode ? low power timer that operates during the software standby state function for lower operating power consumption ? operating power control modes high-speed operating mode, middle-speed operating mode, and low-speed operating mode interrupt interrupt controller (icub) ? interrupt vectors: 167 ? external interrupts: 9 (nmi, irq0 to irq7 pins) ? non-maskable interrupts: 7 (nmi pin, oscillation stop detection interrupt, voltage monitoring 1 interrupt, voltage monitoring 2 interrupt, wdt interrupt, iwdt interrupt, and vbatt power monitoring interrupt) ? 16 levels specifiable for the order of priority external bus extension ? the external address space can be divided into four areas (cs0 to cs3), each with independent control of access settings. capacity of each area: 16 mbytes (cs0 to cs3) a chip-select signal (cs0# to cs3#) can be output for each area. each area is specifiable as an 8-bit or 16-bit bus space the data arrangement in each area is selectable as little or big endian (only for data). bus format: separate bus, multiplex bus ? wait control ? write buffer facility dma dma controller (dmaca) ? 4 channels ? three transfer modes: normal transfer, repeat transfer, and block transfer ? activation sources: software trigger, external in terrupts, and interrupt requests from peripheral functions data transfer controller (dtca) ? transfer modes: normal transfer, repeat transfer, and block transfer ? activation sources: interrupts ? chain transfer function i/o ports general i/o ports 100-pin /64-pin /48-pin i/o: 79/43/30 (rx231 group), 83/47/34 (rx230 group) ? input: 1/1/1 pull-up resistors: 79/43/30(rx231 group), 83/47/34 (rx230 group) ? open-drain outputs: 58/34/26 ? 5-v tolerance: 5/3/3 event link controller (elc) ? event signals of 61 types can be directly connected to the module ? operations of timer modules are selectable at event input ? capable of event link operation for port b and port e multi-function pin controller (mpc) capable of selecting the input/output function from multiple pins timers 16-bit timer pulse unit (tpua) ? (16 bits 6 channels) 1 unit ? maximum of 16 pulse-input/output possible ? select from among seven or eight coun ter-input clock signals for each channel ? supports the input capture/output compare function ? output of pwm waveforms in up to 15 phases in pwm mode ? support for buffered operation, phase-counting mode (two-phase encoder input) and cascade connected operation (32 bits 2 channels) depending on the channel. ? capable of generating conversion start triggers for the a/d converters ? signals from the input capture pins are input via a digital filter ? clock frequency measuring method multi-function timer pulse unit 2 (mtu2a) ? (16 bits 6 channels) 1 unit ? up to 16 pulse-input/output lines and three pulse -input lines are available based on the six 16-bit timer channels ? select from among eight or seven counter-input clock signals for each channel (pclk/1, pclk/4, pclk/16, pclk/64, pclk/256, pclk/1024, mt clka, mtclkb, mtclkc, mtclkd) other than channel 5, for which only four signals are available. ? input capture function ? 21 output compare/input capture registers ? pulse output mode ? complementary pwm output mode ? reset synchronous pwm mode ? phase-counting mode ? capable of generating conversion start triggers for the a/d converter port output enable 2 (poe2a) controls the high-impedance state of the mtu?s waveform output pins compare match timer (cmt) ? (16 bits 2 channels) 2 units ? select from among four clock signals (pclk/8, pclk/32, pclk/128, pclk/512) watchdog timer (wdta) ? 14 bits x 1 channel ? select from among six counter-input clock signals (pclk/4, pclk/64, pclk/128, pclk/512, pclk/ 2048, pclk/8192) table 1.1 outline of specifications (2/4) classification module/function description r01ds0261ej0110 rev.1.10 page 4 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview timers independent watchdog timer (iwdta) ? 14 bits 1 channel ? count clock: dedicated low-speed on-chip oscillator for the iwdt frequency divided by 1, 16, 32, 64, 128, or 256 realtime clock (rtce) ? clock source: sub-clock ? time/calendar ? interrupts: alarm interrupt, periodic interrupt, and carry interrupt ? time-capture facility for three values low power timer (lpt) ? 16 bits 1 channel ? clock source: sub-clock, dedicated low-speed on-chip oscillator for the iwdt frequency divided by 2, 4, 8, 16, or 32 8-bit timer (tmr) ? (8 bits 2 channels) 2 units ? seven internal clocks (pclk/1, pclk/2, pclk/8, pclk/32, pclk/ 64, pclk/1024, and pclk/8192) and an external clock can be selected ? pulse output and pwm output with any duty cycle are available ? two channels can be cascaded and used as a 16-bit timer communication functions serial communications interfaces (scig, scih) ? 7 channels (channel 0, 1, 5, 6, 8, 9: scig, channel 12: scih) ? scig serial communications modes: asynchronous, clock synchronous, and smart-card interface multi-processor function on-chip baud rate generator allows selection of the desired bit rate choice of lsb-first or msb-first transfer average transfer rate clock can be input fr om tmr timers for sci5, sci6, and sci12 start-bit detection: level or edge detection is selectable. simple i 2 c simple spi 9-bit transfer mode bit rate modulation event linking by the elc (only on channel 5) ? scih (the following functions are added to scig) supports the serial communications protocol, whic h contains the start frame and information frame supports the lin format irda interface (irda) ? 1 channel (sci5 used) ? supports encoding/decoding of waveforms conforming to irda standard 1.0 i 2 c bus interface (riica) ? 1 channel ? communications formats: i 2 c bus format/smbus format ? master mode or slave mode selectable ? supports fast mode serial peripheral interface (rspia) ? 1 channel ? transfer facility using the mosi (master out, slave in), miso (master in, slave out), ssl (slave select), and rspck (rspi clock) enables serial transfer through spi operation (four lines) or clock-synchronous operation (three lines) ? capable of handling serial transfer as a master or slave ? data formats ? choice of lsb-first or msb-first transfer the number of bits in each transfer can be changed to 8, 9, 10, 11, 12, 13, 14, 15, 16, 20, 24, or 32 bits. 128-bit buffers for transmission and reception up to four frames can be transmitted or receiv ed in a single transfer operation (with each frame having up to 32 bits) ? double buffers for both transmission and reception usb 2.0 host/function module (usbd) ? usb device controller (udc) and transceiver for usb 2.0 are incorporated. ? host/function module: 1 port ? compliant with usb version 2.0 ? transfer speed: full-speed (12 mbps), low-speed (1.5 mbps) ? otg (on-the-go) is supported. ? isochronous transfer is supported. ? bc1.2 (battery charging specification revision 1.2) is supported. ? internal power supply for usb (allows operation without external power input to the vcc_usb pin when vcc = 4.0 to 5.5v) can module (rscan) ? 1 channel ? compliance with the iso11898-1 specification (standard frame and extended frame) ? 16 message boxes table 1.1 outline of specifications (3/4) classification module/function description r01ds0261ej0110 rev.1.10 page 5 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview communication functions serial sound interface (ssi) ? 1 channel ? capable of duplex communications ? various serial audio formats supported ? master/slave function supported ? programmable word clock or bit clock generation function ? 8/16/18/20/22/24/32-bit data formats supported ? on-chip 8-stage fifo for transmission/reception ? supports ws continue mode in which the ssiws signal is not stopped. sd host interface (sdhia) ? 1 channel ? transfer speed : default speed mode (8mb/s) ? sd memory card interface (1 bit / 4bits sd bus) ? mmc, emmc backward-compatible are supported. ? sd specifications part 1: compliant with physical layer specification ver.3.01 (not support ddr) part e1: sdio specification ver. 3.00 ? compliant with usb version 2.0 ? error check function: crc7 (command), crc16 (data) ? interrupt source: card access interrupt, sdio access interrupt, card detection interrupt, sd buffer access interrupt ? dma transfer sources: sd_bufwrite, sd_buf read ? card detection, write protection security functions ? access management circuit ? encryption engine 128- or 256-bit key sizes of aes block cipher mode of operation: gcm, ecb, cbc, cmac, xts, ctr, gctr ? hash function ? true random number generator ? unique id 12-bit a/d converter (s12ade) ? 12 bits (24 channels 1 unit) ? 12-bit resolution ? minimum conversion time: 0.83 s per channel when the adclk is operating at 54 mhz ? operating modes scan mode (single scan mode, continuous scan mode, and group scan mode) group a priority control (only for group scan mode) ? sampling variable sampling time can be set up for each channel. ? self-diagnostic function ? double trigger mode (a/d conversion data duplicated) ? detection of analog input disconnection ? a/d conversion start conditions a software trigger, a trigger from a timer (mtu, tpu), an external trigger signal, or elc ? event linking by the elc temperature sensor (tempsa) ? 1 channel ? the voltage output from the temperature sensor is co nverted into a digital value by the 12-bit a/d converter. 12-bit d/a converter (r12daa) ? 2 channels ? 12-bit resolution ? output voltage: 0.4 to avcc0-0.5v crc calculator (crc) ? crc code generation for arbitrary amounts of data in 8-bit units ? select any of three generating polynomials: x 8 + x 2 + x + 1, x 16 + x 15 + x 2 + 1, or x 16 + x 12 + x 5 + 1 ? generation of crc codes for use with lsb-firs t or msb-first communications is selectable. comparator b (cmpba) ? 2 channels 2 units ? function to compare the reference voltage and the analog input voltage ? window comparator operation or standard comparator operation is selectable capacitive touch sensing unit (ctsu) detection pin: 24 channels data operation circuit (doc) comparison, addition, and subtraction of 16-bit data power supply voltages/operating frequencies vcc = 1.8 to 2.4 v: 8 mhz, vcc = 2.4 to 2.7 v: 16 mhz, vcc = 2.7 to 5.5 v: 54 mhz operating temperature range d version: ? 40 to +85c, g version: ? 40 to +105c packages 100-pin tflga (ptlg0100ka-a) 5.5 5.5 mm, 0.5 mm pitch 100-pin lfqfp (plqp0100kb-b) 14 14 mm, 0.5 mm pitch 64-pin wflga (pwlg0064ka-a) 5 5 mm, 0.5 mm pitch 64-pin hwqfn (pwqn0064kc-a) 9 9 mm, 0.5 mm pitch 64-pin lfqfp (plqp0064kb-c) 10 10 mm, 0.5 mm pitch 48-pin hwqfn (pwqn0048kb-a) 7 7 mm, 0.5 mm pitch 48-pin lfqfp (PLQP0048KB-B) 7 7 mm, 0.5 mm pitch on-chip debugging system e1 emulator (fine interface) table 1.1 outline of specifications (4/4) classification module/function description r01ds0261ej0110 rev.1.10 page 6 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.2 comparison of functions for different packages module/functions rx230 group rx231 group 100 pins 64 pins 48 pins 100 pins 64 pins 48 pins external bus external bus 16 bit n ot supported 16 bit not supported interrupts external interrupts nmi, irq0 to irq7 nmi, irq0 to irq2, irq4 to irq7 nmi, irq0, irq1, irq4 to irq7 nmi, irq0 to irq7 nmi, irq0 to irq2, irq4 to irq7 nmi, irq0, irq1, irq4 to irq7 dma dma controller 4 channels (dmac0 to dmac3) 4 channels (dmac0 to dmac3) data transfer controll er available available timers 16-bit timer pulse unit 6 channels (tpu0 to tpu5) 6 channels (tpu0 to tpu5) multi-function timer pulse unit 2 6 channels (mtu0 to mtu5) 6 channels (mtu0 to mtu5) port output enable 2 poe0# to poe3#, poe8# poe0# to poe3#, poe8# 8-bit timer 2 channels 2 units 2 channels 2 units compare match timer 2 channel s 2 units 2 channels 2 units low power timer 1 channel 1 channel realtime clock available not supported available not supported watchdog timer available available independent watchdog timer available available communication functions serial communications interfaces (scig) 6 channels (sci0, 1, 5, 6, 8, 9) 5 channels (sci1, 5, 6, 8, 9) 4 channels (sci1, 5, 6, 8) 6 channels (sci0, 1, 5, 6, 8, 9) 5 channels (sci1, 5, 6, 8, 9) 4 channels (sci1, 5, 6, 8) irda interface 1 channel (sci5) 1 channel (sci5) serial communications interfaces (scih) 1 channel (sci12) 1 channel (sci12) i 2 c bus interface 1 channel 1 channel can module not supported 1 channel serial peripheral interface 1 channel 1 channel usb 2.0 host/function module not supported 1 channel serial sound interface 1 channel 1 channel sd host interface not supported 1 channel capacitive touch sensing unit 24 channels 10 channels 6 channels 24 channels 10 channels 6 channels 12-bit a/d converter (including high-precision channels) 24 channels (8 channels) 12 channels (6 channels) 8 channels (4 channels) 24 channels (8 channels) 12 channels (6 channels) 8 channels (4 channels) temperature sensor available available d/a converter 2 channels not supported 2 channels not supported crc calculator available available event link controll er available available comparator b 4 channels 4 channels packages 100-pin tflga 100-pin lfqfp 64-pin wflga 64-pin hwqfn 64-pin lfqfp 48-pin hwqfn 48-pin lfqfp 100-pin tflga 100-pin lfqfp 64-pin wflga 64-pin hwqfn 64-pin lfqfp 48-pin hwqfn 48-pin lfqfp r01ds0261ej0110 rev.1.10 page 7 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 1.2 list of products table 1.3 and table 1.4 are a list of products, and figure 1.1 shows how to read the product part no., memory capacity, and package type. table 1.3 list of products: d version (t a = ?40 to +85c) (1/2) group part no. order part no. package rom capacity ram capacity e2 dataflash operating frequency security function sdhi can operating temperature rx231 r5f52318adla r5f52318adla#20 ptlg0100ka-a 512 kbytes 64 kbytes 8 kbytes 54 mhz not available not available available ? 40 to +85c r5f52318bdla r5f52318bdla#20 available available available r5f52318adfp r5f52318adfp#30 plqp0100kb-b not available not available available r5f52318bdfp r5f52318bdfp#30 available available available r5f52318adnd r5f52318adnd#u0 pwqn0064kc-a not available not available available r5f52318bdnd r5f52318bdnd#u0 available available available r5f52318adfm r5f52318adfm#30 plqp0064kb-c not available not available available r5f52318bdfm r5f52318bdfm#30 available available available r5f52318adne r5f52318adne#u0 pwqn0048kb-a not available not available available r5f52318bdne r5f52318bdne#u0 available available available r5f52318adfl r5f52318adfl#30 PLQP0048KB-B not available not available available r5f52318bdfl r5f52318bdfl#30 available available available r5f52317adla r5f52317adla#20 ptlg0100ka-a 384 kbytes not available not available available r5f52317bdla r5f52317bdla#20 available available available r5f52317adfp r5f52317adfp#30 plqp0100kb-b not available not available available r5f52317bdfp r5f52317bdfp#30 available available available r5f52317adnd r5f52317adnd#u0 pwqn0064kc-a not available not available available r5f52317bdnd r5f52317bdnd#u0 available available available r5f52317adfm r5f52317adfm#30 plqp0064kb-c not available not available available r5f52317bdfm r5f52317bdfm#30 available available available r5f52317adne r5f52317adne#u0 pwqn0048kb-a not available not available available r5f52317bdne r5f52317bdne#u0 available available available r5f52317adfl r5f52317adfl#30 PLQP0048KB-B not available not available available r5f52317bdfl r5f52317bdfl#30 available available available r5f52316adla r5f52316adla#20 ptlg0100ka-a 256 kbytes 32 kbytes not available not ava ilable available r5f52316cdla r5f52316cdla#20 not available not available not available r5f52316adfp r5f52316adfp#30 plqp0100kb-b not available not available available r5f52316cdfp r5f52316cdfp#30 not available not available not available r5f52316cdlf r5f52316cdlf#u0 pwlg0064ka-a not available not available not available r5f52316adnd r5f52316adnd#u0 pwqn0064kc-a not available not available available r5f52316cdnd r5f52316cdnd#u0 not available not available not available r5f52316adfm r5f52316adfm#30 plqp0064kb-c not available not available available r5f52316cdfm r5f52316cdfm#30 not available not available not available r5f52316adne r5f52316adne#u0 pwqn0048kb-a not available not available available r5f52316cdne r5f52316cdne#u0 not available not available not available r5f52316adfl r5f52316adfl#30 PLQP0048KB-B not available not available available r5f52316cdfl r5f52316cdfl#30 not available not available not available r01ds0261ej0110 rev.1.10 page 8 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview rx231 r5f52315adla r5f52315adla#20 ptlg0100ka-a 128 kbytes 32 kbytes 8 kbytes 54 mhz not available not available available ? 40 to +85c r5f52315cdla r5f52315cdla#20 not available not available not available r5f52315adfp r5f52315adfp#30 plqp0100kb-b not available not available available r5f52315cdfp r5f52315cdfp#30 not available not available not available r5f52315cdlf r5f52315cdlf#20 pwlg0064ka-a not available not available not available r5f52315adnd r5f52315adnd#u0 pwqn0064kc-a not available not available available r5f52315cdnd r5f52315cdnd#u0 not available not available not available r5f52315adfm r5f52315adfm#30 plqp0064kb-c not available not available available r5f52315cdfm r5f52315cdfm#30 not available not available not available r5f52315adne r5f52315adne#u0 pwqn0048kb-a not available not available available r5f52315cdne r5f52315cdne#u0 not available not available not available r5f52315adfl r5f52315adfl#30 PLQP0048KB-B not available not available available r5f52315cdfl r5f52315cdfl#30 not available not available not available rx230 r5f52306adla r5f52306adla#20 ptlg0100ka-a 256 kbytes 32 kbytes 8 kbytes 54 mhz not available not available not available ? 40 to +85c r5f52306adfp r5f52306adfp#30 plqp0100kb-b not available not available not available r5f52306adlf r5f52306adlf#20 pwlg0064ka-a not available not available not available r5f52306adnd r5f52306adnd#u0 pwqn0064kc-a not available not ava ilable not available r5f52306adfm r5f52306adfm#30 plqp0064kb-c not available not available not available r5f52306adne r5f52306adne#u0 pwqn0048kb-a not available not available not available r5f52306adfl r5f52306adfl#30 PLQP0048KB-B not available not available not available r5f52305adla r5f52305adla#20 ptlg0100ka-a 128 kbytes not available not available not available r5f52305adfp r5f52305adfp#30 plqp0100kb-b not available not available not available r5f52305adlf r5f52305adlf#20 pwlg0064ka-a not available not available not available r5f52305adnd r5f52305adnd#u0 pwqn0064kc-a not available not available not available r5f52305adfm r5f52305adfm#30 plqp0064kb-c not available not available not available r5f52305adne r5f52305adne#u0 pwqn0048kb-a not available not available not available r5f52305adfl r5f52305adfl#30 PLQP0048KB-B not available not available not available table 1.3 list of products: d version (t a = ?40 to +85c) (2/2) group part no. order part no. package rom capacity ram capacity e2 dataflash operating frequency security function sdhi can operating temperature r01ds0261ej0110 rev.1.10 page 9 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.4 list of products: g version (t a = ?40 to +105c) (1/2) group part no. order part no. package rom capacity ram capacity e2 dataflash operating frequency security function sdhi can operating temperature rx231 r5f52318agfp r5f52318agfp#30 plqp0100kb-b 512 kbytes 64 kbytes 8 kbytes 54 mhz not available not available available ? 40 to +105c r5f52318bgfp r5f52318bgfp#30 available available available r5f52318agnd r5f52318agnd#u0 pwqn0064kc-a not available not available available r5f52318bgnd r5f52318bgnd#u0 available available available r5f52318agfm r5f52318agfm#30 plqp0064kb-c not available not available available r5f52318bgfm r5f52318bgfm#30 available available available r5f52318agne r5f52318agne#u0 pwqn0048kb-a not available not available available r5f52318bgne r5f52318bgne#u0 available available available r5f52318agfl r5f52318agfl#30 PLQP0048KB-B not available not available available r5f52318bgfl r5f52318bgfl#30 available available available r5f52317agfp r5f52317agfp#30 plqp0100kb-b 384 kbytes not available not available available r5f52317bgfp r5f52317bgfp#30 available available available r5f52317agnd r5f52317agnd#u0 pwqn0064kc-a not available not available available r5f52317bgnd r5f52317bgnd#u0 available available available r5f52317agfm r5f52317agfm#30 plqp0064kb-c not available not available available r5f52317bgfm r5f52317bgfm#30 available available available r5f52317agne r5f52317agne#u0 pwqn0048kb-a not available not available available r5f52317bgne r5f52317bgne#u0 available available available r5f52317agfl r5f52317agfl#30 PLQP0048KB-B not available not available available r5f52317bgfl r5f52317bgfl#30 available available available r5f52316agfp r5f52316agfp#30 plqp0100kb-b 256 kbytes 32 kbytes not available not available available r5f52316cgfp r5f52316cgfp#30 not available not available not available r5f52316agnd r5f52316agnd#u0 pwqn0064kc-a not available not available av ailable r5f52316cgnd r5f52316cgnd#u0 not available not available not available r5f52316agfm r5f52316agfm#30 plqp0064kb-c not available not available available r5f52316cgfm r5f52316cgfm#30 not available not available not available r5f52316agne r5f52316agne#u0 pwqn0048kb-a not available not available available r5f52316cgne r5f52316cgne#u0 not available not available not available r5f52316agfl r5f52316agfl#30 PLQP0048KB-B not available not available available r5f52316cgfl r5f52316cgfl#30 not available not available not available r5f52315agfp r5f52315agfp#30 plqp0100kb-b 128 kbytes not available not available available r5f52315cgfp r5f52315cgfp#30 not available not available not available r5f52315agnd r5f52315agnd#u0 pwqn0064kc-a not available not available available r5f52315cgnd r5f52315cgnd#u0 not available not available not available r5f52315agfm r5f52315agfm#30 plqp0064kb-c not available not available available r5f52315cgfm r5f52315cgfm#30 not available not available not available r5f52315agne r5f52315agne#u0 pwqn0048kb-a not available not available available r5f52315cgne r5f52315cgne#u0 not available not available not available r5f52315agfl r5f52315agfl#30 PLQP0048KB-B not available not available available r5f52315cgfl r5f52315cgfl#30 not available not ava ilable not available r01ds0261ej0110 rev.1.10 page 10 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview rx230 r5f52306agfp r5f52306agfp#30 plqp0100kb-b 256 kbytes 32 kbytes 8 kbytes 54 mhz not available not available not available ? 40 to +105c r5f52306agnd r5f52306agnd#u0 pwqn0064kc-a not available not available not available r5f52306agfm r5f52306agfm#30 plqp0064kb-c not available not available not available r5f52306agne r5f52306agne#u0 pwqn0048kb-a not available not available not available r5f52306agfl r5f52306agfl#30 PLQP0048KB-B not available not available not available r5f52305agfp r5f52305agfp#30 plqp0100kb-b 128 kbytes not available not available not available r5f52305agnd r5f52305agnd#u0 pwqn0064kc-a not available not available not available r5f52305agfm r5f52305agfm#30 plqp0064kb-c not available not available not available r5f52305agne r5f52305agne#u0 pwqn0048kb-a not available not available not available r5f52305agfl r5f52305agfl#30 PLQP0048KB-B not available not available not available table 1.4 list of products: g version (t a = ?40 to +105c) (2/2) group part no. order part no. package rom capacity ram capacity e2 dataflash operating frequency security function sdhi can operating temperature r01ds0261ej0110 rev.1.10 page 11 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview figure 1.1 how to read the product part number r5f52318adfm package type, number of pins, and pin pitch fp: lfqfp/100/0.50 fm: lfqfp/64/0.50 fl: lfqfp/48/0.50 la: tflga/100/0.50 lf: wflga/64/0.50 nd: hwqfn/64/0.50 ne: hwqfn/48/0.50 d: operating ambient temperature: ?40 to +85c g: operating ambient temperature: ?40 to +105c chip versions rx231 group a: security function not included, sdhi module not included, can module included b: security function included, sdhi module included, can module included c: security function not included, sdhi module not included, can module not included rx230 group a: usb module not included rom, ram, and e2 dataflash capacity 8: 512 kbytes/64 kbytes/8 kbytes 7: 384 kbyte/64 kbytes/8 kbytes 6: 256 kbytes/32 kbytes/8 kbytes 5: 128 kbytes/32 kbytes/8 kbytes group name 31: rx231 group 30: rx230 group series name rx200 series type of memory f: flash memory version renesas mcu renesas semiconductor product r01ds0261ej0110 rev.1.10 page 12 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 1.3 block diagram figure 1.2 shows a block diagram. figure 1.2 block diagram clock generation circuit rx cpu ram rom port 0 port 1 port 3 port 4 12-bit d/a converter 2 channels riica 1 channel doc rtce mtu2a 6 channels 12-bit a/d converter 24 channels cmt 2 channels (unit 0) rspia 1 channel dtca icub cac scih 1 channel port 5 port a port b port c poe2a usb 2.0 host/function module port 2 temperature sensor port d port h port j external bus dmaca 4 channels comparator b 4 channels tmr 2 channels (unit 0) tmr 2 channels (unit 1) ssi cmt 2 channels (unit 1) mpu tpua 6 channels operand bus instruction bus internal main bus 1 internal main bus 2 bsc scig 6 channels (including irda 1 channel) e2 dataflash crc elc iwdta wdta sdhia rscan ctsu lpt internal peripheral buses 1 to 6 port e icub: interrupt controller dtca: data transfer controller dmaca: dma controller bsc: bus controller wdta: watchdog timer iwdta: independent watchdog timer elc: event link controller crc: crc (cyclic redundanc y check) calculator scig/scih: serial communications interface rspia: serial peripheral interface ssi: serial sound interface riica: i 2 c bus interface tpua: 16-bit timer pulse unit mtu2a: multi-function timer pulse unit 2 poe2a: port output enable 2 cmt: compare match timer rtce: realtime clock doc: data operation circuit cac: clock frequency accuracy measurement circuit ctsu: capacitive touch sensing unit sdhia: sd host interface mpu: memory protection unit tmr: 8-bit timer rscan: can module lpt: low power timer r01ds0261ej0110 rev.1.10 page 13 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 1.4 pin functions table 1.5 lists the pin functions. table 1.5 pin functions (1/4) classifications pin name i/o description power supply vcc input power supply pin. connect it to the system power supply. vcl ? connect this pin to the vss pin via the 4.7 f smoothing capacitor used to stabilize the internal power supply. pl ace the capacitor close to the pin. vss input ground pin. connect it to the system power supply (0 v). vbatt input backup power pin clock xtal output pins for connecting a crystal. an external clock can be input through the extal pin. extal input bclk output outputs the external bus cl ock for external devices. xcin input input/output pins for the sub-clock oscillator. connec t a crystal between xcin and xcout. xcout output clkout output clock output pin. operating mode control md input pin for setting the operating mode. the signal levels on this pin must not be changed during operation. ub input pin used for boot mode (usb interface). upsel input pin used for boot mode (usb interface). system control res# input reset pin. this mcu enter s the reset state when this signal goes low. cac cacref input input pin for the clock fr equency accuracy m easurement circuit. on-chip emulator fined i/o fine interface pin. address bus a0 to a23 output output pins for the address. data bus d0 to d15 i/o input and output pins for the bidirectional data bus. multiplexed bus a0/d0 to a15/d15 i/o address/data multiplexed bus bus control rd# output strobe signal which indicates that reading from the external bus interface space is in progress. wr# output strobe signal which indicates that writing to the external bus interface space is in progress, in single-write strobe mode. wr0#, wr1# output strobe signals which indicate t hat either group of data bus pins (d7 to d0, and d15 to d8) is valid in writing to the external bus interface space, in byte strobe mode. bc0#, bc1# output strobe signals wh ich indicate that either group of data bus pins (d7 to d0 and d15 to d8) is valid in access to the external bus interface space, in single-write strobe mode. cs0# to cs3# output select signals for areas 0 to 3. wait# input input pin for wait request signal s in access to the external space. ale output address latch signal when addr ess/data multiplexed bus is selected. lvd cmpa2 input detection target voltage pin for voltage detection 2. interrupts nmi input non-maskable interrupt request pin. irq0 to irq7 input interrupt request pins. r01ds0261ej0110 rev.1.10 page 14 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 16-bit timer pulse unit tioca0, tiocb0 tiocc0, tiocd0 i/o the tgra0 to tgrd0 input capture input/output compare output/pwm output pins. tioca1, tiocb1 i/o the tgra1 and tgrb1 input capture input/output compare output/pwm output pins. tioca2, tiocb2 i/o the tgra2 and tgrb2 input capture input/output compare output/pwm output pins. tioca3, tiocb3 tiocc3, tiocd3 i/o the tgra3 to tgrd3 input capture input/output compare output/pwm output pins. tioca4, tiocb4 i/o the tgra4 and tgrb4 input capture input/output compare output/pwm output pins. tioca5, tiocb5 i/o the tgra5 and tgrb5 input capture input/output compare output/pwm output pins. tclka, tclkb tclkc, tclkd input input pins for external clock signals. multi-function timer pulse unit 2 mtioc0a, mtioc0b mtioc0c, mtioc0d i/o the tgra0 to tgrd0 input capture input/output compare output/pwm output pins. mtioc1a, mtioc1b i/o the tgra1 and tgrb1 input capture input/output compare output/pwm output pins. mtioc2a, mtioc2b i/o the tgra2 and tgrb2 input capture input/output compare output/pwm output pins. mtioc3a, mtioc3b mtioc3c, mtioc3d i/o the tgra3 to tgrd3 input capture input/output compare output/pwm output pins. mtioc4a, mtioc4b mtioc4c, mtioc4d i/o the tgra4 to tgrd4 input capture input/output compare output/pwm output pins. mtic5u, mtic5v, mtic5w input the tgru5, tgrv5, and tgrw5 input capture input/external pulse input pins. mtclka, mtclkb, mtclkc, mtclkd input input pins for the external clock. port output enable 2 poe0# to poe3#, poe8# input input pins for request signals to place the mtu pins in the high impedance state. realtime clock rtcout output output pin for the 1-hz/64-hz clock. rtcic0 to rtcic2 input time capture event input pins. 8-bit timer tmo0 to tmo3 output compare match output pins. tmci0 to tmci3 input input pins for the external clock to be input to the counter. tmri0 to tmri3 input counter reset input pins. serial communications interface (scig) ? asynchronous mode/clock synchronous mode sck0, sck1, sck5, sck6, sck8, sck9 i/o input/output pins for the clock. rxd0, rxd1, rxd5, rxd6, rxd8, rxd9 input input pins for received data. txd0, txd1, txd5, txd6, txd8, txd9 output output pins for transmitted data. cts0#, cts1#, cts5#, cts6#, cts8#, cts9# input input pins for controlling the start of transmission and reception. rts0#, rts1#, rts5#, rts6#, rts8#, rts9# output output pins for controlling the start of transmission and reception. ? simple i 2 c mode sscl0, sscl1, sscl5, sscl6, sscl8, sscl9 i/o input/output pins for the i 2 c clock. ssda0, ssda1, ssda5, ssda6, ssda8, ssda9 i/o input/output pins for the i 2 c data. table 1.5 pin functions (2/4) classifications pin name i/o description r01ds0261ej0110 rev.1.10 page 15 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview serial communications interface (scig) ? simple spi mode sck0, sck1, sck5, sck6, sck8, sck9 i/o input/output pins for the clock. smiso0, smiso1, smiso5, smiso6, smiso8, smiso9 i/o input/output pins for slave transmit data. smosi0, smosi1, smosi5, smosi6, smosi8, smosi9 i/o input/output pins for master transmit data. ss0#, ss1#, ss5#, ss6#, ss8#, ss9# input slave-select input pins. irda interface irtxd5 output data output pin in the irda format. irrxd5 input data input pin in the irda format. serial communications interface (scih) ? asynchronous mode/clock synchronous mode sck12 i/o input/output pin for the clock. rxd12 input input pin for receiving data. txd12 output output pin for transmitting data. cts12# input input pin for controlling the start of transmission and reception. rts12# output output pin for controlling the start of transmission and reception. ? simple i 2 c mode sscl12 i/o input/output pin for the i 2 c clock. ssda12 i/o input/output pin for the i 2 c data. ? simple spi mode sck12 i/o input/output pin for the clock. smiso12 i/o input/output pin for slave transmit data. smosi12 i/o input/output pin for master transmit data. ss12# input slave-select input pin. ? extended serial mode rxdx12 input input pin for data reception by scif. txdx12 output output pin for data transmission by scif. siox12 i/o input/output pin for data reception or transmission by scif. i 2 c bus interface scl i/o input/output pin for i 2 c bus interface clocks. bus can be directly driven by the n-channel open drain output. sda i/o input/output pin for i 2 c bus interface data. bus can be directly driven by the n-channel open drain output. serial peripheral interface rspcka i/o input/output pin for the rspi clock. mosia i/o input/output pin for transmitting data from the rspi master. misoa i/o input/output pin for transmitting data from the rspi slave. ssla0 i/o input/output pin to select the slave for the rspi. ssla1 to ssla3 output output pins to select the slave for the rspi. serial sound interface ssisck0 i/o ssi serial bit clock pin. ssiws0 i/o word selection pin. ssitxd0 output serial data output pin. ssirxd0 input serial data input pin. audio_mclk input master clock pin for audio. can module crxd0 input input pin ctxd0 output output pin sd host interface sdhi_clk output sd clock output pin sdhi_cmd i/o sd command output, response input signal pin table 1.5 pin functions (3/4) classifications pin name i/o description r01ds0261ej0110 rev.1.10 page 16 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview sd host interface sdhi_d3 to sd_d0 i/o sd data bus pins sdhi_cd input sd card detection pin sdhi_wp input sd write-protect signal usb 2.0 host/ function module vcc_usb input power supply pin for usb. connect this pin to vcc. vss_usb input ground pin for usb. connect this pin to vss. usb0_dp i/o d+ i/o pin of the usb on-chip transceiver. usb0_dm i/o d- i/o pin of the usb on-chip transceiver. usb0_vbus input usb cable connection monitor pin. usb0_exicen output low-power control signal for the otg chip. usb0_vbusen output vbus (5 v) supply enable signal for the otg chip. usb0_ovrcura, usb0_ovrcurb input external overcurrent detection pins. usb0_id input mini-ab connector id input pin during operation in otg mode. 12-bit a/d converter an000 to an007, an016 to an031 input input pins for the analog signals to be processed by the a/d converter. adtrg0# input input pin for the external trigger signal that start the a/d conversion. 12-bit d/a converter da0, da1 output analog output pins of the d/a converter. comparator b cmpb0 to cmpb3 input input pin for the analog signal to be processed by comparator b. cvrefb0 to cvrefb3 input analog reference voltage supply pin for comparator b. cmpob0 to cmpob3 output output pin for comparator b. ctsu ts0 to ts9, ts12, ts13, ts15 to ts20, ts22, ts23, ts27, ts30, ts33, ts35 output electrostatic capacitance measurement pins (touch pins). tscap output lpf connection pin. analog power supply avcc0 input analog voltage supply pin for the 12-bit a/d converter and d/a converter. connect this pin to vcc when not using the 12-bit a/d converter and d/a converter. avss0 input analog ground pin for the 12-bit a/d converter and d/a converter. connect this pin to vss when not using the 12-bit a/d converter and d/a converter. vrefh0 input analog reference voltage supply pin for the 12-bit a/d converter. vrefl0 input analog reference ground pin for the 12-bit a/d converter. vrefh input analog reference voltage supply pin for the 12-bit d/a converter. vrefl input analog reference ground pin for the 12-bit d/a converter. i/o ports p03, p05, p07 i/o 3-bit input/output pins. p12 to p17 i/o 6-bit input/output pins. p20 to p27 i/o 8-bit input/output pins. p30 to p37 i/o 8-bit input/output pins (p35 input pin). p40 to p47 i/o 8-bit input/output pins. p50 to p55 i/o 6-bit input/output pins. pa0 to pa7 i/o 8-bit input/output pins. pb0 to pb7 i/o 8-bit input/output pins. pc0 to pc7 i/o 8-bit input/output pins. pd0 to pd7 i/o 8-bit input/output pins. pe0 to pe7 i/o 8-bit input/output pins. ph0 to ph3 i/o 4-bit input/output pins. pj3 i/o 1-bit input/output pin. table 1.5 pin functions (4/4) classifications pin name i/o description r01ds0261ej0110 rev.1.10 page 17 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 1.5 pin assignments figure 1.3 to figure 1.9 show the pin assignments. table 1.6 to table 1.10 show the lists of pins and pin functions. figure 1.3 pin assignments of the 100-pin tflga (upper perspective view) pe2 rx230 group, rx231 group ptlg0100ka-a (100-pin tflga) (upper perspective view) pe1 pe0 pd4 pd0 p43 vrefl0 p07 vrefh p05 pe3 pd7 pd6 pd3 pd1 p44 p40 avcc0 avss0 p03 pe4 pe5 pd5 pd2 p47 p42 vrefh0 pj3 vrefl vcl pa0 pa1 pe7 pe6 p46 p45 vbatt md xcout xcin pa3 pa5 pa4 pa6 pa2 p41 p34 res# vss p37/ xtal vss pa7 pb0 pb2 pb3 p12 p32 p35 vcc p36/ extal vcc pb1 pb4 pb5 p52 p53 p27 p30 p31 p33 pb7 pb6 pc6 pc7 p54 p55 p15 p16 p25 p26 p17 pc1 pc0 pc4 p50 vcc_ usb/ph3 *1 vss_ usb/ph0 *1 p13 p21 p24 pc2 pc3 pc5 p51 usb0_ dp/ph1 *1 usb0_ dm/ph2 *1 p14 p20 p22 p23 k j h g f e d c b a 10987654321 k j h g f e d c b a 10987654321 note: this figure indicates the power supply pins and i/o port pins. for the pin configuration, see the table ?list of pins and pin functions (100-pin tflga)?. note: for the position of a1 pin in the package, see ?package dimensions?. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb r01ds0261ej0110 rev.1.10 page 18 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview figure 1.4 pin assignments of the 100-pin lqfp 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 pe0 pd7 pd6 pd5 pd4 pd3 pd2 pd1 pd0 p47 p46 p45 p43 p42 p41 vrefl0 p40 vrefh0 avcc0 p07 avss0 pe1 p44 pc2 pc4 pc5 pc6 pc7 p50 p51 p52 p53 p54 p55 vss_usb/ph0 *1 usb0_dp/ph1 *1 vcc_usb/ph3 *1 p12 p13 p14 p15 p16 p17 p20 p21 p22 pc3 usb0_dm/ph2 *1 pe3 pe5 pe6 pe7 pa0 pa1 pa2 pa3 pa4 pa5 pa6 pa7 vss vcc pb1 pb2 pb3 pb4 pb5 pb6 pb7 pc0 pc1 pe4 pb0 vrefh vrefl pj3 vcl vbatt md xcin xcout res# p37/xtal vss p36/extal p35 p34 p33 p32 p31 p30 p27 p26 p25 p23 p03 vcc pe2 p05 p24 rx230 group, rx231 group plqp0100kb-b (100-pin lqfp) (top view) note: this figure indicates the power supply pins and i /o port pins. for the pin configuration, see the table ?list of pins and pin functions (100-pin lqfp)?. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb r01ds0261ej0110 rev.1.10 page 19 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview figure 1.5 pin assignments of the 64-pin wflga a b c d e f g h 1 2 3 4 5 6 7 8 rx230 group, rx231 group pwlg0064ka-a (64-pin wflga) (upper perspective view) p05 avcc0 vrefh0 avss0 p40 vrefl0 p41 p42 p43 p44 vrefh p46 vrefl pe0 pe1 pe2 pe3 pe4 pe5 pa0 pa1 pa3 pa4 pa6 vss pb0 vcc pb1 pb3 pb5 pb6 pb7 pc2 pc3 pc4 pc5 pc6 pc7 p54 p55 vss_ usb/ph0 *1 usb0_ dm/ph2 *1 usb0_ dp/ph1 *1 vcc_ usb/ph3 *1 p14 p15 p16 p17 p26 p27 p30 p31 vbatt p35 vcc p36/ extal vss p37/ xtal res# xcout xcin md vcl p03 note: this figure indicates the power supply pins and i/o port pins. for the pin configuration, see the table ?list of pins and pin functions (64-pin wflga)?. note: for the position of a1 pin in the package, see ?package dimensions?. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb r01ds0261ej0110 rev.1.10 page 20 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview figure 1.6 pin assignments of the 64-pin hwqfn 49 rx230 group, rx231 group pwqn0064kc-a (64-pin hwqfn) (top view) pe2 pe1 pe0 vrefl p46 vrefh p44 p43 p42 p41 vrefl0 p40 vrefh0 avcc0 p05 avss0 pe3 pe4 pe5 pa0 pa1 pa3 pa4 pa6 vss pb0 vcc pb1 pb3 pb5 pb6 pb7 pc2 pc3 pc4 pc5 pc6 pc7 p54 p55 vss_usb/ph0 *1 usb0_dp/ph1 *1 usb0_dm/ph2 *1 vcc_usb/ph3 *1 p14 p15 p16 p17 p03 vcl md xcin xcout res# p37/xtal vss p36/extal vcc p35 vbatt p31 p30 p27 p26 64 50 51 52 53 54 55 56 57 58 59 60 61 62 63 32 17 31 30 29 28 27 26 25 24 23 22 21 20 19 18 1 16 2 3 4 5 6 7 8 9 10 11 12 13 14 15 48 33 47 46 45 44 43 42 41 40 39 38 37 36 35 34 note: this figure indicates the pow er supply pins and i/o port pins. for the pin configuration, see the table ?list of pins and pin functions (64-pin lqfp/hwqfn)?. note: it is recommended to connect an exposed die pad to vss. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb r01ds0261ej0110 rev.1.10 page 21 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview figure 1.7 pin assignments of the 64-pin lqfp 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 54 55 51 49 50 52 53 56 57 58 59 60 61 63 64 62 rx230 group, rx231 group plqp0064kb-c (64-pin lqfp) (top view) pe2 pe1 pe0 vrefl p46 vrefh p44 p43 p42 p41 vrefl0 p40 vrefh0 avcc0 p05 avss0 pe3 pe4 pe5 pa0 pa1 pa3 pa4 pa6 vss pb0 vcc pb1 pb3 pb5 pb6 pb7 pc2 pc3 pc4 pc5 pc6 pc7 p54 p55 vss_usb/ph0 *1 usb0_dp/ph1 *1 usb0_dm/ph2 *1 vcc_usb/ph3 *1 p14 p15 p16 p17 p03 vcl md xcin xcout res# p37/xtal vss p36/extal vcc p35 vbatt p31 p30 p27 p26 note: this figure indicates the power supply pins and i/o port pins. for the pin configuration, see the table ?list of pins and pin functions (64-pin lqfp/hwqfn)?. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb r01ds0261ej0110 rev.1.10 page 22 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview figure 1.8 pin assignments of the 48-pin lqfp figure 1.9 pin assignments of the 48-pin hwqfn 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 1 2 3 4 5 6 7 8 9 10 11 12 38 39 37 40 41 42 43 44 45 47 48 46 rx230 group, rx231 group PLQP0048KB-B (48-pin lqfp) (top view) pe2 pe1 vrefl p46 vrefh p42 p41 vrefl0 p40 vrefh0 avcc0 avss0 pe3 pe4 pa1 pa3 pa4 pa6 vss pb0 vcc pb1 pb3 pb5 pc4 pc5 pc6 pc7 vss_usb/ph0 *1 usb0_dp/ph1 *1 usb0_dm/ph2 *1 vcc_usb/ph3 *1 p14 p15 p16 p17 vcl md res# p37/xtal vss p36/extal vcc p35 p31 p30 p27 p26 18 17 16 15 14 13 note: this figure indicates the pow er supply pins and i/o port pins. for the pin configuration, see the table ?list of pins and pin functions (48-pin lqfp/hwqfn)?. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb rx230 group, rx231 group pwqn0048kb-a (48-pin hwqfn) (top view) pe2 pe1 vrefl p46 vrefh p42 p41 vrefl0 p40 vrefh0 avcc0 avss0 pe3 pe4 pa1 pa3 pa4 pa6 vss pb0 vcc pb1 pb3 pb5 pc4 pc5 pc6 pc7 vss_usb/ph0 *1 usb0_dp/ph1 *1 usb0_dm/ph2 *1 vcc_usb/ph3 *1 p14 p15 p16 p17 vcl md res# p37/xtal vss p36/extal vcc p35 p31 p30 p27 p26 37 48 46 45 44 43 42 41 40 39 38 47 24 13 15 16 17 18 19 20 21 22 23 14 1 12 10 9 8 7 6 5 4 3 2 11 36 25 27 28 29 30 31 32 33 34 35 26 note: it is recommended to connect an exposed die pad to vss. note: this figure indicates the pow er supply pins and i/o port pins. for the pin configuration, see the table ?list of pins and pin functions (48-pin lqfp/hwqfn)?. note 1. rx230: ph0, ph1, ph2, ph3 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb r01ds0261ej0110 rev.1.10 page 23 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.6 list of pins and pin functions (100-pin tflga) (1/3) pin no. power supply, clock, system control i/o port external bus timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others a1 p05 da1 a2 vrefh a3 p07 adtrg0# a4 vrefl0 a5 p43 an003 a6 pd0 d0[a0/d0] irq0/an024 a7 pd4 d4[a4/d4] poe3# irq4/an028 a8 pe0 d8[a8/d8] sck12 an016 a9 pe1 d9[a9/d9] mtioc4c txd12/txdx12/siox12/ smosi12/ssda12 an017/ cmpb0 a10 pe2 d10[a10/d10] mtioc4a rxd12/rxdx12/ smiso12/sscl12 irq7/an018/ cvrefb0 b1 p03 da0 b2 avss0 b3 avcc0 b4 p40 an000 b5 p44 an004 b6 pd1 d1[a1/d1] mtioc4b irq1/an025 b7 pd3 d3[a3/d3] poe8# irq3/an027 b8 pd6 d6[a6/d6] mtic5v/poe1# irq6/an030 b9 pd7 d7[a7/d7] mtic5u/poe0# irq7/an031 b10 pe3 d11[a11/d11] mtioc4b/poe8# cts12#/rts12#/ss12#/ audio_mclk an019/ clkout c1 vcl c2 vrefl c3 pj3 mtioc3c cts6#/rts6#/ss6# c4 vrefh0 c5 p42 an002 c6 p47 an007 c7 pd2 d2[a2/d2] mtioc4d irq2/an026 c8 pd5 d5[a5/d5] mtic5w/poe2# irq5/an029 c9 pe5 d13[a13/d13] mtioc4c/mtioc2b irq5/an021/ cmpob0 c10 pe4 d12[a12/d12] mtioc4d/mtioc1a an020/ cmpa2/ clkout d1 xcin d2 xcout d3 md fined d4 vbatt d5 p45 an005 d6 p46 an006 d7 pe6 d14[a14/d14] irq6/an022 d8 pe7 d15[a15/d15] irq7/an023 d9 pa1 a1 mtioc0b/mtclkc/ tiocb0 sck5/ssla2/ssisck0 d10 pa0 a0/bc0# mtioc4a/tioca0 ssla1 cacref e1 xtal p37 e2 vss e3 res# e4 p34 mtioc0a/tmci3/poe2# sck6 ts0 irq4 e5 p41 an001 e6 pa2 a2 rxd5/smiso5/sscl5/ ssla3/irrxd5 e7 pa6 a6 mtic5v/mtclkb/tmci3/ poe2#/tioca2 cts5#/rts5#/ss5#/ mosia/ssiws0 r01ds0261ej0110 rev.1.10 page 24 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview e8 pa4 a4 mtic5u/mtclka/tmri0/ tioca1 txd5/smosi5/ssda5/ ssla0/ssitxd0/irtxd5 irq5 / cvrefb1 e9 pa5 a5 tiocb1 rspcka e10 pa3 a3 mtioc0d/mtclkd/ tiocd0/tclkb rxd5/smiso5/sscl5/ ssirxd0/irrxd5 irq6 /cmpb1 f1 extal p36 f2 vcc f3 p35 nmi f4 p32 mtioc0c/tmo3/tiocc0/ rtcout/rtcic2 txd6/smosi6/ssda6/ usb0_vbusen irq2 f5 p12 tmci1 scl irq2 f6 pb3 a11 mtioc0a/mtioc4a/tmo0/ poe3#/tiocd3/tclkd sck6 sdhi_w p f7 pb2 a10 tiocc3/tclkc cts6#/rts6#/ss6# f8 pb0 a8 mtic5w/tioca3 rxd6/smiso6/sscl6/ rspcka sdhi_c md f9 pa7 a7 tiocb2 misoa f10 vss g1 p33 mtioc0d/tmri3/poe3#/ tiocd0 rxd6/smiso6/sscl6 ts1 irq3 g2 p31 mtioc4d/tmci2/rtcic1 cts1#/rts1#/ss1#/ ssisck0 irq1 g3 p30 mtioc4b/tmri3/poe8#/ rtcic0 rxd1/smiso1/sscl1/ audio_mclk irq0/ cmpob3 g4 p27 cs3# mtioc2b/tmci3 sck1/ ssiws0 ts2 cvrefb3 g5 bclk p53 ts17 g6 p52 rd# ts18 g7 pb5 a13 mtioc2a/mtioc1b/ tmri1/poe1#/tiocb4 sck9 sdhi_cd g8 pb4 a12 tioca4 cts9#/rts9#/ss9# g9 pb1 a9 mtioc0c/mtioc4c/ tmci0/tiocb3 txd6/smosi6/ssda6 sdhi_cl k irq4/ cmpob1 g10 vcc h1 p26 cs2# mtioc2a/tmo1 txd1/smosi1/ssda1/ ssirxd0 ts3 cmpb3 h2 p25 cs1# mtioc4c/mtclkb/ tioca4 ts4 adtrg0# h3 p16 mtioc3c/mtioc3d/ tmo2/tiocb1/tclkc/ rtcout txd1/smosi1/ssda1/ mosia/scl usb0_vbus/ usb0_vbusen/ usb0_ovrcurb irq6/ adtrg0# h4 p15 mtioc0b/mtclkb/tmci2/ tiocb2/tclkb rxd1/smiso1/sscl1/ crxd0 ts12 irq5/cmpb2 h5 p55 wait# mtioc4d/tmo3 crxd0 ts15 h6 p54 ale mtioc4b/tmci1 ctxd0 ts16 h7 ub pc7 a23/cs0# mtioc3a/mtcl kb/tmo2 txd8/smosi8/ssda8/ misoa cacref h8 pc6 a22/cs1# mtioc3c/mtclka/tmci2 rxd8/smiso8/sscl8/ mosia ts22 h9 pb6 a14 mtioc3d/tioca5 rxd9/smiso9/sscl9 sdhi_d1 h10 pb7 a15 mtioc3b/tiocb5 txd9/smosi9/ssda9 sdhi_d2 j1 p24 cs0# mtioc4a/mtclka/tmri1/ tiocb4 usb0_vbusen ts5 j2 p21 mtioc1b/tmci0/tioca3 rxd0/smiso0/sscl0/ usb0_exicen/ssiws0 ts8 j3 p17 mtioc3a/mtioc3b/tmo1/ poe8#/tiocb0/tclkd sck1/misoa/sda/ ssitxd0 irq7/ cmpob2 j4 p13 mtioc0b/tmo3/tioca5 sda irq3 j5 vss_usb* 1 ph0* 1 cacref* 1 table 1.6 list of pins and pin functions (100-pin tflga) (2/3) pin no. power supply, clock, system control i/o port external bus timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 25 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview note 1. rx230: ph0/cacref, ph1/irq0/tmo0, ph2/irq1/tmri0, ph3/tmci0 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb j6 vcc_usb* 1 ph3* 1 tmci0* 1 j7 p50 wr0#/wr# ts20 j8 pc4 a20/cs3# mtioc3d/mtclkc/tmci1/ poe0# sck5/cts8#/rts8#/ ss8#/ssla0 sdhi_d1 tscap j9 pc0 a16 mtioc3c/tclkc cts5#/rts5#/ss5#/ ssla1 ts35 j10 pc1 a17 mtioc3a/tclkd sck5/ssla2 ts33 k1 p23 mtioc3d/mtclkd/ tiocd3 cts0#/rts0#/ss0#/ ssisck0 ts6 k2 p22 mtioc3b/mtclkc/tmo0/ tiocc3 sck0/ usb0_ovrcurb/ audio_mclk ts7 k3 p20 mtioc1a/tmri0/tio cb3 txd0/smosi0/ssda0/ usb0_id/ssirxd0 ts9 k4 p14 mtioc3a/mtclka/tmri2/ tiocb5/tclka cts1#/rts1#/ss1#/ ctxd0/usb0_ovrcura ts13 irq4/ cvrefb2 k5 ph2* 1 tmri0* 1 usb0_dm* 1 irq1* 1 k6 ph1* 1 tmo0* 1 usb0_dp* 1 irq0* 1 k7 p51 wr1#/bc1#/ wait# ts19 k8 pc5 a21/cs2#/ wait# mtioc3b/mtclkd/tmri2 sck8/rspcka ts23 k9 pc3 a19 mtioc4d/tclkb txd5/smosi5/ssda5/ irtxd5 sdhi_d0 ts27 k10 pc2 a18 mtioc4b/tclka rxd5/smiso5/sscl5/ ssla3/ irrxd5 sdhi_d3 ts30 table 1.6 list of pins and pin functions (100-pin tflga) (3/3) pin no. power supply, clock, system control i/o port external bus timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 26 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.7 list of pins and pin functions (100-pin lfqfp) (1/3) pin no. power supply, clock, system control i/o port external bus timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others 1vrefh 2p 0 3 da0 3vrefl 4 pj3 mtioc3c cts6#/rts6#/ss6# 5vcl 6 vbatt 7md fined 8xcin 9 xcout 10 res# 11 xtal p37 12 vss 13 extal p36 14 vcc 15 p35 nmi 16 p34 mtioc0a/tmci3/poe2# sck6 ts0 irq4 17 p33 mtioc0d/tmri3/poe3#/ tiocd0 rxd6/smiso6/sscl6 ts1 irq3 18 p32 mtioc0c/tmo3/tiocc0/ rtcout/rtcic2 txd6/smosi6/ssda6/ usb0_vbusen irq2 19 p31 mtioc4d/tmci2/rtcic1 cts1#/rts1#/ss1#/ ssisck0 irq1 20 p30 mtioc4b/tmri3/poe8#/ rtcic0 rxd1/smiso1/sscl1/ audio_mclk irq0/ cmpob3 21 p27 cs3# mtioc2b/tmci3 sck1/ ssiws0 ts2 cvrefb3 22 p26 cs2# mtioc2a/tmo1 txd1/smosi1/ssda1/ ssirxd0 ts3 cmpb3 23 p25 cs1# mtioc4c/mtclkb/ tioca4 ts4 adtrg0# 24 p24 cs0# mtioc4a/mtclka/tmri1/ tiocb4 usb0_vbusen ts5 25 p23 mtioc3d/mtclkd/ tiocd3 cts0#/rts0#/ss0#/ ssisck0 ts6 26 p22 mtioc3b/mtclkc/tmo0/ tiocc3 sck0/ usb0_ovrcurb/ audio_mclk ts7 27 p21 mtioc1b/tmci0/tioca3 rxd0/smiso0/sscl0/ usb0_exicen/ssiws0 ts8 28 p20 mtioc1a/tmri0/tiocb3 txd0/smosi0/ssda0/ usb0_id/ssirxd0 ts9 29 p17 mtioc3a/mtioc3b/tmo1/ poe8#/tiocb0/tclkd sck1/misoa/sda/ ssitxd0 irq7/ cmpob2 30 p16 mtioc3c/mtioc3d/ tmo2/tiocb1/tclkc/ rtcout txd1/smosi1/ssda1/ mosia/scl/usb0_vbus/ usb0_vbusen/ usb0_ovrcurb irq6/ adtrg0# 31 p15 mtioc0b/mtclkb/tmci2/ tiocb2/tclkb rxd1/smiso1/sscl1/ crxd0 ts12 irq5/cmpb2 32 p14 mtioc3a/mtclka/tmri2/ tiocb5/tclka cts1#/rts1#/ss1#/ ctxd0/usb0_ovrcura ts13 irq4/ cvrefb2 33 p13 mtioc0b/tmo3/tioca5 sda irq3 34 p12 tmci1 scl irq2 35 vcc_usb* 1 ph3* 1 tmci0* 1 36 ph2* 1 tmri0* 1 usb0_dm* 1 irq1* 1 37 ph1* 1 tmo0* 1 usb0_dp* 1 irq0* 1 38 vss_usb* 1 ph0* 1 cacref* 1 39 p55 wait# mtioc4d/tmo3 crxd0 ts15 40 p54 ale mtioc4b/tmci1 ctxd0 ts16 41 bclk p53 ts17 r01ds0261ej0110 rev.1.10 page 27 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview 42 p52 rd# ts18 43 p51 wr1#/bc1#/ wait# ts19 44 p50 wr0#/wr# ts20 45 ub pc7 a23/cs0# mtioc3a/mtcl kb/tmo2 txd8/smosi8/ssda8/ misoa cacref 46 pc6 a22/cs1# mtioc3c/mtclka/tmci2 rxd8/smiso8/sscl8/ mosia ts22 47 pc5 a21/cs2#/ wait# mtioc3b/mtclkd/tmri2 sck8/rspcka ts23 48 pc4 a20/cs3# mtioc3d/mtclkc/tmci1/ poe0# sck5/cts8#/rts8#/ ss8#/ssla0 sdhi_d1 tscap 49 pc3 a19 mtioc4d/tclkb txd5/smosi5/ssda5/ irtxd5 sdhi_d0 ts27 50 pc2 a18 mtioc4b/tclka rxd5/smiso5/sscl5/ ssla3/ irrxd5 sdhi_d3 ts30 51 pc1 a17 mtioc3a/tclkd sck5/ssla2 ts33 52 pc0 a16 mtioc3c/tclkc cts5#/rts5#/ss5#/ ssla1 ts35 53 pb7 a15 mtioc3b/tiocb5 txd9/smosi9/ssda9 sdhi_d2 54 pb6 a14 mtioc3d/tioca5 rxd9/smiso9/sscl9 sdhi_d1 55 pb5 a13 mtioc2a/mtioc1b/ tmri1/poe1#/tiocb4 sck9/usb0_vbus sdhi_cd 56 pb4 a12 tioca4 cts9#/rts9#/ss9# 57 pb3 a11 mtioc0a/mtioc4a/tmo0/ poe3#/tiocd3/tclkd sck6 sdhi_w p 58 pb2 a10 tiocc3/tclkc cts6#/rts6#/ss6# 59 pb1 a9 mtioc0c/mtioc4c/ tmci0/tiocb3 txd6/smosi6/ssda6 sdhi_cl k irq4/ cmpob1 60 vcc 61 pb0 a8 mtic5w/tioca3 rxd6/smiso6/sscl6/ rspcka sdhi_c md 62 vss 63 pa7 a7 tiocb2 misoa 64 pa6 a6 mtic5v/mtclkb/tmci3/ poe2#/tioca2 cts5#/rts5#/ss5#/ mosia/ssiws0 65 pa5 a5 tiocb1 rspcka 66 pa4 a4 mtic5u/mtclka/tmri0/ tioca1 txd5/smosi5/ssda5/ ssla0/ssitxd0/irtxd5 irq5 / cvrefb1 67 pa3 a3 mtioc0d/mtclkd/ tiocd0/tclkb rxd5/smiso5/sscl5/ ssirxd0/irrxd5 irq6 /cmpb1 68 pa2 a2 rxd5/smiso5/sscl5/ ssla3/irrxd5 69 pa1 a1 mtioc0b/mtclkc/ tiocb0 sck5/ssla2/ssisck0 70 pa0 a0/bc0# mtioc4a/tioca0 ssla1 cacref 71 pe7 d15[a15/d15] irq7/an023 72 pe6 d14[a14/d14] irq6/an022 73 pe5 d13[a13/d13] mtioc4c/mtioc2b irq5/an021/ cmpob0 74 pe4 d12[a12/d12] mtioc4d/mtioc1a an020/ cmpa2/ clkout 75 pe3 d11[a11/d11] mtioc4b/poe8# cts12#/rts12#/ss12#/ audio_mclk an019/ clkout 76 pe2 d10[a10/d10] mtioc4a rxd12/rxdx12/ smiso12/sscl12 irq7/an018/ cvrefb0 77 pe1 d9[a9/d9] mtioc4c txd12/txdx12/siox12/ smosi12/ssda12 an017/ cmpb0 78 pe0 d8[a8/d8] sck12 an016 table 1.7 list of pins and pin functions (100-pin lfqfp) (2/3) pin no. power supply, clock, system control i/o port external bus timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 28 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview note 1. rx230: ph0/cacref, ph1/irq0/tmo0, ph2/irq1/tmri0, ph3/tmci0 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb 79 pd7 d7[a7/d7] mtic5u/poe0# irq7/an031 80 pd6 d6[a6/d6] mtic5v/poe1# irq6/an030 81 pd5 d5[a5/d5] mtic5w/poe2# irq5/an029 82 pd4 d4[a4/d4] poe3# irq4/an028 83 pd3 d3[a3/d3] poe8# irq3/an027 84 pd2 d2[a2/d2] mtioc4d irq2/an026 85 pd1 d1[a1/d1] mtioc4b irq1/an025 86 pd0 d0[a0/d0] irq0/an024 87 p47 an007 88 p46 an006 89 p45 an005 90 p44 an004 91 p43 an003 92 p42 an002 93 p41 an001 94 vrefl0 95 p40 an000 96 vrefh0 97 avcc0 98 p07 adtrg0# 99 avss0 100 p05 da1 table 1.7 list of pins and pin functions (100-pin lfqfp) (3/3) pin no. power supply, clock, system control i/o port external bus timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 29 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.8 list of pins and pin functions (64-pin wflga) (1/2) pin no. power supply, clock, system control i/o port timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others a1 p05 da1 a2 avcc0 a3 vrefh0 a4 vrefl0 a5 vrefh a6 vrefl a7 pe2 mtioc4a rxd12/rxdx12/smiso12/ sscl12 irq7/an018/ cvrefb0 a8 pe3 mtioc4b/poe8# cts12#/rts12#/ss12#/ audio_mclk an019/clkout b1 vcl b2 avss0 b3 p40 an000 b4 p42 an002 b5 p44 an004 b6 p46 an006 b7 pe1 mtioc4c txd12/txdx12/siox12/ smosi12/ssda12 an017/cmpb0 b8 pe4 mtioc4d/mtioc1a an020/cmpa2/ clkout c1 xcin c2 md fined c3 p03 da0 c4 p41 an001 c5 p43 an003 c6 pe0 sck12 an016 c7 pe5 mtioc4c/mtioc2b irq5/an021/ cmpob0 c8 pa0 mtioc4a/tioca0 ssla1 cacref d1 xcout d2 res# d3 p27 mtioc2b/tmci3 sck1/ ssiws0 ts2 cvrefb3 d4 p14 mtioc3a/mtclka/tmri2/ tiocb5/tclka cts1#/rts1#/ss1#/ctxd0/ usb0_ovrcura ts13 irq4/cvrefb2 d5 pa6 mtic5v/mtclkb/tmci3/poe2#/ tioca2 cts5#/rts5#/ss5#/mosia/ ssiws0 d6 pa4 mtic5u/mtclka/tmri0/tioca1 txd5/smosi5/ssda5/ssla0/ ssitxd0/irtxd5 irq5 /cvrefb1 d7 pa1 mtioc0b/mtclkc/tiocb0 sck5/ssla2/ssisck0 d8 pa3 mtioc0d/mtclkd/tiocd0/ tclkb rxd5/smiso5/sscl5/ssirxd0/ irrxd5 irq6 /cmpb1 e1 vss e2 vbatt e3 p30 mtioc4b/tmri3/poe8#/rtcic0 rxd1/smiso1/sscl1/ audio_mclk irq0/cmpob3 e4 p16 mtioc3c/mtioc3d/tmo2/ tiocb1/tclkc/rtcout txd1/smosi1/ssda1/mosia/ scl/usb0_vbus/ usb0_vbusen/ usb0_ovrcurb irq6/adtrg0# e5 pc4 mtioc3d/mtclkc/tmci1/ poe0# sck5/cts8#/rts8#/ss8#/ ssla0 sdhi_d1 tscap e6 vcc e7 vss e8 pb0 mtic5w/tioca3 rxd6/smiso6/sscl6/rspcka sdhi_c md f1 vcc f2 p35 nmi f3 p31 mtioc4d/tmci2/rtcic1 cts1#/rts1#/ss1#/ssisck0 irq1 r01ds0261ej0110 rev.1.10 page 30 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview note 1. rx230: ph0/cacref, ph1/irq0/tmo0, ph2/irq1/tmri0, ph3/tmci0 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb f4 pc5 mtioc3b/mtclkd/tmri 2 sck8/rspcka/usb0_id ts23 f5 p15 mtioc0b/mtclkb/tmci2/ tiocb2/tclkb rxd1/smiso1/sscl1/ crxd0 ts12 irq5/cmpb2 f6 pb1 mtioc0c/mtioc4c/tmci0/ tiocb3 txd6/smosi6/ssda6 sdhi_cl k irq4/ cmpob1 f7 pb5 mtioc2a/mtioc1b/tmri1/ poe1#/tiocb4 sck9 sdhi_cd f8 pb3 mtioc0a/mtioc4a/tmo0/ poe3#/tiocd3/tclkd sck6 sdhi_w p g1 extal p36 g2 p26 mtioc2a/tmo1 txd1/smosi1/ssda1/ usb0_vbusen/ssirxd0 ts3 cmpb3 g3 vcc_usb* 1 ph3* 1 tmci0* 1 g4 vss_usb* 1 ph0* 1 cacref* 1 g5 ub pc7 mtioc3a/mtclkb/tmo2 tx d8/smosi8/ssda8/misoa cacref g6 pc6 mtioc3c/mtclka/tmci2 r xd8/smiso8/sscl8/mosia/ usb0_exicen ts22 g7 pc3 mtioc4d/tclkb txd5/smosi5/ssda5/irtxd5 sdhi_d0 ts27 g8 pb6/pc0 mtioc3d/tioca5 rxd9/smiso9/sscl9 sdhi_d1 h1 xtal p37 h2 p17 mtioc3a/mtioc3b/tmo1/ poe8#/tiocb0/tclkd sck1/misoa/sda/ssitxd0 irq7/ cmpob2 h3 ph2* 1 tmri0* 1 usb0_dm* 1 irq1* 1 h4 ph1* 1 tmo0* 1 usb0_dp* 1 irq0* 1 h5 p55 mtioc4d/tmo3 crxd0 ts15 h6 p54 mtioc4b/tmci1 ctxd0 ts16 h7 pc2 mtioc4b/tclka rxd5/smiso5/sscl5/ssla3/ irrxd5 sdhi_d3 ts30 h8 pb7/pc1 mtioc3b/tiocb5 txd9/smosi9/ssda9 sdhi_d2 table 1.8 list of pins and pin functions (64-pin wflga) (2/2) pin no. power supply, clock, system control i/o port timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 31 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.9 list of pins and pin functions (64-pin lqfp/hwqfn) (1/2) pin no. power supply, clock, system control i/o port timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others 1p 0 3 da0 2vcl 3md fined 4xcin 5 xcout 6 res# 7xtal p37 8 vss 9 extal p36 10 vcc 11 p35 nmi 12 vbatt 13 p31 mtioc4d/tmci2/rtcic1 cts1#/rts1#/ss1#/ssisck0 irq1 14 p30 mtioc4b/tmri3/poe8#/rtcic0 rxd1/smiso1/sscl1/ audio_mclk irq0/cmpob3 15 p27 mtioc2b/tmci3 sck1/ssiws0 ts2 cvrefb3 16 p26 mtioc2a/tmo1 txd1/smosi1/ssda1/ usb0_vbusen/ssirxd0 ts3 cmpb3 17 p17 mtioc3a/mtioc3b/tmo1/ poe8#/tiocb0/tclkd sck1/misoa/sda/ssitxd0 irq7/ cmpob2 18 p16 mtioc3c/mtioc3d/tmo2/ tiocb1/tclkc/rtcout txd1/smosi1/ssda1/mosia/ scl/usb0_vbus/ usb0_vbusen/ usb0_ovrcurb irq6/adtrg0# 19 p15 mtioc0b/mtclkb/tmci2/ tiocb2/tclkb rxd1/smiso1/sscl1/ crxd0 ts12 irq5/cmpb2 20 p14 mtioc3a/mtclka/tmri2/ tiocb5/tclka cts1#/rts1#/ss1#/ctxd0/ usb0_ovrcura ts13 irq4/cvrefb2 21 vcc_usb* 1 ph3* 1 tmci0* 1 22 ph2* 1 tmri0* 1 usb0_dm* 1 irq1* 1 23 ph1* 1 tmo0* 1 usb0_dp* 1 irq0* 1 24 vss_usb* 1 ph0* 1 cacref* 1 25 p55 mtioc4d/tmo3 crxd0 ts15 26 p54 mtioc4b/tmci1 ctxd0 ts16 27 ub pc7 mtioc3a/mtclkb/tmo2 tx d8/smosi8/ssda8/misoa cacref 28 pc6 mtioc3c/mtclka/tmci2 r xd8/smiso8/sscl8/mosia/ usb0_exicen ts22 29 pc5 mtioc3b/mtclkd/tmri 2 sck8/rspcka/usb0_id ts23 30 pc4 mtioc3d/mtclkc/tmci1/ poe0# sck5/cts8#/rts8#/ss8#/ ssla0 sdhi_d1 tscap 31 pc3 mtioc4d/tclkb txd5/smosi5/ssda5/ irtxd5 sdhi_d0 ts27 32 pc2 mtioc4b/tclka rxd5/smiso5/sscl5/ssla3/ irrxd5 sdhi_d3 ts30 33 pb7/pc1 mtioc3b/tiocb5 txd9/smosi9/ssda9 sdhi_d2 34 pb6/pc0 mtioc3d/tioca5 rxd9/smiso9/sscl9 sdhi_d1 35 pb5 mtioc2a/mtioc1b/tmri1/ poe1#/tiocb4 sck9 sdhi_cd 36 pb3 mtioc0a/mtioc4a/tmo0/ poe3#/tiocd3/tclkd sck6 sdhi_w p 37 pb1 mtioc0c/mtioc4c/tmci0/ tiocb3 txd6/smosi6/ssda6 sdhi_cl k irq4/ cmpob1 38 vcc 39 pb0 mtic5w/tioca3 rxd6/smiso6/sscl6/rspcka sdhi_c md 40 vss 41 pa6 mtic5v/mtclkb/tmci3/poe2#/ tioca2 cts5#/rts5#/ss5#/mosia/ ssiws0 r01ds0261ej0110 rev.1.10 page 32 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview note 1. rx230: ph0/cacref, ph1/irq0/tmo0, ph2/irq1/tmri0, ph3/tmci0 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb 42 pa4 mtic5u/mtclka/tmri0/tioca1 txd5/smosi5/ssda5/ssla0/ ssitxd0/irtxd5 irq5 /cvrefb1 43 pa3 mtioc0d/mtclkd/tiocd0/ tclkb rxd5/smiso5/sscl5/ssirxd0/ irrxd5 irq6 /cmpb1 44 pa1 mtioc0b/mtclkc/tiocb0 sck5/ssla2/ssisck0 45 pa0 mtioc4a/tioca0 ssla1 cacref 46 pe5 mtioc4c/mtioc2b irq5/an021/ cmpob0 47 pe4 mtioc4d/mtioc1a an020/cmpa2/ clkout 48 pe3 mtioc4b/poe8# cts12#/rts12#/ss12#/ audio_mclk an019/clkout 49 pe2 mtioc4a rxd12/rxdx12/smiso12/ sscl12 irq7/an018/ cvrefb0 50 pe1 mtioc4c txd12/txdx12/siox12/ smosi12/ssda12 an017/cmpb0 51 pe0 sck12 an016 52 vrefl 53 p46 an006 54 vrefh 55 p44 an004 56 p43 an003 57 p42 an002 58 p41 an001 59 vrefl0 60 p40 an000 61 vrefh0 62 avcc0 63 p05 da1 64 avss0 table 1.9 list of pins and pin functions (64-pin lqfp/hwqfn) (2/2) pin no. power supply, clock, system control i/o port timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 33 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview table 1.10 list of pins and pin functions (48-pin lqfp/hwqfn) (1/2) pin no. power supply, clock, system control i/o port timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others 1vcl 2md fined 3 res# 4xtal p37 5 vss 6 extal p36 7vcc 8p 3 5 nmi 9 p31 mtioc4d/tmci2 cts1#/rts1#/ss1#/ssisck0 irq1 10 p30 mtioc4b/tmri3/poe8# rxd1/smiso1/sscl1/ audio_mclk irq0/cmpob3 11 p27 mtioc2b/tmci3 sck1/ssiws0 ts2 cvrefb3 12 p26 mtioc2a/tmo1 txd1/smosi1/ssda1/ usb0_vbusen/ssirxd0 ts3 cmpb3 13 p17 mtioc3a/mtioc3b/tmo1/ poe8#/tiocb0/tclkd sck1/misoa/sda/ ssitxd0 irq7/ cmpob2 14 p16 mtioc3c/mtioc3d/tmo2/ tiocb1/tclkc txd1/smosi1/ssda1/mosia/ scl/usb0_vbus/ usb0_vbusen/ usb0_ovrcurb irq6/adtrg0# 15 p15 mtioc0b/mtclkb/tmci2/ tiocb2/tclkb rxd1/smiso1/sscl1/ crxd0 ts12 irq5/cmpb2 16 p14 mtioc3a/mtclka/tmri2/ tiocb5/tclka cts1#/rts1#/ss1#/ctxd0/ usb0_ovrcura ts13 irq4/cvrefb2 17 vcc_usb* 1 ph3* 1 tmci0* 1 18 ph2* 1 tmri0* 1 usb0_dm* 1 irq1* 1 19 ph1* 1 tmo0* 1 usb0_dp* 1 irq0* 1 20 vss_usb* 1 ph0* 1 cacref* 1 21 ub pc7 mtioc3a/mtclkb/tmo2 tx d8/smosi8/ssda8/misoa cacref 22 pc6 mtioc3c/mtclka/tmci2 r xd8/smiso8/sscl8/mosia/ usb0_exicen ts22 23 pc5 mtioc3b/mtclkd/tmri 2 sck8/rspcka/usb0_id ts23 24 pc4 mtioc3d/mtclkc/tmci1/ poe0# sck5/cts8#/rts8#/ss8#/ ssla0 sdhi_d1 tscap 25 pb5/pc3 mtioc2a/mtioc1b/tmri1/ poe1#/tiocb4 sdhi_cd 26 pb3/pc2 mtioc0a/mtioc4a/tmo0/ poe3#/tiocd3/tclkd sck6 sdhi_w p 27 pb1/pc1 mtioc0c/mtioc4c/tmci0/ tiocb3 txd6/smosi6/ssda6 sdhi_cl k irq4/ cmpob1 28 vcc 29 pb0/pc0 mtic5w/tioca3 rxd6/smiso6/sscl6/rspcka sdhi_c md 30 vss 31 pa6 mtic5v/mtclkb/tmci3/poe2#/ tioca2 cts5#/rts5#/ss5#/mosia/ ssiws0 32 pa4 mtic5u/mtclka/tmri0/tioca1 txd5/smosi5/ssda5/ssla0/ ssitxd0/irtxd5 irq5 /cvrefb1 33 pa3 mtioc0d/mtclkd/tiocd0/ tclkb rxd5/smiso5/sscl5/ssirxd0/ irrxd5 irq6 /cmpb1 34 pa1 mtioc0b/mtclkc/tiocb0 sck5/ssla2/ssisck0 35 pe4 mtioc4d/mtioc1a an020/cmpa2/ clkout 36 pe3 mtioc4b/poe8# cts12#/rts12#/audio_mclk an019/clkout 37 pe2 mtioc4a rxd12/rxdx12/sscl12 irq7/an018/ cvrefb0 38 pe1 mtioc4c txd12/txdx12/siox12/ssda12 an017/cmpb0 39 vrefl 40 p46 an006 r01ds0261ej0110 rev.1.10 page 34 of 177 oct 30, 2015 rx230 group, rx231 group 1. overview note 1. rx230: ph0/cacref, ph1/irq0/tmo0, ph2/irq1/tmri0, ph3/tmci0 rx231: vss_usb, usb0_dp, usb0_dm, vcc_usb 41 vrefh 42 p42 an002 43 p41 an001 44 vrefl0 45 p40 an000 46 vrefh0 47 avcc0 48 avss0 table 1.10 list of pins and pin functions (48-pin lqfp/hwqfn) (2/2) pin no. power supply, clock, system control i/o port timers (mtu, tpu, tmr, rtc, cmt, poe, cac) communications (scig, scih, rspi, riic, can, usb, ssi) memory interface (sdhi) touch sensing others r01ds0261ej0110 rev.1.10 page 35 of 177 oct 30, 2015 rx230 group, rx231 group 2. cpu 2. cpu figure 2.1 shows register set of the cpu. figure 2.1 register set of the cpu note 1. the stack pointer (sp) can be the interrupt stack pointer (isp) or user stack pointer (usp), according to the value of the u bit in the psw. r15 r14 r13 r12 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 (sp) *1 general-purpose register b31 b0 dsp instruction register b71 b0 acc0 (accumulator 0) acc1 (accumulator 1) usp (user stack pointer) isp (interrupt stack pointer) intb (interrupt table register) pc (program counter) psw (processor status word) bpc (backup pc) bpsw (backup psw) fintv (fast interrupt vector register) fpsw (floating-point status word) control register b31 b0 extb (exception table register) r01ds0261ej0110 rev.1.10 page 36 of 177 oct 30, 2015 rx230 group, rx231 group 2. cpu 2.1 general-purpose r egisters (r0 to r15) this cpu has sixteen 32-bit general-purpose registers (r0 to r15). r0 to r15 can be used as data registers or address registers. r0, a general-purpose register, also functions as the stack pointer (sp). the stack pointer is switched to operate as the interrupt stack pointer (isp) or user stack pointer (usp) by the value of the stack pointer select bit (u) in the processor status word (psw). 2.2 control registers (1) interrupt stack pointer (isp) and user stack pointer (usp) the stack pointer (sp) can be either of two types, the interrupt stack point er (isp) or the user stack pointer (usp). whether the stack pointer operates as the isp or usp depends on the value of the stack poi nter select bit (u) in the processor status word (psw). set the isp or usp to a multiple of 4 to reduce the number of cycles required to execute interrupt sequences and instructions entailing stack manipulation. (2) exception table register (extb) the exception table register (extb) specifies the address wher e the exception vector table starts. set the extb to a multiple of 4 to reduce the number of cycles required to execute interrupt sequences and instructions entailing stack manipulation. (3) interrupt table register (intb) the interrupt table register (int b) specifies the address where th e interrupt vector table starts. set the intb to a multiple of 4 to reduce the number of cycl es required to execute interr upt sequences and instructions entailing stack manipulation. (4) program counter (pc) the program counter (pc) indicates the a ddress of the instruction being executed. (5) processor status word (psw) the processor status word (psw) i ndicates the results of instruction execution or the state of the cpu. (6) backup pc (bpc) the backup pc (bpc) is provided to speed up response to interrupts. after a fast interrupt has been generated, the contents of the program counter (pc) are saved in the bpc register. (7) backup psw (bpsw) the backup psw (bpsw) is provided to speed up response to interrupts. after a fast interrupt has been generated, the contents of the processor status word (psw ) are saved in the bpsw. the allocation of bits in the bpsw corresponds to that in the psw. (8) fast interrupt vector register (fintv) the fast interrupt vector register (fintv) is provided to speed up response to interrupts. the fintv register specifies a bran ch destination address when a fa st interrupt has been generated. r01ds0261ej0110 rev.1.10 page 37 of 177 oct 30, 2015 rx230 group, rx231 group 2. cpu (9) floating-point st atus word (fpsw) the floating-point status word (fpsw) indicates the results of floating-point operations. when an exception handling enable bit (e j) enables the exception handling (ej = 1) , the exception cause can be identified by checking the corresponding cj flag in the exception handling routine. if th e exception handling is masked (ej = 0), the occurrence of exception can be ch ecked by reading the fj flag at the end of a series of pro cessing. once the fj flag has been set to 1, this value is retained until it is cleared to 0 by software (j = x, u, z, o, or v). 2.3 accumulator the accumulator (acc0 or acc1) is a 72-bit register used for dsp instruct ions. the accumulator is handled as a 96-bit register for reading and writing. at this time, when bits 95 to 72 of the accumulator are read , the value where the value of bit 71 is sign extended is read . writing to bits 95 to 72 of the accumulator is ignored. acc0 is also used for the multiply and multiply-and-accumulate in structions; emul, emulu, fmul, mul, and rmpa, in whic h case the prior value in acc0 is modified by execu tion of the instruction. use the mvtacgu, mvtachi, and mvtaclo instructi ons for writing to the accu mulator. the mvtacgu, mvtachi, and mvtaclo instructions write data to bits 95 to 64, the higher-order 32 bits (bits 63 to 32), and the lower-order 32 bits (bits 31 to 0), respectively. use the mvfacgu, mvfa chi, mvfacmi, and mvfaclo in structions for reading data from the accumulator. the mvfacgu, mvfachi, mvfacmi, and mvfaclo instructions r ead data from the guard bits (bits 95 to 64), higher- order 32 bits (bits 63 to 32), the middle 32 bits (bits 47 to 16), and the lower-order 32 bits (bits 31 to 0), respectively. r01ds0261ej0110 rev.1.10 page 38 of 177 oct 30, 2015 rx230 group, rx231 group 3. address space 3. address space 3.1 address space this lsi has a 4-gbyte address space, consisting of the rang e of addresses from 0000 0000 h to ffff ffffh. that is, linear access to an address space of up to 4 gbytes is po ssible, and this contains bo th program and data areas. figure 3.1 shows the memory maps in the re spective operating modes. accessible areas will differ according to the operating mode and states of control bits. r01ds0261ej0110 rev.1.10 page 39 of 177 oct 30, 2015 rx230 group, rx231 group 3. address space figure 3.1 memory map in each operating mode reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 reserved area *3 external address space (cs area) external address space (cs area) on-chip rom (e2dataflash) reserved area *3 0000 0000h 0008 0000h ffff ffffh single-chip mode* 1 ram *2 on-chip rom (program rom) (read only)* 2 0010 0000h peripheral i/o registers 0010 2000h 0080 0000h fff8 0000h peripheral i/o registers peripheral i/o registers 007f c000h 007f c500h 007f fc00h 0001 0000h 0000 0000h 0008 0000h ffff ffffh on-chip rom enabled extended mode ram *2 on-chip rom (program rom) (read only)* 2 0010 0000h peripheral i/o registers 0010 2000h on-chip rom (e2dataflash) 0080 0000h 0500 0000h 0800 0000h fff8 0000h peripheral i/o registers peripheral i/o registers 007f c000h 007f c500h 007f fc00h 0001 0000h 0000 0000h 0008 0000h ffff ffffh on-chip rom disabled extended mode ram *2 0010 0000h peripheral i/o registers 0500 0000h 0800 0000h ff00 0000h 0001 0000h external address space note 1. the address space in boot mode and usb boot mode is the same as the address space in single-chip mode. note 2. the capacity of rom/ram differs depending on the products. note: see table 1.3 and table 1.4 list of products, for the product type name. note 3. reserved areas should not be accessed. rom (bytes) ram (bytes) capacity address capacity address 512 kbytes fff8 0000h to ffff ffffh 64 kbytes 0000 0000h to 0000 ffffh 384 kbytes fffa 0000h to ffff ffffh 256 kbytes fffc 0000h to ffff ffffh 32 kbytes 0000 0000h to 0000 7fffh 128 kbytes fffe 0000h to ffff ffffh r01ds0261ej0110 rev.1.10 page 40 of 177 oct 30, 2015 rx230 group, rx231 group 3. address space 3.2 external address space the external address space is divided into up to four cs areas (cs0 to cs3) , each corresponding to the csn# signal output from a csn# (n = 0 to 3) pin. figure 3.2 shows the address ranges correspondi ng to the individual cs areas (cs0 to cs3) in on-chip rom disabled extended mode. figure 3.2 correspondence between external address spaces and cs areas (in on-chip rom disabl ed extended mode) reserved area* 1 reserved area* 1 reserved area* 1 0000 0000h 0008 0000h ram external address space (cs area) 0010 0000h peripheral i/o registers 0500 0000h 0800 0000h ff00 0000h 0001 0000h external address space* 2 (cs area) 0500 0000h 0600 0000h 0700 0000h 05ff ffffh 06ff ffffh 07ff ffffh cs3 (16 mbytes) cs2 (16 mbytes) cs1 (16 mbytes) ffff ffffh ffff ffffh ff00 0000h cs0 (16 mbytes) note 1. reserved areas should not be accessed. note 2. the cs0 area is disabled in on-chip rom enabled extended mode. in this mode, the address space for addresses above 1000 0000h is as shown in figure on this section, memory map in each operating mode. r01ds0261ej0110 rev.1.10 page 41 of 177 oct 30, 2015 rx230 group, rx231 group 4. i/o registers 4. i/o registers this section provides information on the on-chip i/o register addresses and bit configuration. the information is given as shown below. notes on writing to registers are also given below. (1) i/o register addresses (address order) ? registers are listed from th e lower allocation addresses. ? registers are classified acco rding to module symbols. ? numbers of cycles for access indicate numbers of cycles of the given base clock. ? among the internal i/o register area, a ddresses not listed in the list of regi sters are reserved. reserved addresses must not be accessed. do not access these addresses; ot herwise, the operation when accessing these bits and subsequent operations cannot be guaranteed. (2) notes on writing to i/o registers when writing to an i/o register , the cpu starts executing the subsequent instru ction before completing i/o register write. this may cause the subsequent instruction to be executed befo re the post-update i/o register value is reflected on the operation. as described in the following examples, sp ecial care is required for the cases in wh ich the subsequent instruction must be executed after the post-update i/o re gister value is actually reflected. [examples of cases requiring special care] ? the subsequent instruction must be execu ted while an interrupt request is disabled with the ienj bit in iern of the icu (interrupt request en able bit) cleared to 0. ? a wait instruction is executed immediately after the preprocessing for causing a transition to the low power consumption state. in the above cases, after writing to an i/o register, wait until the write operation is completed using the following procedure and then execute the subsequent instruction. (a) write to an i/o register. (b) read the value from the i/o re gister to a general register. (c) execute the operati on using the value read. (d) execute the subsequent instruction. [instruction examples] ? byte-size i/o registers mov.l #sfr_addr, r1 mov.b #sfr_data, [r1] cmp [r1].ub, r1 ;; next process ? word-size i/o registers mov.l #sfr_addr, r1 mov.w #sfr_data, [r1] cmp [r1].w, r1 ;; next process r01ds0261ej0110 rev.1.10 page 42 of 177 oct 30, 2015 rx230 group, rx231 group 4. i/o registers ? longword-size i/o registers mov.l #sfr_addr, r1 mov.l #sfr_data, [r1] cmp [r1].l, r1 ;; next process if multiple registers are written to and a subsequent instruc tion should be executed after th e write operati ons are entirely completed, only read the i/o register that was last written to and execute the operation using th e value; it is not necessary to read or execute operation for all the registers that were written to. (3) number of access cycles to i/o registers for numbers of clock cycles fo r access to i/o registers, see table 4.1, list of i/o registers (address order) . the number of access cycles to i/o regist ers is obtained by following equation. * 1 number of access cycles to i/o registers = numb er of bus cycles for internal main bus 1 + number of divided clock synchronization cycles + number of bus cycles for internal peripheral bus 1 to 6 the number of bus cycles of internal peripheral bus 1 to 6 differs according to the register to be accessed. when peripheral functions connected to internal peripheral bus 2 to 6 or registers for the ex ternal bus control unit (except for bus error related registers) are accessed, the number of divided clock synchronization cycles is added. the number of divided clock synchronization cycles differs depending on the frequency ratio between iclk and pclk (or fclk, bclk) or bus access timing. in the peripheral function unit, when the fr equency ratio of iclk is equal to or gr eater than that of pclk (or fclk), the sum of the number of bus cycles for internal main bus 1 and the number of the divided clock synchronization cycles will be one cycle of pclk (or fclk) at a maximum. therefore, one pclk (or fclk) has been added to the number of access cycles shown in table 4.1 . when the frequency ratio of iclk is lower than that of pclk (or fclk), the subsequent bus access is started from the iclk cycle following the completion of the access to the peripheral functions. th erefore, the access cycles are described on an iclk basis. in the external bus control unit, the sum of the number of bu s cycles for internal main bus 1 and the number of divided clock synchronization cycles will be one cycle of bclk at a maximum. therefore, one bclk is added to the number of access cycles shown in table 4.1 . note 1. this applies to the number of cycles when the access fr om the cpu does not conflict with the instruction fetching to the external memory or bus access from the different bus master (dmac or dtc). (4) restrictions in relation to rmpa and string-manipulation instructions the allocation of data to be handled by rmpa or string-man ipulation instructions to i/o registers is prohibited, and operation is not guaranteed if this restriction is not observed. (5) notes on sleep mode and mode transitions during sleep mode or mode transitions, do not write to the sy stem control related registers (indicated by 'system' in the module symbol column in table 4.1, list of i/o registers (address order) ). r01ds0261ej0110 rev.1.10 page 43 of 177 oct 30, 2015 rx230 group, rx231 group 4. i/o registers 4.1 i/o register addresses (address order) table 4.1 list of i/o register s (address order) (1 / 42) address module symbol register name register symbol number of bits access size number of access cycles iclk ? pclk iclk r01ds0261ej0110 rev.1.10 page 86 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. use avcc0 and vcc under the following conditions: avcc0 and vcc can be set individually within the operating range when vcc 2.0 v avcc0 = vcc when vcc ? 2.0 v note 2. when powering on the vcc and avcc0 pins, power them on at the same time or the vcc pin first and then the avcc0 pin. table 5.2 recommended operating voltage conditions item symbol conditions min. typ. max. unit power supply voltages vcc *1, *2 when usb is not used 1.8 ? 5.5 v when usb is used when usb regulator is not used 3.0 ? 3.6 when usb is used when usb regulator is used 4.0 ? 5.5 vss ? 0 ? usb power supply voltages vcc_usb when usb regulator is not used ? vcc ? v vss_usb ? 0 ? vbatt power supply voltage vbatt 1.8 ? 5.5 v analog power supply voltages avcc0 *1, *2 1.8 ? 5.5 v avss0 ? 0 ? vrefh0 1.8 ? avcc0 vrefl0 ? 0 ? vrefh 1.8 ? avcc0 vrefl ? 0 ? r01ds0261ej0110 rev.1.10 page 87 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.2 dc characteristics table 5.3 dc characteristics (1) conditions: 2.7 v vcc = vcc_usb 5.5 v, 2.7 v avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions schmitt trigger input voltage riic input pin (except for smbus, 5 v tolerant) v ih vcc 0.7 ? 5.8 v ports 12, 13, 16, 17, port b5 (5 v tolerant) vcc 0.8 ? 5.8 ports 14 to 15, ports 20 to 27, ports 33 to 37, ports 50 to 55, ports a0 to a7, ports b0 to b4, b6, b7 ports c0 to c7, ports d0 to d7, ports e0 to e7, port j3, ports 30 to 32 (when time capture event input is not selected), res vcc 0.8 ? vcc + 0.3 ports 03, 05, 07, ports 40 to 47 avcc0 0.8 ? avcc0 + 0.3 ports 30 to 32 (when time capture event input is selected) when vcc is supplied vcc 0.8 ? vcc + 0.3 when vbatt is supplied vbatt 0.8 ? vbatt + 0.3 ports 03, 05, 07, ports 40 to 47 v il ?0.3 ? avcc0 0.2 riic input pin (except for smbus) ?0.3 ? vcc 0.3 other than riic input pin or ports 30 to 32 ?0.3 ? vcc 0.2 ports 30 to 32 (when time capture event input is selected) when vcc is supplied ?0.3 ? vcc 0.3 when vbatt is supplied ?0.3 ? vbatt 0.3 ports 03, 05, 07, ports 40 to 47 ?v t avcc0 0.1 ? ? riic input pin (except for smbus) vcc 0.05 ? ? ports 12, 13, 16, 17, port b5 vcc 0.05 ? ? other than riic input pin vcc 0.1 ? ? input level voltage (except for schmitt trigger input pins) md v ih vcc 0.9 ? vcc + 0.3 v extal (external clock input) vcc 0.8 ? vcc + 0.3 riic input pin (smbus) 2.1 ? vcc + 0.3 md v il ?0.3 ? vcc 0.1 extal (external clock input) ?0.3 ? vcc 0.2 riic input pin (smbus) ?0.3 ? 0.8 r01ds0261ej0110 rev.1.10 page 88 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics table 5.4 dc characteristics (2) conditions: 1.8 v vcc = vcc_usb < 2.7 v, 1.8 v avcc0 < 2.7 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions schmitt trigger input voltage ports 12, 13, 16, 17, port b5 (5 v tolerant) v ih vcc 0.8 ? 5.8 v ports 14 to 15, ports 20 to 27, ports 30 to 37, ports 50 to 55, ports a0 to a7, ports b0 to b4, b6, b7, ports c0 to c7, ports d0 to d7, ports e0 to e7, port j3, res vcc 0.8 ? vcc + 0.3 ports 03, 05, 07, ports 40 to 47 avcc0 0.8 ? avcc0 + 0.3 ports 03, 05, 07, ports 40 to 47 v il ?0.3 ? avcc0 0.2 ports other than above ?0.3 ? vcc 0.2 ports 03, 05, 07, ports 40 to 47 ?v t avcc0 0.01 ? ? ports other than above vcc 0.01 ? ? input level voltage (except for schmitt trigger input pins) md v ih vcc 0.9 ? vcc + 0.3 v extal (external clock input) vcc 0.8 ? vcc + 0.3 md v il ?0.3 ? vcc 0.1 extal (external clock input) ?0.3 ? vcc 0.2 table 5.5 dc characteristics (3) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions input leakage current res#, md, port 35 ? i in ? ??1.0 av in = 0 v, vcc three-state leakage current (off-state) ports for 5 v tolerant ? i tsi ? ??1.0 av in = 0 v, 5.8v ports except for 5 v tolerant ? ? 0.2 av in = 0 v, vcc input capacitance all input pins (except for port 35, usb0_dm, usb0_dp) c in ? ? 15 pf v in = 0 mv, f = 1 mhz, t a = 25c port 35, usb0_dm, usb0_dp ? ? 30 table 5.6 dc characteristics (4) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions input pull-up resistor all ports (except for port 35) r u 10 20 50 k ? v in = 0 v r01ds0261ej0110 rev.1.10 page 89 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics table 5.7 dc characteristics (5) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol typ. * 4 max. unit test conditions supply current * 1 high-speed operating mode normal operating mode no peripheral operation* 2 iclk = 54 mhz i cc 6.5 ? ma iclk = 32 mhz 4.1 ? iclk = 16 mhz 2.9 ? iclk = 8 mhz 2.2 ? iclk = 4 mhz 1.9 ? all peripheral operation: normal iclk = 54 mhz* 11 26.5 ? iclk = 32 mhz* 3 21.0 ? iclk = 16 mhz* 3 11.8 ? iclk = 8 mhz* 3 6.6 ? iclk = 4 mhz* 3 4.2 ? all peripheral operation: max. iclk = 54 mhz* 11 ? 53.3 iclk = 32 mhz* 3 ? 40.8 increase during security function operation pclkb = 32 mhz ? 2 sleep mode no peripheral operation* 2 iclk = 54 mhz 3.5 ? iclk = 32 mhz 2.4 ? iclk = 16 mhz 1.9 ? iclk = 8 mhz 1.6 ? iclk = 4 mhz 1.5 ? all peripheral operation: normal iclk = 54 mhz* 11 13.4 ? iclk = 32 mhz* 3 12.5 ? iclk = 16 mhz* 3 7.3 ? iclk = 8 mhz* 3 4.6 ? iclk = 4 mhz* 3 3.3 ? deep sleep mode no peripheral operation* 2 iclk = 54 mhz 2.3 ? iclk = 32 mhz 1.5 ? iclk = 16 mhz 1.3 ? iclk = 8 mhz 1.2 ? iclk = 4 mhz 1.1 ? all peripheral operation: normal iclk = 54 mhz* 11 10.6 ? iclk = 32 mhz* 3 9.9 ? iclk = 16 mhz* 3 5.9 ? iclk = 8 mhz* 3 3.8 ? iclk = 4 mhz* 3 2.7 ? increase during bgo operation* 5 2.5 ? middle-speed operating mode normal operating mode no peripheral operation* 6 iclk = 12 mhz i cc 2.7 ? ma iclk = 8 mhz 1.8 ? iclk = 4 mhz 1.4 ? iclk = 1 mhz 1.1 ? all peripheral operation: normal* 7 iclk = 12 mhz 9.6 ? iclk = 8 mhz 6.2 ? iclk = 4 mhz 3.8 ? iclk = 1 mhz 2.3 ? r01ds0261ej0110 rev.1.10 page 90 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. supply current values do not include the output charge/disc harge current from all pins. the values apply when internal p ull-up moss are in the off state. note 2. clock supply to the peripheral func tions is stopped. this does not include bgo oper ation. the clock source is pll. bclk, fclk, and pclk are set to divided by 64. note 3. clocks are supplied to the peripheral functions. this does not include bgo operati on. the clock source is pll. bclk, fcl k, and pclk are the same frequency as that of iclk. note 4. values when vcc is 3.3 v. note 5. this is the increase when data is programmed to or er ased from the rom or e2 dataflash during program execution. note 6. clock supply to the peripheral func tions is stopped. the clock s ource is pll when iclk is 12 mhz and hoco for other case s. bclk, fclk, and pclk are set to divided by 64. note 7. clocks are supplied to the peripheral functions. the clock source is pll when iclk is 12 mhz and hoco for other cases. bclk, fclk, and pclk are the same frequency of that of the iclk. note 8. clock supply to the peripheral func tions is stopped. the clock s ource is the sub oscillati on circuit. bclk, fclk, and pc lk are set to divided by 64. note 9. clocks are supplied to the peripheral functions. the clock source is the sub oscillation ci rcuit. bclk, fclk, and pclk a re the same frequency as that of iclk. note 10. this is the value when the mstpcra.mstpa17 (12-bit a/d converter module stop bit) is in the module stop state. note 11. clocks are supplied to the peripheral functions. this does not include bgo operati on. the clock source is pll. bclk, fc lk, and pclkb are set to divided by 2 and pclka and pclkd are the same frequency as that of iclk. supply current middle-speed operating mode normal operating mode all peripheral operation: max.* 7 iclk = 12 mhz i cc ? 16.7 ma sleep mode no peripheral operation* 6 iclk = 12 mhz 1.9 ? iclk = 8 mhz 1.2 ? iclk = 4 mhz 1.1 ? iclk = 1 mhz 1.0 ? all peripheral operation: normal* 7 iclk = 12 mhz 6.1 ? iclk = 8 mhz 4.4 ? iclk = 4 mhz 3.0 ? iclk = 1 mhz 2.0 ? deep sleep mode no peripheral operation* 6 iclk = 12 mhz 1.6 ? iclk = 8 mhz 1.0 ? iclk = 4 mhz 0.9 ? iclk = 1 mhz 0.8 ? all peripheral operation: normal* 7 iclk = 12 mhz 5.1 ? iclk = 8 mhz 3.7 ? iclk = 4 mhz 2.6 ? iclk = 1 mhz 1.8 ? increase during bgo operation* 5 2.5 ? low-speed operating mode normal operating mode no peripheral operation* 8 iclk = 32 khz i cc 5.2 ? a all peripheral operation: normal * 9, * 10 iclk = 32 khz 22.3 ? all peripheral operation: max.* 9, * 10 iclk = 32 khz ? 74.4 sleep mode no peripheral operation* 8 iclk = 32 khz 3.0 ? all peripheral operation: normal* 9 iclk = 32 khz 13.1 ? deep sleep mode no peripheral operation* 8 iclk = 32 khz 2.4 ? all peripheral operation: normal* 9 iclk = 32 khz 10.5 ? item symbol typ. * 4 max. unit test conditions r01ds0261ej0110 rev.1.10 page 91 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.1 voltage dependency in high-speed operating mode (reference data) 2.0 2.5 3.0 3.5 4.0 4.5 6.0 5.0 5.5 1.5 vcc (v) ta = 105c, iclk = 54mhz *2 ta = 105c, iclk = 32mhz *2 ta = 25c, iclk = 54mhz *1 ta = 25c, iclk = 32mhz *1 ta = 105c, iclk = 16mhz *2 ta = 105c, iclk = 8mhz *2 ta = 25c, iclk = 16mhz *1 ta = 105c, iclk = 4mhz *2 ta = 25c, iclk = 8mhz *1 ta = 25c, iclk = 4mhz *1 50 40 30 20 10 0 icc (ma) 60 ta = 105c, iclk = 54mhz *2 ta = 25c, iclk = 54mhz *1 ta = 25c, iclk = 32mhz *1 ta = 105c, iclk = 32mhz *2 ta = 25c, iclk = 16mhz *1 ta = 105c, iclk = 16mhz *2 ta = 25c, iclk = 8mhz *1 ta = 105c, iclk = 8mhz *2 ta = 25c, iclk = 4mhz *1 ta = 105c, iclk = 4mhz *2 note 1. all peripheral operations except any bgo operat ion are operating normally. indicates the average of the typical samples through actual measurement during product evaluation. note 2. all peripheral operations except any bgo operati on are operating at maximum. indicates the average of the upper-limit samples through actual measurement during product evaluation. r01ds0261ej0110 rev.1.10 page 92 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.2 voltage dependency in middle-speed operating mode (reference data) 2.0 2.5 3.0 3.5 4.0 4.5 6.0 5.0 5.5 1.5 vcc (v) ta = 105c, iclk = 12mhz *2 ta = 25c, iclk = 12mhz *1 ta = 25c, iclk = 8mhz *1 ta = 25c, iclk = 1mhz *1 ta = 25c, iclk = 4mhz *1 20 10 0 icc (ma) ta = 105c, iclk = 8mhz *2 ta = 105c, iclk = 4mhz *2 ta = 105c, iclk = 1mhz *2 ta = 105c, iclk = 12mhz *2 ta = 25c, iclk = 12mhz *1 ta = 25c, iclk = 8mhz *1 ta = 105c, iclk = 8mhz *2 ta = 25c, iclk = 4mhz *1 ta = 105c, iclk = 4mhz *2 ta = 25c, iclk = 1mhz *1 ta = 105c, iclk = 1mhz *2 note 1. all peripheral operations except any bgo operation are operating normally. indicates the average of the typical samples through actual measurement during product evaluation. note 2. all peripheral operations except any bgo operation are operating at maximum. indicates the average of the upper-limit samples through actual m easurement during product evaluation. r01ds0261ej0110 rev.1.10 page 93 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.3 voltage dependency in low-speed operating mode (reference data) 2.0 2.5 3.0 3.5 4.0 4.5 6.0 5.0 5.5 1.5 50 40 30 20 10 0 icc ( ? a) 60 70 vcc (v) ta = 105c, iclk = 32.768khz *2 ta = 25c, iclk = 32.768khz *1 ta = 105c, iclk = 32.768khz *2 ta = 25c, iclk = 32.768khz *1 note 1. all peripheral operations except any bgo operation are operating normally. indicates the average of the typical samples through actual measurement during product evaluation. note 2. all peripheral operations except any bgo operation are operating at maximum. indicates the average of the upper-limit samples through actual me asurement during product evaluation. r01ds0261ej0110 rev.1.10 page 94 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. supply current values are with all output pins unloaded and all input pull-up moss in the off state. note 2. the iwdt, lvd, and cmpb are stopped. note 3. when vcc is 3.3 v. note 4. this increment incl udes the oscill ation circuit. figure 5.4 voltage dependency in software standby mode (reference data) table 5.8 dc characteristics (6) conditions: 1.8 v vcc= vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol typ.* 3 max. unit test conditions supply current* 1 software standby mode* 2 t a = 25c i cc 0.8 3.7 a t a = 55c 1.2 4.3 t a = 85c 3.5 18.6 t a = 105c 7.9 45.2 increment for iwdt operation 0.4 ? increment for lpt operation 0.4 ? use iwdt -dedicated on-chip oscillator for clock source increment for rtc operation* 4 0.4 ? rcr3.rtcdv[2:0] set to low drive capacity 1.2 ? rcr3.rtcdv[2:0] set to normal drive capacity ta = 105c * 2 ta = 105c *1 ta = 85c *2 ta = 85c *1 ta = 55c *2 ta = 25c *2 ta = 55c *1 ta = 25c *1 ta = 105c *2 ta = 105c *1 ta = 85c *2 ta = 85c *1 ta = 55c *2 ta = 55c *1 ta = 25c *1 ta = 25c *2 2 2.5 3 3.5 4 4.5 6 5 5.5 1.5 vcc (v) 10 icc (a) 1 0.1 100 note 1. indicates the average of the typical samples through actual measurement during product evaluation . note 2. indicates the average of the upper-limit samples through actual measurement during product evaluation. r01ds0261ej0110 rev.1.10 page 95 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.5 temperature dependency in software standby mode (reference data) note 1. supply current values do not include output charge/discharge current from all pins. the values appl y when internal pull- up moss are in the off state. table 5.9 dc characteristics (7) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol typ. max. unit test conditions supply current* 1 rtc operation when vcc is off t a = 25c i cc 0.8 ? a vbatt = 2.0 v rcr3.rtcdv[2:0] set to low drive capacity t a = 55c 0.9 ? t a = 85c 1.0 ? t a = 105c 1.2 ? t a = 25c 0.9 ? vbatt = 3.3 v rcr3.rtcdv[2:0] set to low drive capacity t a = 55c 1.0 ? t a = 85c 1.1 ? t a = 105c 1.3 ? t a = 25c 1.5 ? vbatt = 2.0 v rcr3.rtcdv[2:0] set to normal drive capacity t a = 55c 1.8 ? t a = 85c 2.1 ? t a = 105c 2.4 ? t a = 25c 1.6 ? vbatt = 3.3 v rcr3.rtcdv[2:0] set to normal drive capacity t a = 55c 1.9 ? t a = 85c 2.2 ? t a = 105c 2.5 ? -40 -20 020406080 100 0.1 1 10 100 icc (a) ta (c) average value of the tested upper-limit samples during product evaluation. average value of the tested middle samples during product evaluation. r01ds0261ej0110 rev.1.10 page 96 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.6 temperature dependency of rtc operation with vcc off (reference data) note: please contact a renesas electronics sales office for info rmation on the derating of the g-version product. derating is th e systematic reduction of l oad to improve reliability. note 1. total power dissipated by the entire chip (including output currents) table 5.10 dc characteristics (8) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v item symbol min. typ. max. unit test conditions permissible total power consumption* 1 pd ? ? 350 mw d-version product permissible total power consumption* 1 pd ? ? 130 mw g-version product 10 1 0 icc (a) -40 -20 0 20 40 60 80 100 120 ta (c) low drive capacity *1 normal drive capacity *1 low drive capacity *1 normal drive capacity *1 note 1. indicates the average of the typical samples through actual measurement during product evaluation . r01ds0261ej0110 rev.1.10 page 97 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. the value of the d/a converter is the value of the power supply current including the reference current. note 2. current consumed only by the usb module. note 3. includes the current supplied from t he pull-up resistor of the usb0_dp pin to the pull-down resistor of the host device, in addition to the current consumed by this mcu during the suspended state. note 4. current consumed by the power supplies (vcc and vcc_usb). note 5. current consumed only by the comparator b module. note 6. current consumed by the power supply (vcc). note 7. when vcc = avcc0 = vcc_usb = 3.3 v. table 5.11 dc characteristics (9) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ.* 7 max. unit test conditions analog power supply current during a/d conversion (at high-speed conversion) i avcc ?0.71.7ma during a/d conversion (in low-current mode) ? 0.6 1.0 during d/a conversion (per channel)* 1 ?0.40.8 waiting for a/d and d/a conversion (all units) ? ? 0.4 a reference power supply current during a/d conversion (at high-speed conversion) i refh0 ? 25 150 a waiting for a/d conversion (all units) ? ? 60 na during d/a conversion (per channel) i refh ? 50 100 a waiting for d/a conversion (all units) ? ? 100 na lvd1, 2 per channel i lvd ?0.15? a temperature sensor* 6 ?i temp ?75? a comparator b operating current* 6 window mode i cmp * 5 ? 12.5 28.6 a comparator high-speed mode (per channel) ? 3.2 16.2 a comparator low-speed mode (per channel) ? 1.7 4.4 a ctsu operating current when sleep mode base clock frequency: 2mhz pin capacitance: 50pf i ctsu ? 150 ? a usb operating current* 4 during usb communication operation under the following settings and conditions ? host controller operation is set to full-speed mode bulk out transfer (64 bytes) 1, bulk in transfer (64 bytes) 1 ? connect peripheral devices via a 1-meter usb cable from the usb port. i usbh * 2 ?4.3 (vcc) 0.9 (vcc_usb) ?ma during usb communication operation under the following settings and conditions ? function controller operation is set to full-speed mode bulk out transfer (64 bytes) 1, bulk in transfer (64 bytes) 1 ? connect the host device via a 1-meter usb cable from the usb port. i usbf * 2 ?3.6 (vcc) 1.1 (vcc_usb) ?ma during suspended state under the following setting and conditions ? function controller operation is set to full-speed mode (pull up the usb0_dp pin) ? software standby mode ? connect the host device via a 1-meter usb cable from the usb port. i susp * 3 ?0.35 (vcc) 170 (vcc_usb) ? a table 5.12 dc characteristics (10) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions ram standby voltage v ram 1.8 ? ? v r01ds0261ej0110 rev.1.10 page 98 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. when ofs1.(faststup, lvdas) bits are 11b. note 2. when ofs1.(faststup, lvdas) bits are 01b. note 3. when ofs1.lvdas bit is 0. note 4. turn on the power supply voltage according to the normal startup rising gradient because t he settings in the ofs1 regist er are not read in boot mode. figure 5.7 ripple waveform note: the recommended capacitance is 4.7 f. variations in connected capacitor s should be within the above range. table 5.13 dc characteristics (11) conditions: 0 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions power-on vcc rising gradient at normal startup* 1 srvcc 0.02 ? 20 ms/v during fast startup time* 2 0.02 ? 2 voltage monitoring 0 reset enabled at startup* 3, * 4 0.02 ? ? table 5.14 dc characteristics (12) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c the ripple voltage must meet the allowable ripple frequency f r (vcc) within the range between the vcc upper limit and lower limit. when vcc change exceeds vcc 10%, the allowable voltage change rising/falling gradient dt/dvcc must be met. item symbol min. typ. max. unit test conditions allowable ripple frequency f r (vcc) ? ? 10 khz figure 5.7 v r (vcc) vcc 0.2 ? ? 1 mhz figure 5.7 v r (vcc) vcc 0.08 ? ? 10 mhz figure 5.7 v r (vcc) vcc 0.06 allowable voltage change rising/falling gradient dt/dvcc 1.0 ? ? ms/v when vcc change exceeds vcc 10% table 5.15 dc characteristics (13) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions permissible error of vcl pin external capacitance c vcl 1.4 4.7 7.0 f v r(vcc) vcc 1 / f r(vcc) r01ds0261ej0110 rev.1.10 page 99 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: do not exceed the permissible total supply current. table 5.16 permissible output currents (1) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +85c item symbol max. unit permissible output low current (average value per pin) ports 40 to 47, ports 03, 05, 07, port 36, 37 i ol 4.0 ma ports other than above normal output mode 4.0 high-drive output mode 8.0 permissible output low current (maximum value per pin) ports 40 to 47, ports 03, 05, 07, ports 36, 37 4.0 ports other than above normal output mode 4.0 high-drive output mode 8.0 permissible output low current total of ports 40 to 47, ports 03, 05, 07 ? i ol 40 total of ports 12 to 17, ports 20 to 27, ports 30 to 37, port pj3 40 total of ports 50 to 55, ports c0 to c7, ports b0 to b7 40 total of ports e0 to e7, ports a0 to a7, ports d0 to d4 40 total of all output pins 80 permissible output high current (average value per pin) ports 40 to 47, ports 03, 05, 07, ports 36, 37 i oh ?4.0 ports other than above normal output mode ?4.0 high-drive output mode ?8.0 permissible output high current (maximum value per pin) ports 40 to 47, ports 03, 05, 07, ports 36, 37 ?4.0 ports other than above normal output mode ?4.0 high-drive output mode ?8.0 permissible output high current total of ports 40 to 47, ports 03, 05, 07 ? i oh ?40 total of ports 12 to 17, ports 20 to 27, ports 30 to 37, port pj3 ?40 total of ports 50 to 55, ports c0 to c7, ports b0 to b7 ?40 total of ports e0 to e7, ports a0 to a7, ports d0 to d4 ?40 total of all output pins ?80 r01ds0261ej0110 rev.1.10 page 100 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: do not exceed the permissible total supply current. table 5.17 permissible output currents (2) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol max. unit permissible output low current (average value per pin) ports 40 to 47, ports 03, 05, 07, port 36, 37 i ol 4.0 ma ports other than above normal output mode 4.0 high-drive output mode 8.0 permissible output low current (maximum value per pin) ports 40 to 47, ports 03, 05, 07, ports 36, 37 4.0 ports other than above normal output mode 4.0 high-drive output mode 8.0 permissible output low current total of ports 40 to 47, ports 03, 05, 07 ? i ol 30 total of ports 12 to 17, ports 20 to 27, ports 30 to 37, port pj3 30 total of ports 50 to 55, ports c0 to c7, ports b0 to b7 30 total of ports e0 to e7, ports a0 to a7, ports d0 to d4 30 total of all output pins 60 permissible output high current (average value per pin) ports 40 to 47, ports 03, 05, 07, ports 36, 37 i oh ?4.0 ports other than above normal output mode ?4.0 high-drive output mode ?8.0 permissible output high current (maximum value per pin) ports 40 to 47, ports 03, 05, 07, ports 36, 37 ?4.0 ports other than above normal output mode ?4.0 high-drive output mode ?8.0 permissible output high current total of ports 40 to 47, ports 03, 05, 07 ? i oh ?30 total of ports 12 to 17, ports 20 to 27, ports 30 to 37, port pj3 ?30 total of ports 50 to 55, ports c0 to c7, ports b0 to b7 ?30 total of ports e0 to e7, ports a0 to a7, ports d0 to d4 ?30 total of all output pins ?60 r01ds0261ej0110 rev.1.10 page 101 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics table 5.18 output values of voltage (1) conditions: 1.8 v vcc = vcc_usb = avcc0 < 2.7 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. max. unit test conditions output low all output ports normal output mode v ol ?0.8vi ol = 0.5 ma high-drive output mode ? 0.8 i ol = 1.0 ma output high all output ports normal output mode ports 03, 05, 07, ports 40 to 47 v oh avcc0 ? 0.5 ? v i oh = ?0.5 ma ports other than above vcc ? 0.5 ? high-drive output mode vcc ? 0.5 ? i oh = ?1.0 ma table 5.19 output values of voltage (2) conditions: 2.7 v vcc = vcc_usb = avcc0 < 4.0 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. max. unit test conditions output low all output ports (except for riic) normal output mode v ol ?0.8vi ol = 1.0 ma high-drive output mode ? 0.8 i ol = 2.0 ma riic pins standard mode (normal output mode) ?0.4 i ol = 3.0 ma fast mode (high-drive output mode) ?0.6 i ol = 6.0 ma output high all output ports normal output mode ports 03, 05, 07, ports 40 to 47 v oh avcc0 ? 0.8 ? v i oh = ?1.0 ma ports other than above vcc ? 0.8 high-drive output mode vcc ? 0.8 ? i oh = ?2.0 ma table 5.20 output values of voltage (3) conditions: 4.0 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. max. unit test conditions output low all output ports (except for riic) normal output mode v ol ?0.8vi ol = 2.0 ma high-drive output mode ? 0.8 i ol = 4.0 ma riic pins standard mode(normal output mode) ?0.4 i ol = 3.0 ma fast mode (high-drive output mode) ?0.6 i ol = 6.0 ma output high all output ports normal output mode ports 03, 05, 07, ports 40 to 47 v oh avcc0 ? 0.8 ? v i oh = ?2.0 ma ports other than above vcc ? 0.8 ? high-drive output mode vcc ? 0.8 ? i oh = ?4.0 ma r01ds0261ej0110 rev.1.10 page 102 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.2.1 normal i/o pin out put characteristics (1) figure 5.8 to figure 5.12 show the characteristics when normal output is se lected by the drive cap acity control register. figure 5.8 v oh /v ol and i oh /i ol voltage characteristics at t a = 25c when normal output is selected (reference data) figure 5.9 v oh /v ol and i oh /i ol temperature characteristics at vcc = 1.8 v when normal output is selected (reference data) i oh /i ol vs v oh /v ol i oh /i ol [ma] vcc = 5.5v vcc = 3.3v vcc = 2.7v vcc = 1.8v vcc = 1.8v vcc = 2.7v vcc = 3.3v 0123456 vcc = 5.5v 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 v oh /v ol [v] v oh /v ol [v] 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 i oh /i ol [ma] 0 2 4 6 8 -2 -4 -6 -8 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol r01ds0261ej0110 rev.1.10 page 103 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.10 v oh /v ol and i oh /i ol temperature characteristics at vcc = 2.7 v when normal output is selected (reference data) figure 5.11 v oh /v ol and i oh /i ol temperature characteristics at vcc = 3.3 v when normal output is selected (reference data) v oh /v ol [v] 00 . 5 1 . 5 1 2.5 3 i oh /i ol [ma] 0 5 10 15 20 -5 -10 -15 -20 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol 2 v oh /v ol [v] 00 . 5 1 . 5 1 2.5 3 i oh /i ol [ma] 0 10 20 -10 -20 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol 2 3.5 30 -30 r01ds0261ej0110 rev.1.10 page 104 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.12 v oh /v ol and i oh /i ol temperature characteristics at vcc = 5.5 v when normal output is selected (reference data) v oh /v ol [v] 00 . 5 1 . 5 1 2.5 3 i oh /i ol [ma] 0 10 20 -10 -20 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol 2 3.5 30 -30 r01ds0261ej0110 rev.1.10 page 105 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.2.2 normal i/o pin out put characteristics (2) figure 5.13 to figure 5.17 show the characteristics when high-drive output is select ed by the drive capacity control register. figure 5.13 v oh /v ol and i oh /i ol voltage characteristics at t a = 25c when high-drive output is selected (reference data) figure 5.14 v oh /v ol and i oh /i ol temperature characteristics at vcc = 1.8 v when high-drive output is selected (reference data) 0123456 -150 -100 -50 0 50 100 150 i oh /i ol vs v oh /v ol v oh /v ol [v] i oh /i ol [ma] vcc=3.3v vcc=3.3v vcc=2.7v vcc=2.7v vcc=1.8v vcc=1.8v vcc=5.5v vcc=5.5v v oh /v ol [v] 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 i oh /i ol [ma] 0 4 8 12 16 -4 -8 -12 -16 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol r01ds0261ej0110 rev.1.10 page 106 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.15 v oh /v ol and i oh /i ol temperature characteristics at vcc = 2.7 v when high-drive output is selected (reference data) figure 5.16 v oh /v ol and i oh /i ol temperature characteristics at vcc = 3.3 v when high-drive output is selected (reference data) v oh /v ol [v] 00 . 5 11 . 5 2 2.5 3 i oh /i ol [ma] 0 10 20 30 40 -20 -30 -40 -50 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol -10 50 v oh /v ol [v] 00 . 5 11 . 5 2 2.5 3 i oh /i ol [ma] 0 20 40 -20 -40 -60 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol 60 3.5 r01ds0261ej0110 rev.1.10 page 107 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.17 v oh /v ol and i oh /i ol temperature characteristics at vcc = 5.5 v when high-drive output is selected (reference data) v oh /v ol [v] 0 4 1 5 23 i oh /i ol [ma] 0 50 100 -50 -150 ta = 105c ta = 25c ta = -40c ta = 105c ta = 25c ta = -40c i oh /i ol vs v oh /v ol 150 6 -100 r01ds0261ej0110 rev.1.10 page 108 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.2.3 normal i/o pin out put characteristics (3) figure 5.18 to figure 5.21 show the characteristics of the riic output pin. figure 5.18 v ol and i ol voltage characteristics of riic output pin at t a = 25c (reference data) figure 5.19 v ol and i ol temperature characteristics of riic outp ut pin at vcc = 2.7 v (reference data) 0123456 0 20 40 60 80 100 120 i ol vs v ol v ol [v] i ol [ma] vcc=3.3v vcc=2.7v vcc=5.5v i ol [ma] ta = 25c ta = 105c ta = -40c i ol vs v ol 0 5 10 15 20 25 30 35 40 v ol [v] 00 . 511 . 52 2.5 3 r01ds0261ej0110 rev.1.10 page 109 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.20 v ol and i ol temperature characteristics of riic outp ut pin at vcc = 3.3 v (reference data) figure 5.21 v ol and i ol temperature characteristics of riic outp ut pin at vcc = 5.5 v (reference data) i ol vs v ol i ol [ma] v ol [v] 10 20 30 50 40 0 00.511.522.533.5 ta = 25c ta = 105c ta = -40c 60 ta = 105c i ol [ma] 20 40 80 60 0 0123456 100 120 140 i ol vs v ol v ol [v] ta = -40c ta = 25c r01ds0261ej0110 rev.1.10 page 110 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.3 ac characteristics 5.3.1 clock timing note 1. the lower-limit frequency of fclk is 1 mhz during programmi ng or erasing of the flash memory. when fclk is in use at bel ow 4 mhz, the frequency can be set to 1 mhz, 2 mhz, or 3 mhz. a non-integer frequency such as 1.5 mhz cannot be set. note 2. the frequency accuracy of fclk must be within 3.5%. note 3. the vcc_usb range is 3.0 to 5.5 v when the usb clock is in use. note 4. the maximum operating frequency listed abov e does not include errors of the external oscillator and internal oscillator. for details on the range for the guaranteed oper ation, see table 5.26, clock timing. note 1. the lower-limit frequency of fclk is 1 mhz during programmi ng or erasing of the flash memory. when using fclk at below 4 mhz, the frequency can be set to 1 mhz, 2 mhz, or 3 mhz. a non-integer frequency such as 1.5 mhz cannot be set. note 2. the frequency accuracy of fclk must be within 3.5%. note 3. the vcc_usb range is 3.0 to 5.5 v when the usb clock is in use. note 4. the maximum operating frequency listed abov e does not include errors of the external oscillator and internal oscillator. for details on the range for the guaranteed oper ation, see table 5.26, clock timing. table 5.21 operating frequency value (high-speed operating mode) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol vcc unit 1.8 v vcc < 2.4 v 2.4 v vcc < 2.7 v 2.7 v vcc 5.5 v when usb is in use* 3 maximum operating frequency* 4 system clock (iclk) f max 81 65 45 4m h z flashif clock (fclk)* 1, * 2 81 63 23 2 peripheral module clock (pclka) 8 16 54 54 peripheral module clock (pclkb) 8 16 32 32 peripheral module clock (pclkd) 8 32 54 54 external bus clock (bclk) 8 16 32 32 bclk pin output 8 8 16 16 usb clock (uclk) f usb ???4 8 table 5.22 operating frequency value (middle-speed operating mode) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol vcc unit 1.8 v vcc < 2.4 v 2.4 v vcc < 2.7 v 2.7 v vcc 5.5 v when usb is in use* 3 maximum operating frequency* 4 system clock (iclk) f max 81 21 21 2m h z flashif clock (fclk)* 1, * 2 81 21 21 2 peripheral module clock (pclka) 8 12 12 12 peripheral module clock (pclkb) 8 12 12 12 peripheral module clock (pclkd) 8 12 12 12 external bus clock (bclk) 8 12 12 12 bclk pin output 8 8 12 12 usb clock (uclk) f usb ???4 8 r01ds0261ej0110 rev.1.10 page 111 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. programming and erasing t he flash memory is impossible. note 2. the a/d converter cannot be used. note 3. the maximum operating frequency list ed above does not include errors of the exte rnal oscillator. for details on the rang e for the guaranteed operation, see table 5.26, clock timing. table 5.23 operating frequency value (low-speed operating mode) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol vcc unit 1.8 v vcc < 2.4 v 2.4 v vcc < 2.7 v 2.7 v vcc 5.5 v maximum operating frequency* 3 system clock (iclk) f max 32.768 khz flashif clock (fclk)* 1 32.768 peripheral module clock (pclka) 32.768 peripheral module clock (pclkb) 32.768 peripheral module clock (pclkd)* 2 32.768 external bus clock (bclk) 32.768 bclk pin output 32.768 table 5.24 bclk clock timing (1) conditions: 2.7 v vcc= vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, fbclk 32 mhz (bclk pin output frequency 16 mhz), t a = ?40 to +105c item symbol min. typ. max. unit test conditions bclk pin output cycle time t bcyc 62.5 ? ? ns figure 5.22 bclk pin output high pulse width t ch 15 ? ? ns bclk pin output low pulse width t cl 15 ? ? ns bclk pin output rise time t cr ??12ns bclk pin output fall time t cf ??12ns table 5.25 bclk clock timing (2) conditions: 1.8 v vcc = vcc_usb = avcc0 < 2.7 v, vss = avss0 = vrefl0 = vss_usb = 0 v, fbclk 16 mhz (bclk pin output frequency 8 mhz), t a = ?40 to +105c item symbol min. typ. max. unit test conditions bclk pin output cycle time t bcyc 125 ? ? ns figure 5.22 bclk pin output high pulse width t ch 30 ? ? ns bclk pin output low pulse width t cl 30 ? ? ns bclk pin output rise time t cr ??25ns bclk pin output fall time t cf ??25ns r01ds0261ej0110 rev.1.10 page 112 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. time until the clock can be used af ter the main clock oscillator stop bit (m osccr.mostp) is set to 0 (operating). note 2. reference values when an 8-mhz resonator is used. when specifying the main clock oscillator st abilization time, set the moscwtcr register with a stabilization time value that is equal to or greater than the resonator-manufacturer-recommended value. after the mosccr.mostp bit is changed to enable the main cloc k oscillator, confirm that the oscovfsr.moovf flag has become 1, and then start using the main clock. note 3. the vcc range should be 2.4 to 5.5 v when the pll is used. note 4. reference values when a 32.768-khz resonator is used. after the setting of the sosccr.sostp bit or rcr3.rtcen bit is changed to operate the sub-clock oscillator, only start using the sub-clock after the sub-clock oscillation stabilizati on wait time that is equal to or greater than the oscillator-manufactu rer- recommended value has elapsed. note 5. the vcc range should be 3.0 to 5.5 v when the usbpll is used. note 6. the input frequency can be set to 6 or 8 mhz and the oscillation frequency can be set to 48 mhz only. note 7. only 32.768 khz can be used. table 5.26 clock timing conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions extal external clock input cycle time t xcyc 50 ? ? ns figure 5.23 extal external clock input high pulse width t xh 20 ? ? ns extal external clock input low pulse width t xl 20 ? ? ns extal external clock rise time t xr ?? 5 ns extal external clock fall time t xf ?? 5 ns extal external clock input wait time * 1 t xwt 0.5 ? ? s main clock oscill ator oscillation frequency * 2 2.4 vcc 5.5 f main 1?20mhz 1.8 vcc < 2.4 1 ? 8 main clock oscillation st abilization time (crystal) * 2 t mainosc ? 3 ? ms figure 5.24 main clock oscillation stabilization time (ceramic resonator) * 2 t mainosc ?50? s loco clock oscillation frequency f loco 3.44 4.0 4.56 mhz loco clock oscillati on stabilization time t loco ??0.5 s figure 5.25 iwdt-dedicated clock oscillation frequency f iloco 12.75 15 17.25 khz iwdt-dedicated clock oscillati on stabilization time t iloco ??50 s figure 5.26 hoco clock oscillation frequency f hoco (32 mhz) 31.52 32 32.48 mhz t a = ?40 to + 85c 31.68 32 32.32 t a = 0 to + 55c 31.36 32 32.64 t a = ?40 to +105c f hoco (54 mhz) 53.19 54 54.81 mhz t a = ?40 to + 85c 53.46 54 54.54 t a = 0 to + 55c 52.92 54 55.08 t a = ?40 to +105c hoco clock oscillati on stabilization time t hoco ??30 s figure 5.28 pll input frequency * 3 f pllin 4 ? 12.5 mhz pll circuit oscillation frequency * 3 f pll 24 ? 54 mhz pll clock oscillation stabilization time t pll ??50 s figure 5.29 pll free-running oscillation frequency f pllfr ?8?mhz usbpll input frequency * 5 f pllin ?6, 8* 6 ?mhz usbpll circuit oscillation frequency * 5 f pll ? 48* 6 ?mhz usbpll clock oscillati on stabilization time t pll ??50 s figure 5.29 sub-clock oscillator oscillation frequency * 7 f sub ? 32.768 ? khz sub-clock oscillation stabilization time * 4 t subosc ? 0.5 ? s figure 5.30 r01ds0261ej0110 rev.1.10 page 113 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.22 bclk pin output timing figure 5.23 extal external clock input timing figure 5.24 main clock oscillation start timing figure 5.25 loco clock oscillation start timing t cf t ch t bcyc t cr t cl bclk pin output test conditions: v oh = vcc 0.7, v ol = vcc 0.3, i oh = -1.0 ma, i ol = 1.0 ma, c = 30 pf t xh t xcyc extal external clock input vcc 0.5 t xl t xr t xf main clock oscillator output mosccr.mostp t mainosc loco clock oscillator output lococr.lcstp t loco r01ds0261ej0110 rev.1.10 page 114 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.26 iwdt-dedicated cl ock oscillation start timing figure 5.27 hoco clock osci llation start timing (after reset is canceled by setting ofs1.hocoen bit to 0) figure 5.28 hoco clock os cillation start timing (oscillation is started by setting hococr.hcstp bit) figure 5.29 pll clock oscillation start timing (pll is operated after main cl ock oscillation has been stabled) iwdt-dedicated cloc k oscillator output ilococr.ilcstp t iloco res# internal reset hoco clock ofs1.hocoen t reswt hoco clock hococr.hcstp t hoco pllcr2.pllen pll clock mosccr.mostp t mainosc main clock oscillator output t pll r01ds0261ej0110 rev.1.10 page 115 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.30 sub-clock oscillation start timing sub-clock oscillator output sosccr.sostp t subosc r01ds0261ej0110 rev.1.10 page 116 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.3.2 reset timing note 1. when ofs1.(lvdas, faststup) bits are 11b. note 2. when ofs1.(lvdas, faststup) bits are a value other than 11b. note 3. when iwdtcr.cks[3:0] bits are 0000b. note 4. when wdtcr.cks[3:0] bits are 0001b. figure 5.31 reset input timing at power-on figure 5.32 reset input timing (1) figure 5.33 reset input timing (2) table 5.27 reset timing conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions res# pulse width at power-on t reswp 3 ? ? ms figure 5.31 other than above t resw 30 ? ? s figure 5.32 wait time after res# cancellation (at power-on) at normal startup* 1 t reswt ? 8.5 ? ms figure 5.31 during fast startup time* 2 t reswt ? 560 ? s wait time after res# cancellation (during powered-on state) t reswt ? 120 ? s figure 5.32 independent watchdog timer reset period t reswiw ? 1 ? iwdt clock cycle figure 5.33 watchdog timer reset period t reswww ? 4 ? pclkb cycle software reset period t reswsw ? 1 ? iclk cycle wait time after independent watchdog timer reset cancellation* 3 t reswt2 ? 300 ? s wait time after watchdog timer reset cancellation* 4 t reswt2 ? 300 ? s wait time after software reset cancellation t reswt2 ? 170 ? s vcc res# t reswp internal reset t reswt res# internal reset t reswt t resw independent watchdog timer reset watchdog timer reset software reset internal reset t reswt2 t reswiw , t reswww , t reswsw r01ds0261ej0110 rev.1.10 page 117 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.3.3 timing of recovery from low power consumption modes note 1. the recovery time varies depending on the state of each os cillator when the wait instruction is executed. when multiple oscillators are operating, the recovery time varies depending on t he operating state of the oscillators that are not selected a s the system clock source. the above table applies when only the corresponding clock is operating. note 2. when the frequency of the crystal is 20 mhz. when the main clock oscillator wait contro l register (moscwtcr) is set to 04h. note 3. when the frequency of the external clock is 20 mhz. when the main clock oscillator wait contro l register (moscwtcr) is set to 00h. note 1. the recovery time varies depending on the state of each os cillator when the wait instruction is executed. when multiple oscillators are operating, the recovery time varies depending on t he operating state of the oscillators that are not selected a s the system clock source. the above table applies when only the corresponding clock is operating. note 2. when the frequency of the crystal is 12 mhz. when the main clock oscillator wait contro l register (moscwtcr) is set to 04h. note 3. when the frequency of pll is 12 mhz. when the main clock oscillator wait contro l register (moscwtcr) is set to 04h. note 4. when the frequency of the external clock is 12 mhz. when the main clock oscillator wait contro l register (moscwtcr) is set to 00h. note 5. when the frequency of pll is 12 mhz. when the main clock oscillator wait contro l register (moscwtcr) is set to 00h. note 6. this is the case when hoco is selected as the system clock and its frequency division is set to be 8 mhz. table 5.28 timing of recovery from low power consumption modes (1) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions recovery time from software standby mode* 1 high-speed mode crystal connected to main clock oscillator main clock oscillator operating* 2 t sbymc ? 2 3 ms figure 5.34 external clock input to main clock oscillator main clock oscillator operating* 3 t sbyex ?3550 s sub-clock oscillator operating t sbysc ? 650 800 s hoco clock oscillator operating t sbyho ?4055 s loco clock oscillator operating t sbylo ?4055 s table 5.29 timing of recovery from low power consumption modes (2) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions recovery time from software standby mode* 1 middle-speed mode crystal connected to main clock oscillator main clock oscillator operating* 2 t sbymc ? 2 3 ms figure 5.34 main clock oscillator and pll circuit operating* 3 t sbypc ?2 3ms external clock input to main clock oscillator main clock oscillator operating* 4 t sbyex ?3 4 s main clock oscillator and pll circuit operating* 5 t sbype ?6585 s sub-clock oscillator operating t sbysc ? 600 750 s hoco clock oscillator operating* 6 t sbyho ?4050 s loco clock oscillator operating t sbylo ?5 7 s r01ds0261ej0110 rev.1.10 page 118 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. the sub-clock conti nues oscillating in software standby mode during low-speed mode. figure 5.34 software standby mode recovery timing note 1. oscillators continue oscillating in deep sleep mode. note 2. when the frequency of the system clock is 32 mhz. note 3. when the frequency of the system clock is 12 mhz. note 4. when the frequency of the system clock is 32 khz. table 5.30 timing of recovery from low power consumption modes (3) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions recovery time from software standby mode* 1 low-speed mode sub-clock oscillator operating t sbysc ? 600 750 s figure 5.34 table 5.31 timing of recovery from low power consumption modes (4) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions recovery time from deep sleep mode* 1 high-speed mode* 2 t dslp ?23.5 s figure 5.35 middle-speed mode* 3 t dslp ?3 4 s low-speed mode* 4 t dslp ? 400 500 s oscillator iclk irq software standby mode t sbymc, t sbypc, t sbyex, t sbype, t sbysc, t sbyho, t sbylo r01ds0261ej0110 rev.1.10 page 119 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.35 deep sleep mode recovery timing note: values when the frequencies of pclka, pclkb, pclkd, fclk, and bclk are not divided. table 5.32 operating mode transition time conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c mode before transition mode after transition iclk frequency transition time unit min. typ. max. high-speed operating mode middle-speed operating modes 8 mhz ? 10 ? s middle-speed operating modes high-speed operating mode 8 mhz ? 37.5 ? s low-speed operating mode middle-speed operating mode, high-speed operating mode 32.768 khz ? 215 ? s middle-speed operating mode, high-speed operating mode low-speed operating mode 32.768 khz ? 185 ? s oscillator iclk irq deep sleep mode t dslp r01ds0261ej0110 rev.1.10 page 120 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.3.4 control signal timing note: 200 ns minimum in software standby mode. note 1. t pcyc indicates the cycle of pclkb. note 2. t nmick indicates the cycle of the nmi digital filter sampling clock. note 3. t irqck indicates the cycle of th e irqi digital filter samp ling clock (i = 0 to 7). figure 5.36 nmi interrupt input timing figure 5.37 irq interrupt input timing table 5.33 control signal timing conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions nmi pulse width t nmiw 200 ? ? ns nmi digital filter is disabled (nmiflte.nflten = 0) t pcyc 2 200 ns t pcyc 2* 1 ?? t pcyc 2 > 200 ns 200 ? ? nmi digital filter is enabled (nmiflte.nflten = 1) t nmick 3 200 ns t nmick 3.5* 2 ?? t nmick 3 > 200 ns irq pulse width t irqw 200 ? ? ns irq digital filter is disabled (irqflte0.flteni = 0) t pcyc 2 200 ns t pcyc 2* 1 ?? t pcyc 2 > 200 ns 200 ? ? irq digital filter is enabled (irqflte0.flteni = 1) t irqck 3 200 ns t irqck 3.5* 3 ?? t irqck 3 > 200 ns nmi t nmiw irq t irqw r01ds0261ej0110 rev.1.10 page 121 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.3.5 bus timing table 5.34 bus timing (1) conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, fbclk 32 mhz (bclk pin output frequency 16 mhz), t a = ?40 to +105c, v oh = vcc 0.5, v ol = vcc 0.5, i oh = ?1.0 ma, i ol = 1.0 ma, c l = 30 pf, when normal output is selected by the drive capac ity control register item symbol min. max. unit test conditions address delay time t ad ? 55 ns figure 5.38 to figure 5.41 byte control delay time t bcd ?5 5n s cs# delay time t csd ?5 5n s rd# delay time t rsd ?5 5n s read data setup time t rds 40 ? ns read data hold time t rdh 0?n s wr# delay time t wrd ?5 5n s write data delay time t wdd ?5 5n s write data hold time t wdh 0?n s wait# setup time t wts 40 ? ns figure 5.42 wait# hold time t wth 0?n s table 5.35 bus timing (2) conditions: 1.8 v vcc = vcc_usb = avcc0 < 2.7 v, vss = avss0 = vss_usb = 0 v, fbclk 16 mhz (bclk pin output frequency 8 mhz), t a = ?40 to +105c, v oh = vcc 0.5, v ol = vcc 0.5, i oh = ?1.0 ma, i ol = 1.0 ma, c l = 30 pf, when normal output is selected by the drive capac ity control register item symbol min. max. unit test conditions address delay time t ad ? 90 ns figure 5.38 to figure 5.41 byte control delay time t bcd ?9 0n s cs# delay time t csd ?9 0n s rd# delay time t rsd ?9 0n s read data setup time t rds 60 ? ns read data hold time t rdh 0?n s wr# delay time t wrd ?9 0n s write data delay time t wdd ?9 0n s write data hold time t wdh 0?n s wait# setup time t wts 60 ? ns figure 5.42 wait# hold time t wth 0?n s r01ds0261ej0110 rev.1.10 page 122 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.38 external bus timing/normal read cycle (bus clock synchronization) a23 to a1 cs3# to cs0# t ad bclk a23 to a0 d15 to d0 (read) byte-write strobe mode 1-write strobe mode bc1#, bc0# common to byte-write strobe mode and 1-write strobe mode t bcd t csd rd# (read) t rsd t rsd t ad t rdh t rds t ad t ad t w1 t w2 t end t n1 t n2 rdon:1 csrwait:2 csroff:2 cson:0 t bcd t csd r01ds0261ej0110 rev.1.10 page 123 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.39 external bus timing/normal write cycle (bus clock synchronization) a23 to a1 cs3# to cs0# t ad bclk a23 to a0 byte-write strobe mode 1-write strobe mode bc1#, bc0# common to byte-write strobe mode and 1-write strobe mode t bcd t csd t ad t ad t ad d15 to d0 (write) wr1#, wr0#, wr# (write) t wrd t wrd t wdh t wdd t w1 t w2 t end t n1 t n2 wron:1 wdon:1 *1 cswwait:2 wdoff:1 *1 cson:0 t bcd t csd cswoff:2 note 1. be sure to specify wdon and wdoff as at least one cycle of bclk. r01ds0261ej0110 rev.1.10 page 124 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.40 external bus timing/page read cycle (bus clock synchronization) figure 5.41 external bus timing/page wr ite cycle (bus clock synchronization) a23 to a1 cs3# to cs0# t ad bclk a23 to a0 d15 to d0 (read) byte-write strobe mode 1-write strobe mode bc1#, bc0# common to byte-write strobe mode and 1-write strobe mode t bcd t csd rd# (read) t rsd t rsd t rdh t rds t ad t w1 t w2 t end t pw1 t pw2 t ad t ad t rsd t rsd t rdh t rds t rsd t rsd t rdh t rds t end t pw1 t pw2 t end t n1 t h t ad t ad t ad t ad rdon:1 csrwait:2 csroff:1 t rsd t rsd t rdh t rds t ad t ad csprwait:2 t pw1 t pw2 t end rdon:1 csprwait:2 rdon:1 csprwait:2 rdon:1 cson:0 t bcd t csd a23 to a1 cs3# to cs0# t ad bclk a23 to a0 byte-write strobe mode 1-write strobe mode bc1#, bc0# common to byte-write strobe mode and 1-write strobe mode t bcd t csd t ad t w1 d15 to d0 (write) wr1#, wr0#, wr# (write) t wrd t wrd t wdh t wdd t w2 t end t pw1 t pw2 t ad t ad t wrd t wrd t wdh t wdd t wrd t wrd t wdh t wdd t dw1 t end t pw1 t pw2 t end t n1 t h t dw1 t ad t ad t ad t ad wron:1 wdon:1 *1 cswwait:2 cspwwait:2 wdoff:1 *1 cspwwait:2 wdoff:1 *1 cswoff:1 wdoff:1 *1 cson:0 wron:1 wdon:1 *1 wron:1 wdon:1 *1 t bcd t csd note 1. be sure to specify wdon and wdoff as at least one cycle of bclk. r01ds0261ej0110 rev.1.10 page 125 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.42 external bus timing/external wait control t wts t wth t wts t wth csrwait:3 cswwait:3 bclk a23 to a0 cs3# to cs0# rd# (read) wr# (write) wait# t w1 t w2 (t end )t end t w3 t n1 t h external wait r01ds0261ej0110 rev.1.10 page 126 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics table 5.36 bus timing (multiplex bus) (1) conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, fbclk 32 mhz (bclk pin output frequency 16 mhz), t a = ?40 to +105c, v oh = vcc 0.5, v ol = vcc 0.5, i oh = ?1.0 ma, i ol = 1.0 ma, c l = 30 pf, when normal output is selected by the drive capac ity control register item symbol min. max. unit test conditions address delay time t ad ? 55 ns figure 5.43, figure 5.44 byte control delay time t bcd ?5 5n s cs# delay time t csd ?5 5n s rd# delay time t rsd ?5 5n s ale delay time t aled ?5 5n s read data setup time t rds 40 ? ns read data hold time t rdh 0?n s wr# delay time t wrd ?5 5n s write data delay time t wdd ?5 5n s write data hold time t wdh 0?n s wait# setup time t wts 40 ? ns figure 5.42 wait# hold time t wth 0?n s table 5.37 bus timing (multiplex bus) (2) conditions: 1.8 v vcc = vcc_usb = avcc0 < 5.5 v, vss = avss0 = vss_usb = 0 v, fbclk 16 mhz (bclk pin output frequency 8 mhz), t a = ?40 to +105c, v oh = vcc 0.5, v ol = vcc 0.5, i oh = ?1.0 ma, i ol = 1.0 ma, c l = 30 pf, when normal output is selected by the drive capac ity control register item symbol min. max. unit test conditions address delay time t ad ? 90 ns figure 5.43, figure 5.44 byte control delay time t bcd ?9 0n s cs# delay time t csd ?9 0n s rd# delay time t rsd ?9 0n s ale delay time t aled ?9 0n s read data setup time t rds 60 ? ns read data hold time t rdh 0?n s wr# delay time t wrd ?9 0n s write data delay time t wdd ?9 0n s write data hold time t wdh 0?n s wait# setup time t wts 60 ? ns figure 5.42 wait# hold time t wth 0?n s r01ds0261ej0110 rev.1.10 page 127 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.43 external bus timing/read access operation example (multiplex) figure 5.44 external bus timing/write access operat ion example (multiplex) address/ data bus data read (rd#) t ad bclk address address latch (ale) chip select (cs3# to cs0#) t w1 t wn t ad t ad t su(db-rd) 40ns(min) t end address cycle data cycle t aled t csd t csd t n1 t h fixed to 1 cycle wait for address cycle (await) t rsd t rss t rsd t rss cs extended cycle when reading (csroff) t aled wait for rd assertion (rdon) wait for normal read cycle (csrwait) wait for cs assertion (cson) a d t rdh t rds t d(ad-ale) t h(ale-ad) t h(rd-db) 0ns(min) address/ data bus data write (wr#) t ad bclk address address latch (ale) chip select (cs3# to cs0#) t w1 t ad t ad t end address cycle data cycle t csd t csd t n1 t h fixed to 1 cycle t d(bclk-ale)= t aled wait for address cycle (await) t rsd t rss t rsd t rss wait for wr assertion (wron) wait for normal write cycle (cswwait) a d wait for write data output (wdon) t h(bclk-ale)= t aled a cs extended cycle when writing (cswoff) r01ds0261ej0110 rev.1.10 page 128 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.3.6 timing of on-chi p peripheral modules note 1. t pcyc : pclk cycle note 2. t cac : cac count clock source cycle note 3. when the loco is selected as the clock output source (the ckocr.ckosel[2:0] bits are 000b), set the clock output divisio n ratio selection to divided by 2 (the ckocr.ckodiv[2:0] bits are 001b). note 4. when the extal external clock input or an oscillator is used with divided by 1 (the ckocr.ckosel[2:0] bits are 010b and the ckocr.ckodiv[2:0] bits are 000b) to output from clkout, the above should be satisfied with an input duty cycle of 45 to 55%. table 5.38 timing of on-chip peripheral modules (1) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. max. unit *1 test conditions i/o ports input data pulse width t prw 1.5 ? t pcyc figure 5.45 mtu2/tpu input capture input pulse width single-edge setting t ticw 1.5 ? t pcyc figure 5.46 both-edge setting 2.5 ? timer clock pulse width single-edge setting t tckwh, t tckwl 1.5 ? t pcyc figure 5.47 both-edge setting 2.5 ? phase counting mode 2.5 ? poe2 poe# input pulse width t poew 1.5 ? t pcyc figure 5.48 tmr timer clock pulse width single-edge setting t tmcwh , t tmcwl 1.5 ? t pcyc figure 5.49 both-edge setting 2.5 ? sci input clock cycle time asynchronous t scyc 4?t pcyc figure 5.50 clock synchronous 6 ? input clock pulse width t sckw 0.4 0.6 t scyc input clock rise time t sckr ?20ns input clock fall time t sckf ?20ns output clock cycle time asynchronous t scyc 16 ? t pcyc figure 5.51 clock synchronous 4 ? output clock pulse width t sckw 0.4 0.6 t scyc output clock rise time t sckr ?20ns output clock fall time t sckf ?20ns transmit data delay time (master) clock synchronous t txd ?40ns transmit data delay time (slave) clock synchronous 2.7 v or above ? 65 ns 1.8 v or above ? 100 ns receive data setup time (master) clock synchronous 2.7 v or above t rxs 65 ? ns 1.8 v or above 90 ? ns receive data setup time (slave) clock synchronous 40 ? ns receive data hold time clock synchronous t rxh 40 ? ns a/d converter trigger input pulse width t trgw 1.5 ? t pcyc figure 5.52 cac cacref input pulse width t pcyc t cac *2 t cacref 4.5 t cac + 3 t pcyc ?ns t pcyc > t cac *2 5 t cac + 6.5 t pcyc clkout clkout pin output cycle *4 vcc = 2.7 v or above t ccyc 62.5 ? ns figure 5.53 vcc = 1.8 v or above 125 clkout pin high pulse width *3 vcc = 2.7 v or above t ch 15 ? ns vcc = 1.8 v or above 30 clkout pin low pulse width *3 vcc = 2.7 v or above t cl 15 ? ns vcc = 1.8 v or above 30 clkout pin output rise time vcc = 2.7 v or above t cr ?12ns vcc = 1.8 v or above 25 clkout pin output fall time vcc = 2.7 v or above t cf ?12ns vcc = 1.8 v or above 25 r01ds0261ej0110 rev.1.10 page 129 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. t pcyc : pclk cycle note 2. n: an integer from 1 to 8 that can be set by the rspi clock delay register (spckd) note 3. n: an integer from 1 to 8 that can be set by the rspi slave select negation delay register (sslnd) table 5.39 timing of on-chip peripheral modules (2) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c, c = 30 pf, when high-drive output is selected by the drive capacity control register item symbol min. max. unit test conditions rspi rspck clock cycle master t spcyc 2 4096 t pcyc * 1 figure 5.54 slave 8 4096 rspck clock high pulse width master t spckwh (t spcyc ? t spckr ? t spckf )/2 ? 3 ?ns slave (t spcyc ? t spckr ? t spckf )/2 ? rspck clock low pulse width master t spckwl (t spcyc ? t spckr ? t spckf )/2 ? 3 ?ns slave (t spcyc ? t spckr ? t spckf )/2 ? rspck clock rise/fall time output 2.7 v or above t spckr, t spckf ?1 0n s 1.8 v or above ? 15 input ? 1 s data input setup time master 2.7 v or above t su 10 ? ns figure 5.55 to figure 5.58 1.8 v or above 30 ? slave 25 ? t pcyc ? data input hold time master rspck set to a division ratio other than pclkb divided by 2 t h t pcyc ?ns rspck set to pclkb divided by 2 t hf 0? slave t h 20 + 2 t pcyc ? ssl setup time master t lead ?30 + n* 2 t spcyc ?ns slave 2 ? t pcyc ssl hold time master t lag ?30 + n* 3 t spcyc ?ns slave 2 ? t pcyc data output delay time master 2.7 v or above t od ?1 4n s 1.8 v or above ? 30 slave 2.7 v or above ? 3 t pcyc + 65 1.8 v or above ? 3 t pcyc +105 data output hold time master t oh 0?n s slave 0 ? successive transmission delay time master t td t spcyc + 2 t pcyc 8 t spcyc + 2 t pcyc ns slave 4 t pcyc ? mosi and miso rise/fall time output 2.7 v or above t dr, t df ?1 0n s 1.8 v or above ? 15 input ? 1 s ssl rise/fall time output 2.7 v or above t sslr, t sslf ?1 0n s 1.8 v or above ? 15 ns input ? 1 s slave access time 2.7 v or above t sa ?6t pcyc figure 5.57, figure 5.58 1.8 v or above ? 7 slave output release time 2.7 v or above t rel ?5t pcyc 1.8 v or above ? 6 r01ds0261ej0110 rev.1.10 page 130 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note 1. t pcyc : pclk cycle table 5.40 timing of on-chip peripheral modules (3) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. max. unit* 1 test conditions simple spi sck clock cycle output (master) t spcyc 4 65536 t pcyc figure 5.54 sck clock cycle input (slave) 6 65536 t pcyc sck clock high pulse width t spckwh 0.4 0.6 t spcyc sck clock low pulse width t spckwl 0.4 0.6 t spcyc sck clock rise/fall time t spckr, t spckf ?20ns data input setup time (master) 2.7 v or above t su 65 ? ns figure 5.55, figure 5.56 1.8 v or above 95 ? data input setup time (slave) 40 ? data input hold time t h 40 ? ns ssl input setup time t lead 3?t spcyc ssl input hold time t lag 3?t spcyc data output delay time (master) t od ?40ns data output delay time (slave) 2.7 v or above ? 65 1.8 v or above ? 100 data output hold time (master) 2.7 v or above t oh ?10 ? ns 1.8 v or above ?20 ? data output hold time (slave) ?10 ? data rise/fall time t dr , t df ?20ns ssl input rise/fall time t sslr , t sslf ?20ns slave access time t sa ?6t pcyc figure 5.57, figure 5.58 slave output release time t rel ?6t pcyc r01ds0261ej0110 rev.1.10 page 131 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: t iiccyc : riic internal reference clock (iic ) cycle note 1. the value in parentheses is used when the icmr3.nf[1:0] bits are set to 11b while a digital filter is enabled with the i cfer.nfe bit = 1. note 2. c b is the total capacitance of the bus lines. table 5.41 timing of on-chip peripheral modules (4) conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, fpclkb 32 mhz, t a = ?40 to +105c item symbol min.* 1, * 2 max. unit test conditions riic (standard mode, smbus) scl cycle time t scl 6 (12) t iiccyc + 1300 ? ns figure 5.59 scl high pulse width t sclh 3 (6) t iiccyc + 300 ? ns scl low pulse width t scll 3 (6) t iiccyc + 300 ? ns scl, sda rise time t sr ? 1000 ns scl, sda fall time t sf ? 300 ns scl, sda spike pulse removal time t sp 01 ( 4 ) t iiccyc ns sda bus free time t buf 3 (6) t iiccyc + 300 ? ns start condition hold time t stah t iiccyc + 300 ? ns repeated start condition setup time t stas 1000 ? ns stop condition setup time t stos 1000 ? ns data setup time t sdas t iiccyc + 50 ? ns data hold time t sdah 0?n s scl, sda capacitive load c b ? 400 pf riic (fast mode) scl cycle time t scl 6 (12) t iiccyc + 600 ? ns figure 5.59 scl high pulse width t sclh 3 (6) t iiccyc + 300 ? ns scl low pulse width t scll 3 (6) t iiccyc + 300 ? ns scl, sda rise time t sr ? 300 ns scl, sda fall time t sf ? 300 ns scl, sda spike pulse removal time t sp 01 ( 4 ) t iiccyc ns sda bus free time t buf 3 (6) t iiccyc + 300 ? ns start condition hold time t stah t iiccyc + 300 ? ns repeated start condition setup time t stas 300 ? ns stop condition setup time t stos 300 ? ns data setup time t sdas t iiccyc + 50 ? ns data hold time t sdah 0?n s scl, sda capacitive load c b ? 400 pf r01ds0261ej0110 rev.1.10 page 132 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: t pcyc : pclk cycle note 1. c b is the total capacitance of the bus lines. table 5.42 timing of on-chip peripheral modules (5) conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, fpclkb 32 mhz, t a = ?40 to +105c item symbol min.* 1 max. unit test conditions simple i 2 c (standard mode) sda rise time t sr ? 1000 ns figure 5.59 sda fall time t sf ? 300 ns sda spike pulse removal time t sp 04 t pcyc ns data setup time t sdas 250 ? ns data hold time t sdah 0?n s scl, sda capacitive load c b ? 400 pf simple i 2 c (fast mode) sda rise time t sr ? 300 ns figure 5.59 sda fall time t sf ? 300 ns sda spike pulse removal time t sp 04 t pcyc ns data setup time t sdas 100 ? ns data hold time t sdah 0?n s scl, sda capacitive load c b ? 400 pf table 5.43 timing of on-chip peripheral modules (6) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, fpclkb 32 mhz, t a = ?40 to +105c item symbol min. max. unit test conditions ssi audio_mclk input frequency 2.7 v or above t audio 12 5m h z 1.8 v or above 1 4 output clock cycle t o 250 ? ns figure 5.60 input clock cycle t i 250 ? ns clock high level t hc 0.4 0.6 to, ti clock low level t lc 0.4 0.6 to, ti clock rise time t rc ?2 0n s data delay time 2.7 v or above t dtr ? 65 ns figure 5.61 figure 5.62 1.8 v or above ? 105 setup time 2.7 v or above t sr 65 ? ns 1.8 v or above 90 ? hold time t htr 40 ? ns ws changing edge ssidata output delay t dtrw ? 105 ns figure 5.63 r01ds0261ej0110 rev.1.10 page 133 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.45 i/o port input timing figure 5.46 mtu2 input/output timing figure 5.47 mtu2 clock input timing figure 5.48 poe# input timing port pclk t prw output compare output input capture input pclk t ticw mtclka to mtclkd pclk t tckwl t tckwh poen# input pclk t poew r01ds0261ej0110 rev.1.10 page 134 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.49 tmr clock input timing figure 5.50 sck clock input timing figure 5.51 sci input/output timing: clock synchronous mode pclk tmci0 to tmci3 t tmcwl t tmcwh t sckw t sckr t sckf t scyc sckn n = 0, 1, 5, 6, 8, 9, 12 t txd t rxs t rxh txdn rxdn sckn n = 0, 1, 5, 6, 8, 9, 12 r01ds0261ej0110 rev.1.10 page 135 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.52 a/d converter external trigger input timing figure 5.53 clkout output timing figure 5.54 rspi clock timing and simple spi clock timing adtrg0# pclk t trgw t cf t ch t ccyc t cr t cl clkout pin output test conditions: v oh = vcc 0.7, v ol = vcc 0.3, i oh = -1.0 ma, i ol = 1.0 ma, c = 30 pf t spckwh v oh v oh v ol v ol v oh v oh t spckwl t spckr t spckf v ol t spcyc t spckwh v ih v ih v il v il v ih v ih t spckwl t spckr t spckf v il t spcyc v oh = 0.7 vcc, v ol = 0.3 vcc, v ih = 0.7 vcc, v il = 0.3 vcc n = 0, 1, 5, 6, 8, 9, 12 sckn master select output sckn slave select input rspcka master select output rspcka slave select input simple spi rspi r01ds0261ej0110 rev.1.10 page 136 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.55 rspi timing (master, cpha = 0) and simple spi clock timing (master, ckph = 1) figure 5.56 rspi timing (master, cpha = 1) and simple spi clock timing (master, ckph = 0) t dr, t df t su t h t lead t td t lag t sslr, t sslf t oh t od msb in data lsb in msb in msb out data lsb out idle msb out sckn ckpol = 0 output sckn ckpol = 1 output smison input smosin output n = 0, 1, 5, 6, 8, 9, 12 simple spi rspi ssla0 to ssla3 output rspcka cpol = 0 output rspcka cpol = 1 output misoa input mosia output ssla0 to ssla3 output rspcka cpol = 0 output rspcka cpol = 1 output misoa input mosia output rspi simple spi sckn ckpol = 1 output sckn ckpol = 0 output smison input smosin output t dr, t df t su t h t lead t td t lag t sslr, t sslf t oh msb in data lsb in msb in msb out data lsb out idle msb out t od n = 0, 1, 5, 6, 8, 9, 12 r01ds0261ej0110 rev.1.10 page 137 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.57 rspi timing (sl ave, cpha = 0) and simple spi clock timing (slave, ckph = 1) figure 5.58 rspi timing (sl ave, cpha = 1) and simple spi clock timing (slave, ckph = 0) t dr, t df t su t h t lead t td t lag t sa msb in data lsb in msb in msb out data lsb out msb in msb out t oh t od t rel sckn ckpol = 0 input sckn ckpol = 1 input smison output smosin input n = 0, 1, 5, 6, 8, 9, 12 simple spi rspi ssla0 input rspcka cpol = 0 input rspcka cpol = 1 input misoa output mosia input ssn# input t dr, t df t sa t oh t lead t td t lag t h lsb out (last data) data msb out msb in data lsb in msb in lsb out t su t od t rel msb out sckn ckpol = 1 input sckn ckpol = 0 input smison output smosin input n = 0, 1, 5, 6, 8, 9, 12 simple spi rspi ssla0 input rspcka cpol = 0 input rspcka cpol = 1 input misoa output mosia input ssn# input r01ds0261ej0110 rev.1.10 page 138 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.59 riic bus interface input/output timing and simple i 2 c bus interface input/output timing figure 5.60 ssi clock input/output timing figure 5.61 ssi transmission/re ception timing (ssicr.sckp=0) test conditions v ih = vcc 0.7, v il = vcc 0.3 sda scl v ih v il t stah t sclh t scll p *1 s *1 t sf t sr t scl t sdah t sdas t stas t sp t stos p *1 t buf sr *1 note 1. s, p, and sr indicate the following conditions, respectively. s: start condition p: stop condition sr: repeated start condition ssisckn t hc t lc t rc t i , t o t sr t htr t dtr ssisckn (input or output) ssiwsn, ssidatan, ssirxdn (input) ssiwsn, ssidatan, ssitxdn (output) r01ds0261ej0110 rev.1.10 page 139 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.62 ssi transmission/re ception timing (ssicr.sckp=1) figure 5.63 ssidata ou tput delay after ssiwsn changing edge t sr t htr t dtr ssisckn (input or output) ssiwsn, ssidatan, ssirxdn (input) ssiwsn, ssidatan, ssitxdn (output) t dtrw ssiwsn (input) ssidatan (output) note. timing to output the msb bit during slave transmission from ssiwsn when del = 1 and sdta = 0 or del = 1, sdta = 1, and swl[2:0] = dwl[2:0] r01ds0261ej0110 rev.1.10 page 140 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.4 usb characteristics figure 5.64 usb0_dp and usb0_dm output timing table 5.44 usb characteristics (usb0_d p and usb0_dm pin characteristics) conditions: 3.0 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. max. unit test conditions input characteristics input high level voltage v ih 2.0 ? v input low level voltage v il ?0 . 8v differential input sensitivity v di 0.2 ? v | usb0_dp ? usb0_dm | differential common mode range v cm 0.8 2.5 v output characteristics output high level voltage v oh 2.8 vcc_usb v i oh = ?200 a output low level voltage v ol 0.0 0.3 v i ol = 2 ma cross-over voltage v crs 1.3 2.0 v figure 5.64, figure 5.65 rise time fs t r 42 0n s ls 75 300 fall time fs t f 42 0n s ls 75 300 rise/fall time ratio fs t r /t f 90 111.11 % t r /t f ls 80 125 output resistance z drv 28 44 ? (adjusting the resistance by external elements is not necessary.) vbus characteristics vbus input voltage v ih vcc 0.8 ? v v il ?v c c 0 . 2v pull-up, pull-down pull-down resistor r pd 14.25 24.80 k ? pull-up resistor r pui 0.9 1.575 k ? during idle state r pua 1.425 3.09 k ? during reception battery charging specification ver 1.2 d+ sink current i dp_sink 25 175 a d- sink current i dm_sink 25 175 a dcd source current i dp_src 71 3 a data detection voltage v dat_ref 0.25 0.4 v d+ source current v dp_src 0.5 0.7 v output current = 250 a d- source current v dm_src 0.5 0.7 v output current = 250 a usb0_dp, usb0_dm t f t r 90% 10% 10% 90% v crs r01ds0261ej0110 rev.1.10 page 141 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.65 test circuit observation point 50 pf 50 pf usb0_dp usb0_dm full-speed (fs) observation point 1.5 k ? 200 pf to 600 pf usb0_dp usb0_dm 200 pf to 600 pf 3.6 v observation point low-speed (ls) r01ds0261ej0110 rev.1.10 page 142 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.5 a/d conversion characteristics figure 5.66 vrefh0 voltage range vs. avcc0 note: the characteristics apply when no pin functions other than a/d converter input are used. absolute accuracy includes quantization errors. offset error, full-scale error, dnl differe ntial non-linearity error, and inl integral non-linearity error do not include quantization errors. note 1. the conversion time is the sum of the sampling time and th e comparison time. as the test conditions, the number of sampl ing states is indicated. table 5.45 a/d conversion characteristics (1) conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, 2.7 v vrefh0 avcc0, reference voltage = vrefh0 selected, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item min. typ. max. unit test conditions frequency 1 ? 54 mhz resolution ? ? 12 bit conversion time* 1 (operation at pclkd = 54 mhz) permissible signal source impedance (max.) = 0.3 k ? 0.83 ? ? s high-precision channel the adcsr.adhsc bit is 0 the adsstrn register is 0dh 1.33 ? ? normal-precision channel the adcsr.adhsc bit is 0 the adsstrn register is 28h analog input capacitance cs ? ? 15 pf pin capacitance included figure 5.67 analog input resistance rs ? ? 2.5 k ? figure 5.67 analog input voltage range ain 0 ? vrefh0 v offset error ? 0.5 4.5 lsb high-precision channel 6.0 lsb other than above full-scale error ? 0.75 4.5 lsb high-precision channel 6.0 lsb other than above quantization error ? 0.5 ? lsb absolute accuracy ? 1.25 5.0 lsb high-precision channel 8.0 lsb other than above dnl differential non-linearity error ? 1.0 ? lsb inl integral non-linearity error ? 1.0 3.0 lsb vrefh0 5.0 4.0 3.0 2.0 1.0 1.0 2.0 3.0 4.0 5.0 a/d conversion characteristics (1) a/d conversion characteristics (2) adcsr.adhsc = 0 5.5 2.7 2.4 2.4 2.7 5.5 avcc0 vrefh0 5.0 4.0 3.0 2.0 1.0 1.0 2.0 3.0 4.0 5.0 a/d conversion characteristics (3) a/d conversion characteristics (4) adcsr.adhsc = 1 5.5 2.7 2.4 2.4 2.7 5.5 avcc0 a/d conversion characteristics (5) 1.8 1.8 r01ds0261ej0110 rev.1.10 page 143 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: the characteristics apply when no pin functions other than a/d converter input are used. absolute accuracy includes quantization errors. offset error, full-scale error, dnl differe ntial non-linearity error, and inl integral non-linearity error do not include quantization errors. note 1. the conversion time is the sum of the sampling time and th e comparison time. as the test conditions, the number of sampl ing states is indicated. table 5.46 a/d conversion characteristics (2) conditions: 2.4 v vcc = vcc_usb = avcc0 5.5 v, 2.4 v vrefh0 avcc0, reference voltage = vrefh0 selected, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item min. typ. max. unit test conditions frequency 1 ? 32 mhz resolution ? ? 12 bit conversion time* 1 (operation at pclkd = 32 mhz) permissible signal source impedance (max.) = 1.3 k ? 1.41 ? ? s high-precision channel the adcsr.adhsc bit is 0 the adsstrn register is 0dh 2.25 ? ? normal-precision channel the adcsr.adhsc bit is 0 the adsstrn register is 28h analog input capacitance cs ? ? 15 pf pin capacitance included figure 5.67 analog input resistance rs ? ? 2.5 k ? figure 5.67 offset error ? 0.5 4.5 lsb full-scale error ? 0.75 4.5 lsb quantization error ? 0.5 ? lsb absolute accuracy ? 1.25 5.0 lsb high-precision channel 8.0 lsb other than above dnl differential non-linearity error ? 1.0 ? lsb inl integral non-linearity error ? 1.0 4.5 lsb r01ds0261ej0110 rev.1.10 page 144 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: the characteristics apply when no pin functions other than a/d converter input are used. absolute accuracy includes quantization errors. offset error, full-scale error, dnl differe ntial non-linearity error, and inl integral non-linearity error do not include quantization errors. note 1. the conversion time is the sum of the sampling time and th e comparison time. as the test conditions, the number of sampl ing states is indicated. table 5.47 a/d conversion characteristics (3) conditions: 2.7v vcc = vcc_usb = avcc0 5.5v, 2.7v vrefh0 avcc0, reference voltage = vrefh0 selected, vss = avss0 = vrefl0 = vss_usb = 0v, ta = ?40 to +105c item min. typ. max. unit test conditions frequency 1 ? 27 mhz resolution ? ? 12 bit conversion time* 1 (operation at pclkd = 27 mhz) permissible signal source impedance (max.) = 1.1 k ? 2?? s high-precision channel the adcsr.adhsc bit is 1 the adsstrn.sst[7:0] bits are 0dh 3 ? ? normal-precision channel the adcsr.adhsc bit is 1 the adsstrn.sst[7:0] bits are 28h analog input capacitance cs ? ? 15 pf pin capacitance included figure 5.67 analog input resistance rs ? ? 2.5 k ? figure 5.67 offset error ? 0.5 4.5 lsb full-scale error ? 0.75 4.5 lsb quantization error ? 0.5 ? lsb absolute accuracy ? 1.25 5.0 lsb high-precision channel 8.0 lsb other than above dnl differential non-linearity error ? 1.0 ? lsb inl integral non-linearity error ? 1.0 3.0 lsb r01ds0261ej0110 rev.1.10 page 145 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: the characteristics apply when no pin functions other than a/d converter input are used. absolute accuracy includes quantization errors. offset error, full-scale error, dnl differe ntial non-linearity error, and inl integral non-linearity error do not include quantization errors. note 1. the conversion time is the sum of the sampling time and th e comparison time. as the test conditions, the number of sampl ing states is indicated. table 5.48 a/d conversion characteristics (4) conditions: 2.4v vcc = vcc_usb = avcc0 5.5v, 2.4v vrefh0 avcc0, vss = avss0 = vss_usb = 0v, reference voltage = vrefh0 selected, ta = ?40 to +105c item min. typ. max. unit test conditions frequency 1 ? 16 mhz resolution ? ? 12 bit conversion time* 1 (operation at pclkd = 16 mhz) permissible signal source impedance (max.) = 2.2 k ? 3.38 ? ? s high-precision channel the adcsr.adhsc bit is 1 the adsstrn register is 0dh 5.06 ? ? normal-precision channel the adcsr.adhsc bit is 1 the adsstrn register is 28h analog input capacitance cs ? ? 15 pf pin capacitance included figure 5.67 analog input resistance rs ? ? 2.5 k ? figure 5.67 offset error ? 0.5 4.5 lsb full-scale error ? 0.75 4.5 lsb quantization error ? 0.5 ? lsb absolute accuracy ? 1.25 5.0 lsb high-precision channel 8.0 lsb other than above dnl differential non-linearity error ? 1.0 ? lsb inl integral non-linearity error ? 1.0 3.0 lsb r01ds0261ej0110 rev.1.10 page 146 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: the characteristics apply when no pin functions other than a/d converter input are used. absolute accuracy includes quantization errors. offset error, full-scale error, dnl differe ntial non-linearity error, and inl integral non-linearity error do not include quantization errors. note 1. the conversion time is the sum of the sampling time and th e comparison time. as the test conditions, the number of sampl ing states is indicated. figure 5.67 equivalent circuit table 5.49 a/d conversion characteristics (5) conditions: 1.8v vcc = vcc_usb = avcc0 5.5v, 1.8v vrefh0 avcc0, vss = avss0 = vss_usb = 0v, reference voltage = vrefh0 selected, ta = ?40 to +105c item min. typ. max. unit test conditions frequency 1 ? 8 mhz resolution ? ? 12 bit conversion time* 1 (operation at pclkd = 8 mhz) permissible signal source impedance (max.) = 5 k ? 6.75 ? ? s high-precision channel the adcsr.adhsc bit is 1 the adsstrn register is 0dh 10.13 ? ? normal-precision channel the adcsr.adhsc bit is 1 the adsstrn register is 28h analog input capacitance cs ? ? 15 pf pin capacitance included figure 5.67 analog input resistance rs ? ? 2.5 k ? figure 5.67 offset error ? 1 7.5 lsb full-scale error ? 1.5 7.5 lsb quantization error ? 0.5 ? lsb absolute accuracy ? 3.0 8.0 lsb dnl differential non-linearity error ? 1.0 ? lsb inl integral non-linearity error ? 1.25 3.0 lsb table 5.50 a/d converter channel classification classification channel conditions remarks high-precision channel an000 to an007 avcc0 = 1.8 to 5.5 v pins an000 to an007 cannot be used as digital outputs when the a/d converter is in use. normal-precision channel an016 to an031 internal reference voltage input channel internal reference voltage avcc0 = 2.0 to 5.5 v temperature sensor input channel temperature sensor output avcc0 = 2.0 to 5.5 v 12b - adc cs rs r0 mcu r01ds0261ej0110 rev.1.10 page 147 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.68 illustration of a/d converter characteristic terms absolute accuracy absolute accuracy is the difference betw een output code based on the theoretical a/d conversion char acteristics and the actual a/d conversion result. when measur ing absolute accuracy, the voltage at th e midpoint of the width of analog input voltage (1-lsb width), that can m eet the expectation of outp utting an equal code based on the theoretical a/d conversion characteristics, is us ed as an analog input voltage. for example, if 12-bit resolution is used and if reference voltage (vrefh0 = 3.072 v), then 1-lsb width becomes 0.75 mv, and 0 mv, 0.75 mv, 1.5 mv, ... are used as analog input voltages. if analog input voltage is 6 mv, absolute accuracy = 5 lsb means that the actual a/d conversion result is in the range of 003h to 00dh, although an output code, 008h, can be exp ected from the theoretical a/ d conversion characteristics. integral non-linearity error (inl) the integral non-linearity error is the maximum deviation betw een the ideal line when the m easured offset and full-scale errors are zeroed, and the actual output code. integral nonlinearity error (inl) actual a/d conversion characteristic ideal a/d conversion characteristic analog input voltage offset error absolute accuracy differential nonlinearity error (dnl) full-scale error fffh 000h 0 ideal line of actual a/d conversion characteristic 1-lsb width for ideal a/d conversion characteristic differential nonlinear ity error (dnl) 1-lsb width for ideal a/d conversion characteristic vrefh0 (full-scale) a/d converter output code r01ds0261ej0110 rev.1.10 page 148 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics differential non-lin earity error (dnl) the differential non-linearity error is the difference between 1-lsb width based on the ideal a/d conversion characteristics and the widt h of the actual output code. offset error an offset error is the difference between a transition point of the ideal first output code and the actual first output code. full-scale error a full-scale error is the difference between a transition point of the id eal last output code and the actual last output code. r01ds0261ej0110 rev.1.10 page 149 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.6 d/a conversion characteristics table 5.51 d/a conversion characteristics (1) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c reference voltage = vrefh or vrefl selected item min. typ. max. unit test conditions resolution ? ? 12 bit resistive load 30 ? ? k ? capacitive load ? ? 50 pf output voltage range 0.35 ? avcc0 - 0.47 v dnl differential non-linearity error ? 0.5 1.0 lsb inl integral non-linearity error ? 2.0 8.0 lsb offset error ? ? 20 mv full-scale error ? ? 20 mv output resistance ? 5 ? ? conversion time ? ? 30 s table 5.52 d/a conversion characteristics (2) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl = vss_usb = 0 v, t a = ?40 to +105c reference voltage = av cc0 or avss0 selected item min. typ. max. unit test conditions resolution ? ? 12 bit resistive load 30 ? ? k ? capacitive load ? ? 50 pf output voltage range 0.35 ? avcc0 - 0.47 v dnl differential non-linearity error ? 0.5 2.0 lsb inl integral non-linearity error ? 2.0 8.0 lsb offset error ? ? 30 mv full-scale error ? ? 30 mv output resistance ? 5 ? ? conversion time ? ? 30 s table 5.53 d/a conversion characteristics (3) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c reference voltage = internal reference voltage selected item min. typ. max. unit test conditions resolution ? ? 12 bit internal reference voltage (vbgr) 1.36 1.43 1.50 v resistive load 30 ? ? k ? capacitive load ? ? 50 pf output voltage range 0.35 ? vbgr v dnl differential non-linearity error ? 2.0 16.0 lsb inl integral non-linearity error ? 8.0 16.0 lsb offset error ? ? 30 mv output resistance ? 5 ? ? conversion time ? ? 30 s r01ds0261ej0110 rev.1.10 page 150 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.69 illustration of d/a converter characteristic terms integral non-linearity error (inl) the integral non-linearity error is the maximum deviation betw een the ideal line when the m easured offset and full-scale errors are zeroed, and the actual output code. differential non-lin earity error (dnl) the differential non-linearity error is the difference between 1-lsb width based on the ideal d/a conversion characteristics and the width of the actually output code. offset error an offset error is the difference between a transition point of the ideal first output code and the actual first output code. full-scale error a full-scale error is the difference between a transition point of the id eal last output code and the actual last output code. 000h d/a converter input code fffh output analog voltage upper output limit lower output limit offset error ideal output voltage 1-lsb width for ideal d/a conversion characteristic differential nonlinearity error (dnl) actual d/a conversion characteristic *1 integral nonlinearity error (inl) full-scale error gain error offset error ideal output voltage note 1. ideal d/a conversion output voltage that is adj usted so that offset and full scale errors are zeroed. r01ds0261ej0110 rev.1.10 page 151 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.7 temperature sensor characteristics 5.8 comparator characteristics table 5.54 temperature sensor characteristics conditions: 2.0 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions relative accuracy DD 1.5 D c 2.4 v or above D 2.0 D below 2.4 v temperature slope DD ?3.65 D mv/c output voltage (25c) DD 1.05 D v vcc = 3.3 v temperature sensor start time t start DD 5 s sampling time D 5 DD s table 5.55 comparator characteristics conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions cvrefb0 to cvrefb3 input reference voltage vref 0 ? vcc - 1.4 v cmpb0 to cmpb3 input voltage vi ?0.3 ? vcc + 0.3 v offset comparator high-speed mode ?? ? 50 mv comparator high-speed mode window function enabled ?? ? 60 mv comparator low-speed mode ?? ? 40 mv comparator output delay time comparator high-speed mode td ? ? 1.2 s vcc = 3 v, input slew rate 50 mv/us comparator high-speed mode window function enabled tdw ? ? 2.0 s comparator low-speed mode td ? ? 5.0 s high-side reference voltage (comparator high-speed mode, window function enabled) vrfh ? 0.76 vcc ? v low-side reference voltage (comparator high-speed mode, window function enabled) vrfl ? 0.24 vcc ? v operation stabilization wait time tcmp 100 ? ? s r01ds0261ej0110 rev.1.10 page 152 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.70 comparator output delay time in comparator high-speed mode and low-speed mode figure 5.71 comparator output delay time in high-speed mode with window function enabled cmpb cmpob td td cvrefb = 0 v cmpb cmpob tdw tdw internal vrh = vcc * 0.76 cmpb cmpob tdw tdw internal vrh = vcc * 0.24 r01ds0261ej0110 rev.1.10 page 153 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.9 ctsu characteristics 5.10 characteristics of power-on rese t circuit and voltage detection circuit note: these characteristics apply when noise is not superimposed on the power supply. when a setting is made so that the voltage detection level overlaps with that of the voltage detection circ uit (lvd2), it cannot be specified which of lvd1 and lvd2 is us ed for voltage detection. note 1. n in the symbol vdet0_n denotes the value of the ofs1.vdsel[1:0] bits. note 2. n in the symbol vdet1_n denotes the value of the lvdlvlr.lvd1lvl[3:0] bits. note 3. n in the symbol vdet2_n denotes the value of the lvdlvlr.lvd2lvl[1:0] bits. table 5.56 ctsu characteristics conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions external capacitance connected to tscap pin c tscap 91011nf ts pin capacitive load c base ??50pf permissible output high current ? i oh ?? ? 24 ma when the mutual capacitance method is applied table 5.57 characteristics of power-on rese t circuit and voltage detection circuit (1) conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions voltage detection level power-on reset (por) v por 1.35 1.50 1.65 v figure 5.72, figure 5.73 voltage detection circuit (lvd0)* 1 v det0_0 3.67 3.84 3.97 v figure 5.74 at falling edge vcc v det0_1 2.70 2.82 3.00 v det0_2 2.37 2.51 2.67 v det0_3 1.80 1.90 1.99 voltage detection circuit (lvd1)* 2 v det1_0 4.12 4.29 4.42 v figure 5.75 at falling edge vcc v det1_1 3.98 4.14 4.28 v det1_2 3.86 4.02 4.16 v det1_3 3.68 3.84 3.98 v det1_4 2.99 3.10 3.29 v det1_5 2.89 3.00 3.19 v det1_6 2.79 2.90 3.09 v det1_7 2.68 2.79 2.98 v det1_8 2.57 2.68 2.87 v det1_9 2.47 2.58 2.67 v det1_a 2.37 2.48 2.57 v det1_b 2.10 2.20 2.30 v det1_c 1.86 1.96 2.06 v det1_d 1.80 1.86 1.96 voltage detection circuit (lvd2)* 3 v det2_0 4.08 4.29 4.48 v figure 5.76 at falling edge vcc v det2_1 3.95 4.14 4.35 v det2_2 3.82 4.02 4.22 v det2_3 3.62 3.84 4.02 r01ds0261ej0110 rev.1.10 page 154 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: these characteristics apply when noise is not superimposed on the power supply. when a setting is made so that the voltage detection level overlaps with that of the voltage detection circ uit (lvd1), it cannot be specified which of lvd1 and lvd2 is us ed for voltage detection. note 1. when ofs1.(lvdas, faststup) = 11b. note 2. when ofs1.(lvdas, faststup) 11b. note 3. the minimum vcc down time indicates the time when v cc is below the minimum value of voltage detection levels v por , v det0 , v det1 , and v det2 for the por/lvd. table 5.58 characteristics of power-on rese t circuit and voltage detection circuit (2) conditions: 1.8 v vcc0 = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions wait time after power-on reset cancellation at normal startup* 1 t por D 9.1 D ms figure 5.73 during fast startup time* 2 t por D 1.6 D wait time after voltage monitoring 0 reset cancellation power-on voltage monitoring 0 reset disabled* 1 t lvd0 D 568 D s figure 5.74 power-on voltage monitoring 0 reset enabled* 2 D 100 D wait time after voltage monitoring 1 reset cancellation t lvd1 D 100 D s figure 5.75 wait time after voltage monitoring 2 reset cancellation t lvd2 D 100 D s figure 5.76 response delay time t det DD 350 s figure 5.72 minimum vcc down time* 3 t voff 350 DD s figure 5.72, vcc = 1.0 v or above power-on reset enable time t w(por) 1 DD ms figure 5.73, vcc = below 1.0 v lvd operation stabilization time (after lvd is enabled) td (e-a) DD 300 s figure 5.75, figure 5.76 hysteresis width (power-on rest (por)) v porh D 110 D mv hysteresis width (voltage detection circuit: lvd1 and lvd2) v lvh D 70 D mv when vdet1_0 to vdet1_4 is selected D 60 D when vdet1_5 to vdet1_9 is selected D 50 D when vdet1_a or vdet1_b is selected D 40 D when vdet1_c or vdet1_d is selected D 60 D when lvd2 is selected r01ds0261ej0110 rev.1.10 page 155 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.72 voltage detection reset timing figure 5.73 power-on reset timing figure 5.74 voltage detection circuit timing (vdet0) internal reset signal (active-low) vcc t voff t por t det v por t det 1.0v v porh internal reset signal (active-low) vcc t por v por 1.0 v t w(por) *1 t det note 1. t w(por) is the time required for a power-on reset to be enabled while the external power vcc is being held below the valid voltage (1.0 v). when turning the vcc on, maintain a voltage below 1.0v for at least 1.0ms. v porh t voff v det0 vcc t det t det internal reset signal (active-low) v lvh t lvd0 r01ds0261ej0110 rev.1.10 page 156 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.75 voltage detection circuit timing (v det1 ) figure 5.76 voltage detection circuit timing (v det2 ) t voff v det1 vcc t det t det t lvd1 t d(e-a) lvd1e lvd1 comparator output lvd1cmpe lvd1mon internal reset signal (active-low) when lvd1rn = l when lvd1rn = h v lvh t lvd1 t voff v det2 vcc t det t det t lvd2 t d(e-a) lvd2e lvd2 comparator output lvd2cmpe lvd2mon internal reset signal (active-low) when lvd2rn = l when lvd2rn = h v lvh t lvd2 r01ds0261ej0110 rev.1.10 page 157 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.11 oscillation stop detection timing figure 5.77 oscillation stop detection timing table 5.59 oscillation stop detection timing conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions detection time t dr ? ? 1 ms figure 5.77 t dr main clock ostdsr.ostdf low-speed clock ic lk t dr main clock ostdsr.ostdf ic lk when the main clock is selected when the pll clock is selected pll clock low-speed clock r01ds0261ej0110 rev.1.10 page 158 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.12 battery backup function characteristics note: the vcc-off period for starting power supply switching indicate s the period in which vcc is below the minimum value of the voltage level for switching to battery backup (v detbatt ). figure 5.78 battery backup function characteristics table 5.60 battery backup function characteristics conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, 1.8 v vbatt 5.5 v, vss = avss0 = vrefl0 = vss_usb = 0 v, t a = ?40 to +105c item symbol min. typ. max. unit test conditions voltage level for switching to battery backup (falling) v detbatt 1.99 2.09 2.19 v figure 5.78 hysteresis width v vbatth ?100?mv vcc-off period for starting power supply switching t voffbatt ? ? 350 s allowable voltage change rising/falli ng gradient dt/dvcc 1.0 ? ? ms/v figure 5.7 level for detection of voltage drop on the vbatt pin (falling) vbtlvdlvl[1:0] = 10b v detbatlvd 2.11 2.20 2.29 v figure 5.78 vbtlvdlvl[1:0] = 11b 1.87 2.00 2.13 v hysteresis width for detection of voltage drop on the vbatt pin v batlvdh ?50?mv vcc vbatt backup power supply area vcc supplied vcc supplied vbatt supplied v detbatt vcc voltage guaranteed range vbatt voltage guaranteed range t voffbatt vcc cannot be raised v vbatth v detbatlvd v batlvdh r01ds0261ej0110 rev.1.10 page 159 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.13 rom (flash memory for code storage) characteristics note 1. definition of reprogram/erase cycle: the reprogram/erase cycle is the number of erasing for each block. when the reprogr am/ erase cycle is n times (n = 1000), erasing can be performed n times for each block. for instance, when 4-byte programming is performed 256 times for different addresses in a 1-kbyte block and th en the entire block is erased, the reprogram/erase cycle i s counted as one. however, programming the same address for se veral times as one erasing is not enabled (overwriting is prohibited). note 2. characteristic when using the flash memory programmer and the self-programming library provided from renesas electronics . note 3. this result is obtained from reliability testing. note: the time until each operation of the flash memory is start ed after instructions are executed by software is not included. note: the lower-limit frequency of fclk is 1 mhz during programmi ng or erasing of the flash memory. when using fclk at below 4 mhz, the frequency can be set to 1 mhz, 2 mhz, or 3 mhz. a non-integer frequency such as 1.5 mhz cannot be set. note: the frequency accuracy of fclk must be within 3.5%. table 5.61 rom (flash memory for code storage) characteristics (1) item symbol min. typ. max. unit conditions reprogramming/erasure cycle* 1 n pec 1000 ? ? times data hold time after 1000 times of n pec t drp 20* 2, * 3 ? ? year t a = +85c table 5.62 rom (flash memory for code storage) characteristics (2) high-speed operating mode conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v temperature range for the progr amming/erasure operation: t a = ?40 to +105c item symbol fclk = 1 mhz fclk = 32 mhz unit min. typ. max. min. typ. max. programming time 8-byte t p8 ? 112 967 ? 52.3 491 s erasure time 2-kbyte t e2k ? 8.75 278 ? 5.50 215 ms 512-kbyte (when block erase command is used) t e512k ? 928 19218 ? 72.0 1679 ms 512-kbyte (when all- block erase command is used) t ea512k ? 923 19013 ? 66.7 1469 ms blank check time 8-byte t bc8 ? ? 55.0 ? ? 16.1 s 2-kbyte t bc2k ? ? 1840 ? ? 136 ms erase operation forced stop time t sed ? ? 18.0 ? ? 10.7 s start-up area switching setting time t sas ? 12.3 566.5 ? 6.2 434 ms access window time t aws ? 12.3 566.5 ? 6.2 434 ms rom mode transition wait time 1 t dis 2.0 ? ? 2.0 ? ? s rom mode transition wait time 2 t ms 5.0 ? ? 5.0 ? ? s r01ds0261ej0110 rev.1.10 page 160 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics note: the time until each operation of the flash memory is start ed after instructions are executed by software is not included. note: the lower-limit frequency of fclk is 1 mhz during programmi ng or erasing of the flash memory. when using fclk at below 4 mhz, the frequency can be set to 1 mhz, 2 mhz, or 3 mhz. a non-integer frequency such as 1.5 mhz cannot be set. note: the frequency accuracy of fclk must be within 3.5%. table 5.63 rom (flash memory for code storage) characteristics (3) middle-speed operating mode conditions: 1.8 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v temperature range for the progr amming/erasure operation: t a = ?40 to +85c item symbol fclk = 1 mhz fclk = 8 mhz unit min. typ. max. min. typ. max. programming time 8-byte t p8 ? 152 1367 ? 97.9 936 s erasure time 2-kbyte t e2k ? 8.8 279.7 ? 5.9 221 ms 512-kbyte (when block erase command is used) t e512k ? 928 19221 ? 191 4108 ms 512-kbyte (when all- block erase command is used) t ea512k ? 923 19015 ? 185 3901 ms blank check time 8-byte t bc8 ? ? 85.0 ? ? 50.88 s 2-kbyte t bc2k ? ? 1870 ? ? 402 s erase operation forced stop time t sed ? ? 28.0 ? ? 21.3 s start-up area switching setting time t sas ? 13.0 573.3 ? 7.7 451 ms access window time t aws ? 13.0 573.3 ? 7.7 451 ms rom mode transition wait time 1 t dis 2.0 ? ? 2.0 ? ? s rom mode transition wait time 2 t ms 3.0 ? ? 3.0 ? ? s r01ds0261ej0110 rev.1.10 page 161 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.14 e2 dataflash characteristics (flash memory for data storage) note 1. the reprogram/erase cycle is the number of erasing for each block. when the reprogram/erase cycle is n times (n = 100000 ), erasing can be performed n times for each block. for instance, when 1-byte programming is performed 1000 times for different addresses in a 1-kbyte block and then the entire block is eras ed, the reprogram/erase cycle is counted as one. however, programming the same address for several times as one erasing is not enabled (overwriting is prohibited). note 2. characteristic when the flash memory programmer is used and the self-programming libr ary is provided from renesas electronics. note 3. these results are obtai ned from reliability testing. note: the time until each operation of the flash memory is start ed after instructions are executed by software is not included. note: the lower-limit frequency of fclk is 1 mhz during programmi ng or erasing of the flash memory. when using fclk at below 4 mhz, the frequency can be set to 1 mhz, 2 mhz, or 3 mhz. a non-integer frequency such as 1.5 mhz cannot be set. note: the frequency accuracy of fclk must be within 3.5%. note: the time until each operation of the flash memory is start ed after instructions are executed by software is not included. note: the lower-limit frequency of fclk is 1 mhz during programmi ng or erasing of the flash memory. when using fclk at below 4 mhz, the frequency can be set to 1 mhz, 2 mhz, or 3 mhz. a non-integer frequency such as 1.5 mhz cannot be set. note: the frequency accuracy of fclk must be within 3.5%. table 5.64 e2 dataflash characteristics (1) item symbol min. typ. max. unit conditions reprogramming/erasure cycle* 1 n dpec 100000 1000000 ? times data hold time after 10000 times of n dpec t ddrp 20* 2, * 3 ? ? year t a = +85c after 100000 times of n dpec 5* 2, * 3 ? ? year after 1000000 times of n dpec ?1* 2, * 3 ? year t a = +25c table 5.65 e2 dataflash characteristics (2) : high-speed operating mode conditions: 2.7 v vcc = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v temperature range for the progr amming/erasure operation: t a = ?40 to +105c item symbol fclk = 1 mhz fclk = 32 mhz unit min. typ. max. min. typ. max. programming time 1 byte t dp1 ? 95.0 797 ? 40.8 376 s erasure time 1 kbyte t de1k ? 19.5 498 ? 6.2 230 ms 8 kbyte t de8k ? 119.8 2556 ? 12.9 368 ms blank check time 1 byte t dbc1 ? ? 55.00 ? ? 16.1 s 1 kbyte t dbc1k ? ? 0.72 ? ? 0.50 ms erase operation forced stop time t dsed ? ? 16.0 ? ? 10.7 s dataflash stop recovery time t dstop 5.0 ? ? 5.0 ? ? s table 5.66 e2 dataflash characteristics (3) : middle-speed operating mode conditions: 1.8 v vcc0 = vcc_usb = avcc0 5.5 v, vss = avss0 = vss_usb = 0 v temperature range for the progr amming/erasure operation: t a = ?40 to +85c item symbol fclk = 1 mhz fclk = 8 mhz unit min. typ. max. min. typ. max. programming time 1 byte t dp1 ? 135 1197 ? 86.5 823 s erasure time 1 kbyte t de1k ? 19.6 501 ? 8.0 265 ms 8 kbyte t de8k ? 120 2558 27.7 669 ms blank check time 1 byte t dbc1 ? ? 85.0 ? ? 50.9 s 1 kbyte t dbc1k ? ? 0.72 ? ? 1.45 ms erase operation forced stop time t dsed ? ? 28.0 ? ? 21.3 s dataflash stop recovery time t dstop 0.72 ? ? 0.72 ? ? s r01ds0261ej0110 rev.1.10 page 162 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics 5.15 usage notes 5.15.1 connecting vcl capacitor and bypass capacitors this mcu integrates an internal voltage-down circuit, which is used for lowering the power supply voltage in the internal mcu automatically to the optimum level. a 4.7- f capacitor needs to be connected between this internal voltage-down power supply (vcl pin) and the vss pin. figure 5.79 to figure 5.81 shows how to connect external capacitors. place an external capacitor close to the pins. do not apply the power supp ly voltage to the vcl pin. insert a multilayer ceramic capacitor as a bypass capacitor between each pair of the power supply pins. implement a bypass capacitor as closer to the mcu power supply pins as possible. use a recommended value of 0.1 f as the capacitance of the capacitors. for the capacito rs related to crystal oscillation, see section 9, clock generation circuit in the user?s manual: hardware . for the capacitors related to analog modules, also see section 43, 12-bit a/d converter (s12ade) in the user?s manual: hardware . for notes on designing the printed circuit board, see the descriptions of the application note, the hardware design guide (r01an1411ej). the latest version can be down loaded from the renesas electronics website. r01ds0261ej0110 rev.1.10 page 163 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.79 connecting capacitors (100 pins) note: do not apply the power supply voltage to the vcl pin . use a 4.7-f multilayer ceramic capacitor fo r the vcl pin and place it close to the pin . a recommended value is shown for the capacitance of the bypass capacitors . external capacitor for power supply stabilization 4.7 f bypass capacitor 0.1 f bypass capacitor 0.1 f bypass capacitor 0.1 f 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 avcc0 avss0 vss_usb *1 vcc_usb *1 vss vcc vcl vss vcc rx230 group, rx231 group plqp0100kb-b (100-pin lqfp) (top view) bypass capacitor 0.1 f note 1. as the products of the rx230 group do not have vcc_ usb or vss_usb, a bypass capacitor is not required. r01ds0261ej0110 rev.1.10 page 164 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.80 connecting capacitors (64 pins) note: do not apply the power supply voltage to the vcl pin . use a 4.7-f multilayer ceramic capacitor fo r the vcl pin and place it close to the pin . a recommended value is shown for the capacitance of the bypass capacitors . external capacitor for power supply stabilization 4.7 f bypass capacitor 0.1 f bypass capacitor 0.1 f bypass capacitor 0.1 f 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 54 55 51 49 50 52 53 56 57 58 59 60 61 63 64 62 rx230 group, rx231 group plqp0064kb-c (64-pin lqfp) (top view) avcc0 avss0 vss vcc vss_usb *1 vcc_usb *1 vcl vss vcc bypass capacitor 0.1 f note 1. as the products of the rx230 group do not have vc c_usb or vss_usb, a bypass capacitor is not required. r01ds0261ej0110 rev.1.10 page 165 of 177 oct 30, 2015 rx230 group, rx231 group 5. electrical characteristics figure 5.81 connecting capacitors (48 pins) 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 1 2 3 4 5 6 7 8 9 10 11 12 38 39 37 40 41 42 43 44 45 47 48 46 rx230 group, rx231 group PLQP0048KB-B (48-pin lqfp) (top view) avcc0 avss0 vss vcc vss_usb *1 vcc_usb *1 vss vcc 18 17 16 15 14 13 note: do not apply the power supply voltage to the vcl pin . use a 4.7-f multilayer ceramic capacitor for the vcl pin and place it close to the pin . a recommended value is shown for the capacitance of the bypass capacitors . bypass capacitor 0.1 f external capacitor for power supply stabilization 4.7 f bypass capacitor 0.1 f bypass capacitor 0.1 f bypass capacitor 0.1 f vcl note 1. as the products of the rx230 group do not have vcc_usb or vss_usb, a bypass capacitor is not required. r01ds0261ej0110 rev.1.10 page 166 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions appendix 1. package dimensions information on the latest version of the package dimensions or mountings has been displayed in ?packages? on renesas electronics corporation website. figure a 100 -pin tflga (ptlg0100ka-a) e e a b c d e f g h j k 12345678910 b a s ys index mark index mark (laser mark) x4 v a ws b ws d e z d z e a sab m sab m b 1 b 0.15 1.05 0.08 0.08 reference symbol dimension in millimeters min nom max d e v z d b 1 b 5.5 5.5 0.5 0.5 a 0.5 e w x y z e 0.20 0.250.21 0.29 0.340.29 0.39 p-tflga100-5.5x5.5-0.50 0.1g mass[typ.] 100f0m ptlg0100ka-a renesas code jeita package code previous code r01ds0261ej0110 rev.1.10 page 167 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions figure b 100 -pin lqfp (plqp0100kb-b) r01ds0261ej0110 rev.1.10 page 168 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions figure c 64 -pin wflga (pwlg0064ka-a) 64-pin plastic flga (5x5) e w 5.00 o 0.10 0.20 y 0.20 0.08 y1 zd 0.75 0.05 x d 5.00 o 0.10 a 0.69 o 0.07 b 0.25 o 0.04 p64fc-50-an5 ze 0.75 s b s w s y y1 e 0.50 index mark w sa zd ze a b s a b e xs 8 7 6 5 4 3 2 1 bcdefgh a c d c d detail detail e detail m 60x a b item dimensions (unit:mm) 3.90 3.90 b 0.34 o0.03 0.55 0.70 o0.03 0.55 o0.04 0.70 o0.03 0.55 o0.04 0.75 0.75 0.55 0.55 r0.17 o 0.015 r0.17 o0.015 r0.125 o 0.02 r0.125 o0.02 r0.275 o0.02 r0.35 o0.015 0.75 0.55 o0.04 0.70 o0.03 0.55 0.75 0.55 o0.04 0.70 o0.03 (land pad) (aperture of solder resist) e e d r01ds0261ej0110 rev.1.10 page 169 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions figure d 64 -pin hwqfn (pwqn0064kc-a) s y e lp sx ba b m a d e 48 32 33 16 17 1 64 a s b a d e 49 detail of a part exposed die pad jeita package code renesas code previous code mass(typ.)[g] p-hwqfn64-9x9-0.50 pwqn0064kc-a p64k8-50-6b4-5 0.21 16 1 17 32 49 64 index area 2 2 d a lp 0.20 7.50 0.40 9.00 9.00 7.50 reference symbol min nom max dimension in millimeters 0.30 0.30 0.50 b 0.18 x a 0.80 y 0.05 0.00 0.25 e z z c d e 1 d e 2 2 2 e 0.50 0.05 0.75 0.75 0.15 0.25 a 1 c 2 9.05 8.95 9.05 8.95 z z d e 33 48 r01ds0261ej0110 rev.1.10 page 170 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions figure e 64 -pin lqfp (plqp0064kb-c) r01ds0261ej0110 rev.1.10 page 171 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions figure f 48 -pin hwqfn (pwqn0048kb-a) s y e lp sx ba b m a d e 36 24 25 12 13 1 48 a s b a d e 37 detail of a part exposed die pad jeita package code renesas code previous code mass(typ.)[g] p-hwqfn48-7x7-0.50 pwqn0048kb-a 48pjn-a 0.13 12 1 13 24 37 48 index area 2 2 d a lp 0.20 5.50 0.40 7.00 7.00 5.50 reference symbol min nom max dimension in millimeters 0.30 0.30 0.50 b 0.18 x a 0.80 y 0.05 0.00 0.25 e z z c d e 1 d e 2 2 2 e 0.50 0.05 0.75 0.75 0.15 0.25 a 1 c 2 7.05 6.95 7.05 6.95 z z d e 25 36 p48k8-50-5b4-7 r01ds0261ej0110 rev.1.10 page 172 of 177 oct 30, 2015 rx230 group, rx231 group appendix 1. package dimensions figure g 48 -pin lqfp (PLQP0048KB-B) r01ds0261ej0110 rev.1.10 page 173 of 177 oct 30, 2015 rx230 group, rx231 group revision history classifications - items with technical update document number: changes according to the corresponding i ssued technical update - items without technical update documen t number: minor changes that do not re quire technical update to be issued revision history rx230 group, rx231 group datasheet rev. date description classification page summary 1.00 jun 24, 2015 ? first edition, issued 1.10 oct 30, 2015 1. overview 3 table 1.1 outline of specifications (2/4), changed 5 table 1.1 outline of specifications (4/4): sd host interface (sdhia) added 6 table 1.2 comparison of functions for different packages: rx230 group added 3. address space 39 figure 3.1 memory map in each operating mode, changed 4. i/o registers 67 table 4.1 list of i/o registers (a ddress order) (25 / 42), changed tn-rx*-a139a/e 83 table 4.1 list of i/o registers (address order) (41 / 42), changed 5. electrical characteristics 85 table 5.1 absolute maximum ratings, changed tn-rx*-a137a/e 86 table 5.2 recommended operating voltage conditions, changed 87 table 5.3 dc characteristics (1), changed tn-rx*-a137a/e 88 table 5.4 dc characteristics (2), changed 88 table 5.5 dc characteristics (3), changed 89 table 5.7 dc characteristics (5), changed 91 figure 5.1 voltage dependency in high-speed operating mode (reference data), changed 92 figure 5.2 voltage dependency in middle-speed operating mode (reference data), changed 93 figure 5.3 voltage dependency in low-speed operating mode (reference data), changed tn-rx*-a137a/e 94 table 5.8 dc characteristics (6), changed figure 5.4 voltage dependency in software standby mode (reference data), changed 95 figure 5.5 temperature dependency in software standby mode (reference data), changed 96 figure 5.6 temperature dependency of rtc operation with vcc off (reference data), changed table 5.10 dc characteristics (8): conditions changed 97 table 5.11 dc characterist ics (9), changed tn-rx*-a137a/e 99 table 5.16 permissible output currents (1), changed tn-rx*-a137a/e 100 table 5.17 permissible output currents (2), changed 101 table 5.18 output values of voltage (1), changed 101 table 5.19 output values of voltage (2), changed tn-rx*-a137a/e 101 table 5.20 output values of voltage (3), changed tn-rx*-a137a/e 105 figure 5.13 voh/vol and ioh/iol voltage characteristics at ta = 25c when high-drive output is selected (reference data), changed tn-rx*-a137a/e 108 figure 5.18 v ol and i ol voltage characteristics of riic output pin at ta = 25c (reference data) tn-rx*-a137a/e 110 table 5.21 operating frequency va lue (high-speed operating mode) and table 5.22 operating frequency value (middle-speed operating mode), changed tn-rx*-a137a/e 112 table 5.26 clock timing, changed tn-rx*-a137a/e 116 table 5.27 reset timing, changed 131 table 5.41 timing of on-chip pe ripheral modules (4): note changed 132 table 5.43 timing of on-chip peripheral modules (6), changed 138 figure 5.61 ssi transmission/recepti on timing (ssicp.sckp=0), changed tn-rx*-a137a/e 139 figure 5.62 ssi transmission/recepti on timing (ssicp.sckp=1), changed tn-rx*-a137a/e 142 figure 5.66 vrefh0 voltage range vs. avcc0, changed revision history r01ds0261ej0110 rev.1.10 page 174 of 177 oct 30, 2015 rx230 group, rx231 group revision history 1.10 oct 30, 2015 142 table 5.45 a/d conversion characteristics (1): conditions and voltage range of analog input (max.), changed 143 table 5.46 a/d conversion char acteristics (2): conditions changed 144 table 5.47 a/d conversion char acteristics (3): conditions changed 145 table 5.48 a/d conversion char acteristics (4): conditions changed 146 table 5.49 a/d conversion characteristics (5): conditions changed and absolute accuracy (test conditions) deleted 153 table 5.57 characteristics of power-on reset circuit and voltage detection circuit (1), changed tn-rx*-a137a/e 154 table 5.58 characteristics of power-on reset circuit and voltage detection circuit (2), changed 155 figure 5.73 power-on reset timing and figure 5.74 voltage detection circuit timing (vdet0), changed 159 table 5.62 rom (flash memory for code storage) characteristics (2) high- speed operating mode: note changed 160 table 5.63 rom (flash memory for code storage) characteristics (3) middle-speed operating mode: note changed 161 table 5.65 e2 dataflash characteristics (2): high-speed operating mode, note changed 161 table 5.66 e2 dataflash characterist ics (3): middle-speed operating mode, conditions and note changed 163 figure 5.79 connecting ca pacitors (100 pins), changed 164 figure 5.80 connecting ca pacitors (64 pins), changed 165 figure 5.81 connecting ca pacitors (48 pins), changed appendix 1. package dimensions 167 figure b 100 -pin lqfp (plqp0100kb-b), changed tn-rx*-a137a/e 170 figure e 64 -pin lqfp (plqp0064kb-c), changed tn-rx*-a137a/e 172 figure g 48 -pin lqfp (PLQP0048KB-B), changed tn-rx*-a137a/e rev. date description classification page summary notes for cmos devices (1) voltage application waveform at input pin: waveform distortion due to input noise or a reflected wave may cause malfunction. if the input of the cmos device stays in the area between vil (max) and vih (min) due to noise, etc., the device may malfunction. take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between vil (max) and vih (min). (2) handling of unused input pins: unconnected cm os device inputs can be cause of malfunction. if an input pin is unconnected, it is possible that an in ternal input level may be generated due to noise, etc., causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using pull-up or pull-down circuitry. each unused pin should be connected to vdd or gnd via a resist or if there is a possibility that it will be an output pin. all handling related to unused pins must be judged separately for each device and according to related specifications governing the device. (3) precaution against esd: a strong electric fi eld, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade t he device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. environmental control must be adequat e. when it is dry, a humidifier should be used. it is recommended to avoid using insulators that easily build up static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work benches and floors should be gr ounded. the operator should be grounded using a wrist strap. semiconductor devices must not be touc hed with bare hands. similar precautions need to be taken for pw boards with mounted semiconductor devices. (4) status before initialization: power-on does not necessarily define the in itial status of a mos device. immediately after the power source is turn ed on, devices with reset functions have not yet been initialized. hence, power-on does not guarantee output pin levels, i/o setti ngs or contents of registers. a device is not initialized un til the reset signal is received. a re set operation must be executed immediately after power-on for devices with reset functions. (5) power on/off sequence: in the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. when switching the po wer supply off, as a rule, switch off the external power supply and then the internal power supply. use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. the correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. (6) input of signal during power off state : do not input signals or an i/o pull-up power supply while the device is not powered. the current injection that re sults from input of such a signal or i/o pull-up power supply may cause malfunction and the abnormal cu rrent that passes in the device at this time may cause degradation of internal elem ents. input of signals during th e power off state must be judged separately for each device and according to re lated specifications governing the device. general precautions in the handling of mpu/mcu products the following usage notes are applicable to all mpu/mcu pr oducts from renesas. for detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products. 1. handling of unused pins handle unused pins in accord with the directions given under handling of unused pins in the manual. ? the input pins of cmos products are generally in the high-impedance state. in operation with an unused pin in the open-circuit state, extra electromag netic noise is induced in the vicinity of lsi, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal be come possible. unused pins should be handled as described under handling of unused pins in the manual. 2. processing at power-on the state of the product is undefined at the moment when power is supplied. ? the states of internal circuits in the lsi are indeterminate and the states of register settings and pins are undefined at the moment when power is supplied. in a finished product where the reset signal is applie d to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset pr ocess is completed. in a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified. 3. prohibition of access to reserved addresses access to reserved addresses is prohibited. ? the reserved addresses are provid ed for the possible future expansi on of functions. do not access these addresses; the correct operation of ls i is not guaranteed if they are accessed. 4. clock signals after applying a reset, only release the reset line after the operating clock signal has become stable. when switching the clock signal during program ex ecution, wait until the target clock signal has stabilized. ? when the clock signal is gene rated with an external resonator (or from an external oscillator) during a reset, ensure that the reset line is only re leased after full stabilization of the clock signal. moreover, when switching to a clock signal produc ed with an external resonator (or by an external oscillator) while program ex ecution is in progress, wait until t he target clock signal is stable. 5. differences between products before changing from one product to another, i.e. to a product with a different part number, confirm that the change will not lead to problems. ? the characteristics of an mpu or mcu in the same group but having a different part number may differ in terms of the internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, ope rating margins, immunity to noise, and amount of radiated noise. when changing to a product with a different part number, implement a system-evaluation test for the given product. notice 1. descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information incl uded herein. 3. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rig hts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any paten ts, copyrights or other intellectual property rights of renesas electronics or others. 4. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of renesas electronics product. 5. renesas electronics products are classified according to the following two quality grades: "standard" and "high quality". the recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti-crime systems; and safety equipment etc. renesas electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat t o human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). you mus t check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application for which it is not intended. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for which the product is not intended by renesas electronics. 6. you should use the renesas electronics products described in this document within the range specified by renesas electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 7. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have sp ecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance desig n. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics produc t, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measu res. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatibi lity of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, in cluding without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufactur e, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. you should not use renesas electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. when exporting the renesas electronics products or technology described in this do cument, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. it is the responsibility of the buyer or distributor of renesas electronics products, who distributes, disposes of, or other wise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, renesas electronics assumes no responsibility for any losses incurred by yo u or third parties as a result of unauthorized use of renesas electronics products. 11. this document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of renesas electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this docu ment or renesas electronics products, or if you have any other inquiries. (note 1) "renesas electronics" as used in this document means renesas electronics corporation and also includes its majority-own ed subsidiaries. (note 2) "renesas electronics product(s)" means any product developed or manufactured by or for renesas electronics. http://www.renesas.com refer to "http://www.renesas.com/" for the latest and detailed information. renesas electronics america inc. 2801 scott boulevard santa clara, ca 95050-2549, u.s.a. tel: +1-408-588-6000, fax: +1-408-588-6130 renesas electronics canada limited 9251 yonge street, suite 8309 richmond hill, ontario canada l4c 9t3 tel: +1-905-237-2004 renesas electronics europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k tel: +44-1628-585-100, fax: +44-1628-585-900 renesas electronics europe gmbh arcadiastrasse 10, 40472 dsseldorf, germany tel: +49-211-6503-0, fax: +49-211-6503-1327 renesas electronics (china) co., ltd. room 1709, quantum plaza, no.27 zhichunlu haidian district, beijing 100191, p.r.china tel: +86-10-8235-1155, fax: +86-10-8235-7679 renesas electronics (shanghai) co., ltd. unit 301, tower a, central towers, 555 langao road, putuo district, shanghai, p. r. china 200333 tel: +86-21-2226-0888, fax: +86-21-2226-0999 renesas electronics hong kong limited unit 1601-1611, 16/f., tower 2, grand century place, 193 prince edward road west, mongkok, kowloon, hong kong tel: +852-2265-6688, fax: +852 2886-9022 renesas electronics taiwan co., ltd. 13f, no. 363, fu shing north road, taipei 10543, taiwan tel: +886-2-8175-9600, fax: +886 2-8175-9670 renesas electronics singapore pte. ltd. 80 bendemeer road, unit #06-02 hyflux innovation centre, singapore 339949 tel: +65-6213-0200, fax: +65-6213-0300 renesas electronics malaysia sdn.bhd. unit 1207, block b, menara amcorp, amcorp trade centre, no. 18, jln persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: +60-3-7955-9390, fax: +60-3-7955-9510 renesas electronics india pvt. ltd. no.777c, 100 feet road, hal ii stage, indiranagar, bangalore, india tel: +91-80-67208700, fax: +91-80-67208777 renesas electronics korea co., ltd. 12f., 234 teheran-ro, gangnam-gu, seoul, 135-080, korea tel: +82-2-558-3737, fax: +82-2-558-5141 sales offices ? 2015 renesas electronics corporation. all rights reserved. colophon 5.0 |
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